JPWO2020235233A1 - トリミング回路およびトリミング方法 - Google Patents
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Abstract
Description
[先行技術文献]
[特許文献]
[特許文献1] 特開2018−22848号公報
[特許文献2] 特開2000−340656号公報
トリミング回路100がトリミングを実行していない状態においては、出力端子OUTの出力電圧SOは、高電位配線VDDによりプルアップ(分圧)されている。一例において、高電位配線VDDに印加された電圧が第1抵抗素子R1および第2抵抗部29によって分圧される。例えば、高電位配線VDDに印加された電圧が5Vであり、第1抵抗素子R1、第2抵抗部29、およびヒューズ抵抗22の電気抵抗値が、それぞれ100kΩ、10kΩ、および100Ωであるとすると、出力端子OUTには、約4.5Vの電圧が印加される。すなわち、出力端子OUTには、Hiレベル(トランジスタ部10を構成するトランジスタの閾値電圧より高い電圧)の電圧Soが印加される。これにより、電流調整用のMOSFETであるトランジスタ部10はオンし、対応する被調整素子2の両端はショート状態を維持する。
トリミング回路100は、ヒューズ抵抗22の切断後における被調整素子2の電気特性を確認するために仮想切断を実行することができる。トリミング回路100は、ヒューズ抵抗22が仮想的に切断された状態を生成する。トリミング回路100が、仮想切断を実行する場合には(ステップS100:YES)、トリミング用のパッド24に印加される電圧Spが調整されてよい。
仮想切断により得られた結果に基づいて、トリミングを実行するか否かが決定されてよい(ステップS102)。例えば、端子T1と端子T2との間の抵抗値または電流値が目標範囲になるように、複数のヒューズ抵抗22のうちから選択的に切断するヒューズ抵抗22が決定される。
図5は、トリミング回路100における本体部20の他の例を示す回路図である。図5に示される本体部20は、保護ダイオードZLが省略されていることを除いて、図2に示される本体部20と同様の構造を有する。
Claims (19)
- ヒューズ抵抗の切断の有無に応じた電圧を出力する本体部を備えたトリミング回路であって、
前記本体部は、
半導体基板に絶縁膜を介して配置されるポリシリコン層により形成されるヒューズ抵抗と、
前記ヒューズ抵抗の一端に接続されるトリミング用のパッドと、
前記ヒューズ抵抗と前記パッドとの接続点に電気的に接続されており、前記ヒューズ抵抗の切断の有無に応じた電圧を出力する出力端子と、
前記半導体基板に形成されており、前記ヒューズ抵抗の他端に一端が接続されるダイオードと、を備えている、
トリミング回路。 - 前記ダイオードは、第1導電型の前記半導体基板に形成された第2導電型の半導体領域を有する、請求項1に記載のトリミング回路。
- 前記ヒューズ抵抗と前記ダイオードとの接続点に一端が接続され、他端が第1電位に接続される第1抵抗部を更に備える
請求項1または2に記載のトリミング回路。 - 前記ヒューズ抵抗と前記パッドとの接続点に一端が接続され、他端が第2電位に接続される第2抵抗部を更に備える
請求項1または2に記載のトリミング回路。 - 前記第2抵抗部の他端と前記出力端子との間に接続される保護ダイオードを更に備える
請求項4に記載のトリミング回路。 - 前記半導体基板に形成され、前記出力端子に制御端子が接続されるトランジスタ部を更に備える
請求項1から5の何れか1項に記載のトリミング回路。 - 前記ダイオードは、縦型ダイオードであり、
前記ダイオードの他端が、前記半導体基板の基板電極に接続されている
請求項1から6の何れか1項に記載のトリミング回路。 - 前記第1導電型は、n型であり、前記第2導電型は、p型であり、
前記ヒューズ抵抗の他端と前記ダイオードのアノードとが接続されており、
前記ヒューズ抵抗と前記ダイオードのアノードとの接続点に一端が接続され、他端が高電位配線に接続される第1抵抗部と、
前記ヒューズ抵抗と前記パッドとの接続点に一端が接続され、他端がグランド配線に接続される第2抵抗部と、
を更に備える
請求項2に記載のトリミング回路。 - 前記第1導電型は、p型であり、前記第2導電型は、n型であり、
前記ヒューズ抵抗の他端と前記ダイオードのカソードとが接続されており、
前記ヒューズ抵抗と前記ダイオードのカソードとの接続点に一端が接続され、他端がグランド配線に接続される第1抵抗部と、
前記ヒューズ抵抗と前記パッドとの接続点に一端が接続され、他端が高電位配線に接続される第2抵抗部と、
を更に備える
請求項2に記載のトリミング回路。 - 複数の前記本体部を備え、
前記ダイオードが、複数の前記本体部に対して共通に設けられ、
前記ダイオードには、それぞれの前記本体部の前記ヒューズ抵抗の前記他端が接続されている
請求項1に記載のトリミング回路。 - 複数の前記本体部に対して共通に設けられ、前記ダイオードに一端が接続され、他端が高電位配線に接続される第1抵抗部を更に備え、
