JPWO2021095642A1 - - Google Patents

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Publication number
JPWO2021095642A1
JPWO2021095642A1 JP2021556063A JP2021556063A JPWO2021095642A1 JP WO2021095642 A1 JPWO2021095642 A1 JP WO2021095642A1 JP 2021556063 A JP2021556063 A JP 2021556063A JP 2021556063 A JP2021556063 A JP 2021556063A JP WO2021095642 A1 JPWO2021095642 A1 JP WO2021095642A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021556063A
Other versions
JP7283573B2 (ja
JPWO2021095642A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021095642A1 publication Critical patent/JPWO2021095642A1/ja
Publication of JPWO2021095642A5 publication Critical patent/JPWO2021095642A5/ja
Application granted granted Critical
Publication of JP7283573B2 publication Critical patent/JP7283573B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H01P3/087—Suspended triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Waveguides (AREA)
JP2021556063A 2019-11-15 2020-11-05 伝送線路、伝送線路の製造方法及び電子機器 Active JP7283573B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019206607 2019-11-15
JP2019206607 2019-11-15
JP2020059348 2020-03-30
JP2020059348 2020-03-30
PCT/JP2020/041422 WO2021095642A1 (ja) 2019-11-15 2020-11-05 伝送線路、伝送線路の製造方法及び電子機器

Publications (3)

Publication Number Publication Date
JPWO2021095642A1 true JPWO2021095642A1 (ja) 2021-05-20
JPWO2021095642A5 JPWO2021095642A5 (ja) 2022-05-31
JP7283573B2 JP7283573B2 (ja) 2023-05-30

Family

ID=75912950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021556063A Active JP7283573B2 (ja) 2019-11-15 2020-11-05 伝送線路、伝送線路の製造方法及び電子機器

Country Status (4)

Country Link
US (1) US11956903B2 (ja)
JP (1) JP7283573B2 (ja)
CN (1) CN217336036U (ja)
WO (1) WO2021095642A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN219042063U (zh) * 2020-05-21 2023-05-16 株式会社村田制作所 信号传输线路
US11700689B2 (en) 2021-08-31 2023-07-11 Htc Corporation Circuit board
JP7330241B2 (ja) * 2021-09-09 2023-08-21 宏達國際電子股▲ふん▼有限公司 回路板
JP7286902B1 (ja) * 2022-05-31 2023-06-06 眞一 前田 電子部品の配線構造、電子部品の接続方法
JP7399402B1 (ja) 2022-11-10 2023-12-18 眞一 前田 電子部品の配線構造、電子部品の接続方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060288570A1 (en) * 2004-04-29 2006-12-28 International Business Machines Corporation Method and structures for implementing customizable dielectric printed circuit card traces
US20080315977A1 (en) * 2007-06-22 2008-12-25 Tessera, Inc. Low loss RF transmission lines
WO2017130731A1 (ja) * 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3083416B2 (ja) * 1992-11-06 2000-09-04 進工業株式会社 ディレイライン素子およびその製造方法
JP2007150526A (ja) * 2005-11-25 2007-06-14 Mitsubishi Electric Corp サスペンデット線路及び高周波パッケージ
JP2009094752A (ja) * 2007-10-09 2009-04-30 Nec Corp 高周波伝送線路
JP5546270B2 (ja) 2010-02-01 2014-07-09 三菱電機株式会社 高周波伝送線路
JP2011182311A (ja) * 2010-03-03 2011-09-15 Sony Corp 伝送線路
US9307636B2 (en) * 2011-07-20 2016-04-05 Panasonic Intellectual Property Management Co., Ltd. Printed wiring board
JP5881400B2 (ja) * 2011-12-13 2016-03-09 三菱電機株式会社 高周波伝送線路
US9270003B2 (en) * 2012-12-06 2016-02-23 Anaren, Inc. Stripline assembly having first and second pre-fired ceramic substrates bonded to each other through a conductive bonding layer
US9954263B2 (en) 2015-08-28 2018-04-24 General Electric Company Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same
CN216529280U (zh) * 2018-12-20 2022-05-13 株式会社村田制作所 传输线路构件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060288570A1 (en) * 2004-04-29 2006-12-28 International Business Machines Corporation Method and structures for implementing customizable dielectric printed circuit card traces
US20080315977A1 (en) * 2007-06-22 2008-12-25 Tessera, Inc. Low loss RF transmission lines
WO2017130731A1 (ja) * 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Also Published As

Publication number Publication date
WO2021095642A1 (ja) 2021-05-20
CN217336036U (zh) 2022-08-30
JP7283573B2 (ja) 2023-05-30
US11956903B2 (en) 2024-04-09
US20220232708A1 (en) 2022-07-21

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