JPWO2020255581A5 - - Google Patents
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- Publication number
- JPWO2020255581A5 JPWO2020255581A5 JP2021527444A JP2021527444A JPWO2020255581A5 JP WO2020255581 A5 JPWO2020255581 A5 JP WO2020255581A5 JP 2021527444 A JP2021527444 A JP 2021527444A JP 2021527444 A JP2021527444 A JP 2021527444A JP WO2020255581 A5 JPWO2020255581 A5 JP WO2020255581A5
- Authority
- JP
- Japan
- Prior art keywords
- hydrophilic group
- general formula
- polishing
- ring
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005498 polishing Methods 0.000 claims 36
- 239000007788 liquid Substances 0.000 claims 19
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 14
- 150000001875 compounds Chemical class 0.000 claims 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 10
- 239000000126 substance Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 4
- 239000004094 surface-active agent Substances 0.000 claims 4
- 239000008119 colloidal silica Substances 0.000 claims 3
- 150000007524 organic acids Chemical class 0.000 claims 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 2
- 239000003945 anionic surfactant Substances 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 2
- 239000010941 cobalt Substances 0.000 claims 2
- 229910017052 cobalt Inorganic materials 0.000 claims 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 2
- 239000002736 nonionic surfactant Substances 0.000 claims 2
- 235000005985 organic acids Nutrition 0.000 claims 2
- 229910052700 potassium Inorganic materials 0.000 claims 2
- 239000011591 potassium Substances 0.000 claims 2
- 229910052708 sodium Inorganic materials 0.000 claims 2
- 239000011734 sodium Substances 0.000 claims 2
- 125000001424 substituent group Chemical group 0.000 claims 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 1
- 239000006061 abrasive grain Substances 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 238000007865 diluting Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011164 primary particle Substances 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019114674 | 2019-06-20 | ||
| JP2019114674 | 2019-06-20 | ||
| PCT/JP2020/018765 WO2020255581A1 (ja) | 2019-06-20 | 2020-05-11 | 研磨液、及び、化学的機械的研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020255581A1 JPWO2020255581A1 (https=) | 2020-12-24 |
| JPWO2020255581A5 true JPWO2020255581A5 (https=) | 2022-03-02 |
| JP7333396B2 JP7333396B2 (ja) | 2023-08-24 |
Family
ID=74040477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021527444A Active JP7333396B2 (ja) | 2019-06-20 | 2020-05-11 | 研磨液、及び、化学的機械的研磨方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12448541B2 (https=) |
| JP (1) | JP7333396B2 (https=) |
| KR (1) | KR102727373B1 (https=) |
| TW (1) | TWI863994B (https=) |
| WO (1) | WO2020255581A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7244642B2 (ja) * | 2019-06-20 | 2023-03-22 | 富士フイルム株式会社 | 研磨液、及び、化学的機械的研磨方法 |
| CN115926629B (zh) * | 2022-12-30 | 2023-12-05 | 昂士特科技(深圳)有限公司 | 具有改进再循环性能的化学机械抛光组合物 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4010359B2 (ja) | 2003-03-07 | 2007-11-21 | 信越化学工業株式会社 | 金属膜付基板の洗浄方法 |
| JP2005223260A (ja) | 2004-02-09 | 2005-08-18 | Asahi Kasei Chemicals Corp | 研磨粒子を含有する金属研磨用水系分散体 |
| JP5121273B2 (ja) | 2007-03-29 | 2013-01-16 | 富士フイルム株式会社 | 金属用研磨液及び研磨方法 |
| JP2008277723A (ja) | 2007-03-30 | 2008-11-13 | Fujifilm Corp | 金属用研磨液及び研磨方法 |
| JP2009064881A (ja) | 2007-09-05 | 2009-03-26 | Fujifilm Corp | 金属用研磨用組成物及びそれを用いた化学的機械的研磨方法 |
| JP2009088243A (ja) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | 研磨液 |
| JP6198740B2 (ja) * | 2012-09-18 | 2017-09-20 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| CN103897602B (zh) * | 2012-12-24 | 2017-10-13 | 安集微电子（上海）有限公司 | 一种化学机械抛光液及抛光方法 |
| US10059860B2 (en) | 2014-02-26 | 2018-08-28 | Fujimi Incorporated | Polishing composition |
| WO2016006631A1 (ja) | 2014-07-09 | 2016-01-14 | 日立化成株式会社 | Ｃｍｐ用研磨液及び研磨方法 |
| JP6377656B2 (ja) * | 2016-02-29 | 2018-08-22 | 株式会社フジミインコーポレーテッド | シリコン基板の研磨方法および研磨用組成物セット |
| JP6220090B2 (ja) * | 2016-04-01 | 2017-10-25 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びその製造方法並びに磁気研磨方法 |
| US20170330762A1 (en) * | 2016-05-10 | 2017-11-16 | Jsr Corporation | Semiconductor treatment composition and treatment method |
| JP6819280B2 (ja) * | 2016-12-27 | 2021-01-27 | Jsr株式会社 | 化学機械研磨用組成物および化学機械研磨方法 |
| KR102626655B1 (ko) * | 2017-02-08 | 2024-01-17 | 제이에스알 가부시끼가이샤 | 반도체 처리용 조성물 및 처리 방법 |
| KR102405560B1 (ko) * | 2017-02-28 | 2022-06-07 | 후지필름 가부시키가이샤 | 연마액, 연마액의 제조 방법, 연마액 원액, 연마액 원액 수용체, 화학적 기계적 연마 방법 |
| JP2018157164A (ja) * | 2017-03-21 | 2018-10-04 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨用組成物の製造方法、研磨方法および半導体基板の製造方法 |
| US10676646B2 (en) * | 2017-05-25 | 2020-06-09 | Fujifilm Electronic Materials U.S.A., Inc. | Chemical mechanical polishing slurry for cobalt applications |
-
2020
- 2020-05-11 KR KR1020217040540A patent/KR102727373B1/ko active Active
- 2020-05-11 WO PCT/JP2020/018765 patent/WO2020255581A1/ja not_active Ceased
- 2020-05-11 JP JP2021527444A patent/JP7333396B2/ja active Active
- 2020-05-15 TW TW109116202A patent/TWI863994B/zh active
-
2021
- 2021-12-05 US US17/542,486 patent/US12448541B2/en active Active
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