JPWO2020235438A1 - - Google Patents

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Publication number
JPWO2020235438A1
JPWO2020235438A1 JP2021520742A JP2021520742A JPWO2020235438A1 JP WO2020235438 A1 JPWO2020235438 A1 JP WO2020235438A1 JP 2021520742 A JP2021520742 A JP 2021520742A JP 2021520742 A JP2021520742 A JP 2021520742A JP WO2020235438 A1 JPWO2020235438 A1 JP WO2020235438A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021520742A
Other languages
Japanese (ja)
Other versions
JP7191216B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2020235438A1 publication Critical patent/JPWO2020235438A1/ja
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Publication of JP7191216B2 publication Critical patent/JP7191216B2/ja
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2021520742A 2019-05-23 2020-05-14 基板処理方法 Active JP7191216B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019097157 2019-05-23
JP2019097157 2019-05-23
PCT/JP2020/019246 WO2020235438A1 (ja) 2019-05-23 2020-05-14 基板処理方法

Publications (2)

Publication Number Publication Date
JPWO2020235438A1 true JPWO2020235438A1 (zh) 2020-11-26
JP7191216B2 JP7191216B2 (ja) 2022-12-16

Family

ID=73458856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021520742A Active JP7191216B2 (ja) 2019-05-23 2020-05-14 基板処理方法

Country Status (3)

Country Link
JP (1) JP7191216B2 (zh)
TW (1) TW202105495A (zh)
WO (1) WO2020235438A1 (zh)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384119A (ja) * 1986-09-29 1988-04-14 Tokyo Electron Ltd 基板の洗浄方法
JP2007134673A (ja) * 2005-10-14 2007-05-31 Sony Corp 基板の処理方法
JP2007263485A (ja) * 2006-03-29 2007-10-11 Tokyo Electron Ltd 基板処理方法，記録媒体及び基板処理装置
JP2008108830A (ja) * 2006-10-24 2008-05-08 Dainippon Screen Mfg Co Ltd 二流体ノズルユニットおよびそれを用いた基板処理装置
JP2009200365A (ja) * 2008-02-23 2009-09-03 Sony Corp 基板の処理方法
JP2012054269A (ja) * 2010-08-31 2012-03-15 Elpida Memory Inc 半導体洗浄方法および半導体洗浄装置
JP2012231116A (ja) * 2011-04-15 2012-11-22 Tokyo Electron Ltd 液処理方法、液処理装置および記憶媒体
JP2016086072A (ja) * 2014-10-24 2016-05-19 東京エレクトロン株式会社 基板処理方法、基板処理装置および記憶媒体
JP2017157800A (ja) * 2016-03-04 2017-09-07 東京エレクトロン株式会社 液処理方法、基板処理装置、及び記憶媒体
JP2018056223A (ja) * 2016-09-27 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2018056206A (ja) * 2016-09-26 2018-04-05 東京エレクトロン株式会社 基板処理装置および基板処理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004349501A (ja) * 2003-05-22 2004-12-09 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP4991668B2 (ja) * 2008-09-29 2012-08-01 株式会社東芝 コンピュータシステムおよび修正パッチ確認／適用方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384119A (ja) * 1986-09-29 1988-04-14 Tokyo Electron Ltd 基板の洗浄方法
JP2007134673A (ja) * 2005-10-14 2007-05-31 Sony Corp 基板の処理方法
JP2007263485A (ja) * 2006-03-29 2007-10-11 Tokyo Electron Ltd 基板処理方法，記録媒体及び基板処理装置
JP2008108830A (ja) * 2006-10-24 2008-05-08 Dainippon Screen Mfg Co Ltd 二流体ノズルユニットおよびそれを用いた基板処理装置
JP2009200365A (ja) * 2008-02-23 2009-09-03 Sony Corp 基板の処理方法
JP2012054269A (ja) * 2010-08-31 2012-03-15 Elpida Memory Inc 半導体洗浄方法および半導体洗浄装置
JP2012231116A (ja) * 2011-04-15 2012-11-22 Tokyo Electron Ltd 液処理方法、液処理装置および記憶媒体
JP2016086072A (ja) * 2014-10-24 2016-05-19 東京エレクトロン株式会社 基板処理方法、基板処理装置および記憶媒体
JP2017157800A (ja) * 2016-03-04 2017-09-07 東京エレクトロン株式会社 液処理方法、基板処理装置、及び記憶媒体
JP2018056206A (ja) * 2016-09-26 2018-04-05 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2018056223A (ja) * 2016-09-27 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Also Published As

Publication number Publication date
WO2020235438A1 (ja) 2020-11-26
TW202105495A (zh) 2021-02-01
JP7191216B2 (ja) 2022-12-16

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