JPWO2021079566A1 - - Google Patents

Info

Publication number
JPWO2021079566A1
JPWO2021079566A1 JP2021554072A JP2021554072A JPWO2021079566A1 JP WO2021079566 A1 JPWO2021079566 A1 JP WO2021079566A1 JP 2021554072 A JP2021554072 A JP 2021554072A JP 2021554072 A JP2021554072 A JP 2021554072A JP WO2021079566 A1 JPWO2021079566 A1 JP WO2021079566A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021554072A
Other languages
Japanese (ja)
Other versions
JP7575395B2 (ja
JPWO2021079566A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021079566A1 publication Critical patent/JPWO2021079566A1/ja
Publication of JPWO2021079566A5 publication Critical patent/JPWO2021079566A5/ja
Application granted granted Critical
Publication of JP7575395B2 publication Critical patent/JP7575395B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/012Form of non-self-supporting electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/38Multiple capacitors, i.e. structural combinations of fixed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/38Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H01G4/385Single unit multiple capacitors, e.g. dual capacitor in one coil

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP2021554072A 2019-10-24 2020-07-09 複合キャパシタ Active JP7575395B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019193614 2019-10-24
JP2019193614 2019-10-24
PCT/JP2020/026831 WO2021079566A1 (ja) 2019-10-24 2020-07-09 複合キャパシタ

Publications (3)

Publication Number Publication Date
JPWO2021079566A1 true JPWO2021079566A1 (https=) 2021-04-29
JPWO2021079566A5 JPWO2021079566A5 (https=) 2022-06-24
JP7575395B2 JP7575395B2 (ja) 2024-10-29

Family

ID=75620434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021554072A Active JP7575395B2 (ja) 2019-10-24 2020-07-09 複合キャパシタ

Country Status (4)

Country Link
US (1) US11869719B2 (https=)
JP (1) JP7575395B2 (https=)
CN (1) CN114600209B (https=)
WO (1) WO2021079566A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7151907B2 (ja) * 2019-09-25 2022-10-12 株式会社村田製作所 キャパシタおよびその製造方法
CN119403137B (zh) * 2024-10-17 2025-05-30 普赛微科技(杭州)有限公司 一种堆叠电容器的封装结构和制备方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168745A (ja) * 2001-11-28 2003-06-13 Ind Technol Res Inst 集積回路素子の容量を増加させる方法
JP2003249417A (ja) * 2002-02-25 2003-09-05 Tdk Corp コンデンサ構造体およびその製造方法
JP2004146520A (ja) * 2002-10-23 2004-05-20 Fujitsu Ltd キャパシタ
JP2006287197A (ja) * 2005-03-31 2006-10-19 Hynix Semiconductor Inc ナノチューブを有するキャパシタ及びその製造方法
JP2008130778A (ja) * 2006-11-20 2008-06-05 Taiyo Yuden Co Ltd コンデンサ素子及びその製造方法並びにコンデンサ
US20080135908A1 (en) * 2006-12-06 2008-06-12 Samsung Electronics Co., Ltd. Semiconductor device and method of manufacturing the same
JP2009010371A (ja) * 2007-06-26 2009-01-15 Headway Technologies Inc キャパシタおよびその製造方法並びにキャパシタユニット
JP2009105369A (ja) * 2007-10-19 2009-05-14 Young Joo Oh 金属キャパシタ及びその製造方法
JP2009170861A (ja) * 2008-01-11 2009-07-30 Young Joo Oh 金属キャパシタ及びその製造方法
JP2016535441A (ja) * 2013-10-29 2016-11-10 アイピーディーアイエイ 改良型コンデンサを有する構造
JP2019057703A (ja) * 2017-09-21 2019-04-11 サムソン エレクトロ−メカニックス カンパニーリミテッド. キャパシタ部品
JP2019091877A (ja) * 2017-11-10 2019-06-13 サムソン エレクトロ−メカニックス カンパニーリミテッド. 積層型キャパシタ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4150552B2 (ja) * 2002-08-28 2008-09-17 富士通株式会社 複合キャパシタ
US20050167655A1 (en) 2004-01-29 2005-08-04 International Business Machines Corporation Vertical nanotube semiconductor device structures and methods of forming the same
JP4920335B2 (ja) * 2006-08-07 2012-04-18 新光電気工業株式会社 キャパシタ内蔵インターポーザ及びその製造方法と電子部品装置
JP2009021512A (ja) * 2007-07-13 2009-01-29 Taiyo Yuden Co Ltd 積層コンデンサ
JP5171407B2 (ja) * 2008-06-06 2013-03-27 昭和電工株式会社 回路基板およびその製造方法並びに電子装置
US9406442B2 (en) * 2012-03-22 2016-08-02 California Institute Of Technology Micro- and nanoscale capacitors that incorporate an array of conductive elements having elongated bodies
JP6451186B2 (ja) * 2014-09-30 2019-01-16 株式会社村田製作所 コンデンサ素子
WO2016136771A1 (ja) * 2015-02-27 2016-09-01 株式会社村田製作所 可変容量素子