前記第1抵抗部の前記一端には、それぞれの前記本体部の前記ヒューズ抵抗の前記他端が接続されている
請求項10に記載のトリミング回路。 - 複数の前記本体部に対して共通に設けられ、前記ダイオードに一端が接続され、他端がグランド配線に接続される第1抵抗部を更に備え、
前記第1抵抗部の前記一端には、それぞれの前記本体部の前記ヒューズ抵抗の前記他端が接続されている
請求項10に記載のトリミング回路。 - 前記ダイオードのカソードに、それぞれの前記本体部の前記ヒューズ抵抗の前記他端が接続されている
請求項10から12のいずれか一項に記載のトリミング回路。 - 前記ダイオードのアノードに、それぞれの前記本体部の前記ヒューズ抵抗の前記他端が接続されている
請求項10から12のいずれか一項に記載のトリミング回路。 - 請求項1から14の何れか1項に記載のトリミング回路を用いて、被調整素子の電気特性を調整するトリミング方法であって、
前記ダイオードに順方向電流が流れるように前記半導体基板の電位と、前記パッドに印加する電圧を調整する段階と、
前記順方向電流が前記ヒューズ抵抗を流れることによって前記ヒューズ抵抗を切断する段階と、
を備えるトリミング方法。 - 前記ダイオードに順方向電流を流す段階の前に、前記パッドに、予め定められた電圧を印加することにより、前記ヒューズ抵抗が仮想的に切断された状態を生成する段階を更に備える請求項15に記載のトリミング方法。
- 前記ヒューズ抵抗を切断した後において、前記パッドと前記出力端子とは電気的に接続されている、
請求項15または16に記載のトリミング方法。 - 前記トリミング回路は、複数の前記本体部を備え、前記ダイオードが、複数の前記本体部に対して共通に設けられ、前記ダイオードには、それぞれの前記本体部の前記ヒューズ抵抗の前記他端が接続されており、
前記電圧を調整する段階において、前記ヒューズ抵抗を切断すべき前記本体部の前記パッドに、選択的に電圧を印加する
請求項15から17のいずれか一項に記載のトリミング方法。 - それぞれの前記本体部には、高電位およびグランド電位が印加され、
前記電圧を調整する段階において、前記ヒューズ抵抗を切断すべき前記本体部に印加するグランド電位を変更する
請求項18に記載のトリミング方法。
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04163934A (ja) * | 1990-10-26 | 1992-06-09 | Toshiba Corp | 半導体装置 |
JPH05267464A (ja) * | 1992-03-18 | 1993-10-15 | Fujitsu Ltd | 半導体装置 |
JPH07198794A (ja) * | 1993-12-28 | 1995-08-01 | Sony Corp | 検出用端子を有する半導体装置 |
JP2000323650A (ja) * | 1999-05-11 | 2000-11-24 | Hitachi Ltd | トリミング回路 |
JP2000340656A (ja) * | 1999-05-28 | 2000-12-08 | Fujitsu Ltd | トリミング回路 |
JP2018022848A (ja) * | 2016-08-05 | 2018-02-08 | 富士電機株式会社 | トリミング回路およびトリミング方法 |
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KR20100084726A (ko) * | 2009-01-19 | 2010-07-28 | (주)싸이닉솔루션 | 트리밍 장치 및 트리밍 장치가 형성된 웨이퍼 |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04163934A (ja) * | 1990-10-26 | 1992-06-09 | Toshiba Corp | 半導体装置 |
JPH05267464A (ja) * | 1992-03-18 | 1993-10-15 | Fujitsu Ltd | 半導体装置 |
JPH07198794A (ja) * | 1993-12-28 | 1995-08-01 | Sony Corp | 検出用端子を有する半導体装置 |
JP2000323650A (ja) * | 1999-05-11 | 2000-11-24 | Hitachi Ltd | トリミング回路 |
JP2000340656A (ja) * | 1999-05-28 | 2000-12-08 | Fujitsu Ltd | トリミング回路 |
JP2018022848A (ja) * | 2016-08-05 | 2018-02-08 | 富士電機株式会社 | トリミング回路およびトリミング方法 |
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