JPWO2021079668A1 - - Google Patents

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Publication number
JPWO2021079668A1
JPWO2021079668A1 JP2021554174A JP2021554174A JPWO2021079668A1 JP WO2021079668 A1 JPWO2021079668 A1 JP WO2021079668A1 JP 2021554174 A JP2021554174 A JP 2021554174A JP 2021554174 A JP2021554174 A JP 2021554174A JP WO2021079668 A1 JPWO2021079668 A1 JP WO2021079668A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021554174A
Other versions
JP7095813B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021079668A1 publication Critical patent/JPWO2021079668A1/ja
Application granted granted Critical
Publication of JP7095813B2 publication Critical patent/JP7095813B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/12—Measuring force or stress, in general by measuring variations in the magnetic properties of materials resulting from the application of stress
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/16—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in the magnetic properties of material resulting from the application of stress
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R15/00—Magnetostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R23/00—Transducers other than those covered by groups H04R9/00 - H04R21/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N35/00—Magnetostrictive devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2410/00—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Hall/Mr Elements (AREA)
  • Measuring Fluid Pressure (AREA)
JP2021554174A 2019-10-21 2020-09-18 センサ、歪検知センサ、圧力センサ、およびマイクロフォン Active JP7095813B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019192058 2019-10-21
JP2019192058 2019-10-21
PCT/JP2020/035465 WO2021079668A1 (ja) 2019-10-21 2020-09-18 センサ、歪検知センサ、圧力センサ、およびマイクロフォン

Publications (2)

Publication Number Publication Date
JPWO2021079668A1 true JPWO2021079668A1 (ja) 2021-04-29
JP7095813B2 JP7095813B2 (ja) 2022-07-05

Family

ID=75619397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021554174A Active JP7095813B2 (ja) 2019-10-21 2020-09-18 センサ、歪検知センサ、圧力センサ、およびマイクロフォン

Country Status (3)

Country Link
US (1) US12092533B2 (ja)
JP (1) JP7095813B2 (ja)
WO (2) WO2021079669A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021079669A1 (ja) * 2019-10-21 2021-04-29 株式会社村田製作所 センサ、歪検知センサ、圧力センサ、およびマイクロフォン、ならびに、センサの製造方法、および歪検知センサの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018033007A (ja) * 2016-08-24 2018-03-01 株式会社東芝 センサ及び電子機器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019822A (ja) * 2003-06-27 2005-01-20 Asahi Glass Co Ltd マスク保護装置及びマスク保護装置の製造方法、並びにマスク
DE102004032484B3 (de) 2004-07-05 2005-11-24 Infineon Technologies Ag Sensor und Verfahren zum Herstellen eines Sensors
US7356909B1 (en) 2004-09-29 2008-04-15 Headway Technologies, Inc. Method of forming a CPP magnetic recording head with a self-stabilizing vortex configuration
DE102005010338B4 (de) 2005-03-07 2007-01-25 Infineon Technologies Ag Kraftsensoranordnung mit magnetostriktiven Magnetowiderstandssensoren und Verfahren zur Ermittlung einer auf den Träger einer Kraftsensoranordnung wirkenden Kraft
JP5579218B2 (ja) * 2012-03-28 2014-08-27 株式会社東芝 圧力検知素子の製造方法
JP6211866B2 (ja) 2013-09-20 2017-10-11 株式会社東芝 圧力センサ、マイクロフォン、血圧センサおよびタッチパネル
JP6304989B2 (ja) 2013-09-24 2018-04-04 株式会社東芝 圧力センサ、マイクロフォン、血圧センサ、タッチパネル、圧力センサの製造方法、および圧力センサの製造装置
JP2015179779A (ja) * 2014-03-19 2015-10-08 株式会社東芝 歪検出素子、圧力センサ、マイクロフォン、血圧センサ及びタッチパネル
JP6275549B2 (ja) 2014-05-26 2018-02-07 株式会社東芝 圧力センサ、マイクロフォン、超音波センサ、血圧センサ及びタッチパネル
JP6502802B2 (ja) 2015-09-09 2019-04-17 株式会社東芝 センサ、情報端末、マイクロフォン、血圧センサ及びタッチパネル
DE102015121753B4 (de) 2015-12-14 2021-10-21 Infineon Technologies Ag Magnetsensorbauelement und Verfahren für ein Magnetsensorbauelement mit einer magnetoresistiven Struktur
JP6200565B2 (ja) * 2016-09-23 2017-09-20 株式会社東芝 圧力センサ、音響マイク、血圧センサ及びタッチパネル
JP2018116010A (ja) 2017-01-20 2018-07-26 株式会社東芝 圧力センサ及び電子機器
JP6370980B2 (ja) 2017-09-14 2018-08-08 株式会社東芝 センサ、マイクロフォン、血圧センサおよびタッチパネル
JP6745774B2 (ja) 2017-09-20 2020-08-26 株式会社東芝 センサ及び電子機器
JP6517954B2 (ja) 2018-01-04 2019-05-22 株式会社東芝 圧力センサ、マイクロフォン、超音波センサ、血圧センサ及びタッチパネル
JP6510100B2 (ja) 2018-02-28 2019-05-08 株式会社東芝 圧力センサ、マイクロフォン、血圧センサ、タッチパネル
WO2021079669A1 (ja) * 2019-10-21 2021-04-29 株式会社村田製作所 センサ、歪検知センサ、圧力センサ、およびマイクロフォン、ならびに、センサの製造方法、および歪検知センサの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018033007A (ja) * 2016-08-24 2018-03-01 株式会社東芝 センサ及び電子機器

Also Published As

Publication number Publication date
WO2021079669A1 (ja) 2021-04-29
US20220163410A1 (en) 2022-05-26
US12092533B2 (en) 2024-09-17
WO2021079668A1 (ja) 2021-04-29
JP7095813B2 (ja) 2022-07-05

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