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168745A (ja) * 2001-11-28 2003-06-13 Ind Technol Res Inst 集積回路素子の容量を増加させる方法
JP2003249417A (ja) * 2002-02-25 2003-09-05 Tdk Corp コンデンサ構造体およびその製造方法
JP2004146520A (ja) * 2002-10-23 2004-05-20 Fujitsu Ltd キャパシタ
JP2006287197A (ja) * 2005-03-31 2006-10-19 Hynix Semiconductor Inc ナノチューブを有するキャパシタ及びその製造方法
JP2008130778A (ja) * 2006-11-20 2008-06-05 Taiyo Yuden Co Ltd コンデンサ素子及びその製造方法並びにコンデンサ
US20080135908A1 (en) * 2006-12-06 2008-06-12 Samsung Electronics Co., Ltd. Semiconductor device and method of manufacturing the same
JP2009010371A (ja) * 2007-06-26 2009-01-15 Headway Technologies Inc キャパシタおよびその製造方法並びにキャパシタユニット
JP2009105369A (ja) * 2007-10-19 2009-05-14 Young Joo Oh 金属キャパシタ及びその製造方法
JP2009170861A (ja) * 2008-01-11 2009-07-30 Young Joo Oh 金属キャパシタ及びその製造方法
JP2016535441A (ja) * 2013-10-29 2016-11-10 アイピーディーアイエイ 改良型コンデンサを有する構造
JP2019057703A (ja) * 2017-09-21 2019-04-11 サムソン エレクトロ−メカニックス カンパニーリミテッド. キャパシタ部品
JP2019091877A (ja) * 2017-11-10 2019-06-13 サムソン エレクトロ−メカニックス カンパニーリミテッド. 積層型キャパシタ

Also Published As

Publication number Publication date
JP7575395B2 (ja) 2024-10-29
CN114600209B (zh) 2024-07-23
US11869719B2 (en) 2024-01-09
CN114600209A (zh) 2022-06-07
US20220238275A1 (en) 2022-07-28
WO2021079566A1 (ja) 2021-04-29

Similar Documents

Publication Publication Date Title
BR112019017762A2 (https=)
BR112021017339A2 (https=)
BR112021018450A2 (https=)
BR112021017637A2 (https=)
BR112021017892A2 (https=)
BR112021017782A2 (https=)
BR112021016821A2 (https=)
BR112021017939A2 (https=)
BR112021017738A2 (https=)
BR112021016996A2 (https=)
BR112021008711A2 (https=)
BR112019016141A2 (https=)
BR112021017728A2 (https=)
AU2020104490A5 (https=)
BR112021013944A2 (https=)
BR112021018452A2 (https=)
BR112021017703A2 (https=)
BR112021018102A2 (https=)
BR112019016142A2 (https=)
BR112019016138A2 (https=)
BR112021017732A2 (https=)
BR112021017234A2 (https=)
BR112021017355A2 (https=)
BR112021018168A2 (https=)
BR112021018093A2 (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220418

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220418

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230214

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230406

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230718

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20231128

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241017

R150 Certificate of patent or registration of utility model

Ref document number: 7575395

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150