JPWO2021111919A5 - - Google Patents
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- Publication number
- JPWO2021111919A5 JPWO2021111919A5 JP2021562580A JP2021562580A JPWO2021111919A5 JP WO2021111919 A5 JPWO2021111919 A5 JP WO2021111919A5 JP 2021562580 A JP2021562580 A JP 2021562580A JP 2021562580 A JP2021562580 A JP 2021562580A JP WO2021111919 A5 JPWO2021111919 A5 JP WO2021111919A5
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- electrolytic copper
- copper plating
- atom
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 12
- 229910052802 copper Inorganic materials 0.000 claims 12
- 239000010949 copper Substances 0.000 claims 12
- 238000007747 plating Methods 0.000 claims 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical group [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 4
- 229910001431 copper ion Inorganic materials 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- 229910052708 sodium Inorganic materials 0.000 claims 4
- 125000004436 sodium atom Chemical group 0.000 claims 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019219370 | 2019-12-04 | ||
| PCT/JP2020/043577 WO2021111919A1 (fr) | 2019-12-04 | 2020-11-24 | Solution de cuivrage électrolytique, son procédé de production, et procédé de cuivrage électrolytique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021111919A1 JPWO2021111919A1 (fr) | 2021-06-10 |
| JPWO2021111919A5 true JPWO2021111919A5 (fr) | 2023-11-20 |
Family
ID=76222138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021562580A Pending JPWO2021111919A1 (fr) | 2019-12-04 | 2020-11-24 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230025950A1 (fr) |
| JP (1) | JPWO2021111919A1 (fr) |
| KR (1) | KR20220109405A (fr) |
| CN (1) | CN114761621A (fr) |
| TW (1) | TW202130860A (fr) |
| WO (1) | WO2021111919A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024016330A1 (fr) * | 2022-07-22 | 2024-01-25 | 扬州纳力新材料科技有限公司 | Raffineur de grains de placage de cuivre exempt de cyanure, solution de placage de cuivre exempt de cyanure, procédé de préparation associé et application correspondante |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07316875A (ja) * | 1994-05-23 | 1995-12-05 | C Uyemura & Co Ltd | 電気銅めっき用添加剤及び電気銅めっき浴 |
| US6676823B1 (en) * | 2002-03-18 | 2004-01-13 | Taskem, Inc. | High speed acid copper plating |
| JP4704761B2 (ja) | 2005-01-19 | 2011-06-22 | 石原薬品株式会社 | 電気銅メッキ浴、並びに銅メッキ方法 |
| JP4799887B2 (ja) | 2005-03-24 | 2011-10-26 | 石原薬品株式会社 | 電気銅メッキ浴、並びに銅メッキ方法 |
| JP2007016264A (ja) | 2005-07-06 | 2007-01-25 | Adeka Corp | 新規化合物、該化合物からなる電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴、該メッキ浴を使用する電解銅メッキ方法 |
| JP4750486B2 (ja) * | 2005-07-06 | 2011-08-17 | 株式会社Ａｄｅｋａ | 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法 |
-
2020
- 2020-11-24 KR KR1020227018554A patent/KR20220109405A/ko unknown
- 2020-11-24 CN CN202080084097.2A patent/CN114761621A/zh active Pending
- 2020-11-24 JP JP2021562580A patent/JPWO2021111919A1/ja active Pending
- 2020-11-24 WO PCT/JP2020/043577 patent/WO2021111919A1/fr active Application Filing
- 2020-11-24 US US17/781,949 patent/US20230025950A1/en not_active Abandoned
- 2020-11-27 TW TW109141728A patent/TW202130860A/zh unknown
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