JPWO2021153112A1 - - Google Patents

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Publication number
JPWO2021153112A1
JPWO2021153112A1 JP2021574546A JP2021574546A JPWO2021153112A1 JP WO2021153112 A1 JPWO2021153112 A1 JP WO2021153112A1 JP 2021574546 A JP2021574546 A JP 2021574546A JP 2021574546 A JP2021574546 A JP 2021574546A JP WO2021153112 A1 JPWO2021153112 A1 JP WO2021153112A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021574546A
Other versions
JP7369797B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021153112A1 publication Critical patent/JPWO2021153112A1/ja
Application granted granted Critical
Publication of JP7369797B2 publication Critical patent/JP7369797B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/04Anodisation of aluminium or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/04Anodisation of aluminium or alloys based thereon
    • C25D11/18After-treatment, e.g. pore-sealing
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/04Anodisation of aluminium or alloys based thereon
    • C25D11/18After-treatment, e.g. pore-sealing
    • C25D11/20Electrolytic after-treatment
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2021574546A 2020-01-31 2020-12-23 金属充填微細構造体の製造方法 Active JP7369797B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020014713 2020-01-31
JP2020014713 2020-01-31
PCT/JP2020/048124 WO2021153112A1 (ja) 2020-01-31 2020-12-23 金属充填微細構造体の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021153112A1 true JPWO2021153112A1 (ja) 2021-08-05
JP7369797B2 JP7369797B2 (ja) 2023-10-26

Family

ID=77078200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021574546A Active JP7369797B2 (ja) 2020-01-31 2020-12-23 金属充填微細構造体の製造方法

Country Status (4)

Country Link
JP (1) JP7369797B2 (ja)
CN (1) CN115003864A (ja)
TW (1) TW202130861A (ja)
WO (1) WO2021153112A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7220796B2 (ja) * 2019-08-16 2023-02-10 富士フイルム株式会社 構造体の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007214464A (ja) * 2006-02-10 2007-08-23 Seizo Miyata 微細パターンの形成方法
JP4163728B2 (ja) * 2006-10-02 2008-10-08 エス・イー・エス株式会社 電気めっき方法
JP2008305443A (ja) * 2007-06-05 2008-12-18 Yamaguchi Univ パターンドメディアの製造方法
US20100236596A1 (en) * 2008-08-11 2010-09-23 Samsung Electronics Co., Ltd. Anisotropically elongated thermoelectric material, process for preparing the same, and device comprising the material

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006090785A1 (ja) * 2005-02-23 2006-08-31 Daikin Industries, Ltd. 燃料電池用めっき部材並びにその製造方法及び製造装置
US7405154B2 (en) * 2006-03-24 2008-07-29 International Business Machines Corporation Structure and method of forming electrodeposited contacts
TWI545233B (zh) * 2012-06-04 2016-08-11 Uyemura C & Co Ltd Plating method
JP6029764B2 (ja) * 2013-08-30 2016-11-24 富士フイルム株式会社 金属充填微細構造体の製造方法
JP6535098B2 (ja) * 2015-09-29 2019-06-26 富士フイルム株式会社 金属充填微細構造体の製造方法
WO2019065095A1 (ja) * 2017-09-26 2019-04-04 富士フイルム株式会社 金属充填微細構造体の製造方法および絶縁性基材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007214464A (ja) * 2006-02-10 2007-08-23 Seizo Miyata 微細パターンの形成方法
JP4163728B2 (ja) * 2006-10-02 2008-10-08 エス・イー・エス株式会社 電気めっき方法
JP2008305443A (ja) * 2007-06-05 2008-12-18 Yamaguchi Univ パターンドメディアの製造方法
US20100236596A1 (en) * 2008-08-11 2010-09-23 Samsung Electronics Co., Ltd. Anisotropically elongated thermoelectric material, process for preparing the same, and device comprising the material

Also Published As

Publication number Publication date
TW202130861A (zh) 2021-08-16
WO2021153112A1 (ja) 2021-08-05
JP7369797B2 (ja) 2023-10-26
CN115003864A (zh) 2022-09-02

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