JPWO2021061922A5 - - Google Patents
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- Publication number
- JPWO2021061922A5 JPWO2021061922A5 JP2022519388A JP2022519388A JPWO2021061922A5 JP WO2021061922 A5 JPWO2021061922 A5 JP WO2021061922A5 JP 2022519388 A JP2022519388 A JP 2022519388A JP 2022519388 A JP2022519388 A JP 2022519388A JP WO2021061922 A5 JPWO2021061922 A5 JP WO2021061922A5
- Authority
- JP
- Japan
- Prior art keywords
- hydroxylamine
- acid
- composition
- mixture
- derivative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962906810P | 2019-09-27 | 2019-09-27 | |
| US62/906,810 | 2019-09-27 | ||
| PCT/US2020/052406 WO2021061922A1 (en) | 2019-09-27 | 2020-09-24 | Compositions for removing etch residues, methods of using and use thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022550365A JP2022550365A (ja) | 2022-12-01 |
| JPWO2021061922A5 true JPWO2021061922A5 (ko) | 2023-10-02 |
Family
ID=75166177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022519388A Pending JP2022550365A (ja) | 2019-09-27 | 2020-09-24 | ポストエッチング残留物を除去するための組成物、その組成物を使用する方法、及びその組成物の使用 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20220380705A1 (ko) |
| EP (1) | EP4034629A4 (ko) |
| JP (1) | JP2022550365A (ko) |
| KR (1) | KR20220075230A (ko) |
| CN (1) | CN114450388A (ko) |
| TW (1) | TW202122564A (ko) |
| WO (1) | WO2021061922A1 (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202124776A (zh) * | 2019-12-20 | 2021-07-01 | 美商慧盛材料美國有限責任公司 | Co/cu選擇性濕蝕刻劑 |
| CN114999911A (zh) * | 2022-05-24 | 2022-09-02 | 长鑫存储技术有限公司 | 半导体结构及其形成方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6492311B2 (en) * | 1990-11-05 | 2002-12-10 | Ekc Technology, Inc. | Ethyenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process |
| AU6530000A (en) * | 1999-08-19 | 2001-03-19 | Ashland Inc. | Stripping and cleaning compositions |
| KR100366974B1 (ko) * | 1999-12-30 | 2003-01-14 | 유니켐스 (주) | 드라이필름용 박리액 조성물 및 이를 이용한 드라이필름의박리방법 |
| US8003587B2 (en) * | 2002-06-06 | 2011-08-23 | Ekc Technology, Inc. | Semiconductor process residue removal composition and process |
| TWI339780B (en) * | 2005-07-28 | 2011-04-01 | Rohm & Haas Elect Mat | Stripper |
| WO2009058277A1 (en) * | 2007-10-29 | 2009-05-07 | Ekc Technology, Inc. | Novel nitrile and amidoxime compounds and methods of preparation |
| US20090133716A1 (en) * | 2007-10-29 | 2009-05-28 | Wai Mun Lee | Methods of post chemical mechanical polishing and wafer cleaning using amidoxime compositions |
| US8518865B2 (en) * | 2009-08-31 | 2013-08-27 | Air Products And Chemicals, Inc. | Water-rich stripping and cleaning formulation and method for using same |
| US8889609B2 (en) * | 2011-03-16 | 2014-11-18 | Air Products And Chemicals, Inc. | Cleaning formulations and method of using the cleaning formulations |
| US9536730B2 (en) * | 2012-10-23 | 2017-01-03 | Air Products And Chemicals, Inc. | Cleaning formulations |
| KR101459725B1 (ko) * | 2014-02-18 | 2014-11-12 | 주식회사 코원이노텍 | 포스트-에칭 포토레지스트 에칭 중합체 및 잔류물을 제거하기 위한 스트리퍼 조성물 |
-
2020
- 2020-09-24 CN CN202080067656.9A patent/CN114450388A/zh active Pending
- 2020-09-24 EP EP20870060.9A patent/EP4034629A4/en active Pending
- 2020-09-24 KR KR1020227013937A patent/KR20220075230A/ko unknown
- 2020-09-24 WO PCT/US2020/052406 patent/WO2021061922A1/en active Application Filing
- 2020-09-24 JP JP2022519388A patent/JP2022550365A/ja active Pending
- 2020-09-24 US US17/753,256 patent/US20220380705A1/en active Pending
- 2020-09-24 TW TW109133041A patent/TW202122564A/zh unknown
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