JPWO2020221510A5 - - Google Patents
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- Publication number
- JPWO2020221510A5 JPWO2020221510A5 JP2021557159A JP2021557159A JPWO2020221510A5 JP WO2020221510 A5 JPWO2020221510 A5 JP WO2020221510A5 JP 2021557159 A JP2021557159 A JP 2021557159A JP 2021557159 A JP2021557159 A JP 2021557159A JP WO2020221510 A5 JPWO2020221510 A5 JP WO2020221510A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- superconducting layer
- superconducting
- component
- resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 32
- 238000000034 method Methods 0.000 claims 20
- 239000011241 protective layer Substances 0.000 claims 16
- 239000000758 substrate Substances 0.000 claims 10
- 238000000151 deposition Methods 0.000 claims 8
- 238000005530 etching Methods 0.000 claims 6
- 230000001939 inductive effect Effects 0.000 claims 6
- 239000002096 quantum dot Substances 0.000 claims 5
- 239000002887 superconductor Substances 0.000 claims 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 4
- 238000000059 patterning Methods 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 4
- 239000010703 silicon Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 1
- 238000001459 lithography Methods 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/396,992 | 2019-04-29 | ||
| US16/396,992 US11088310B2 (en) | 2019-04-29 | 2019-04-29 | Through-silicon-via fabrication in planar quantum devices |
| PCT/EP2020/057766 WO2020221510A1 (en) | 2019-04-29 | 2020-03-20 | Through-silicon-via fabrication in planar quantum devices |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022530310A JP2022530310A (ja) | 2022-06-29 |
| JPWO2020221510A5 true JPWO2020221510A5 (zh) | 2022-08-18 |
| JP7430198B2 JP7430198B2 (ja) | 2024-02-09 |
Family
ID=70189899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021557159A Active JP7430198B2 (ja) | 2019-04-29 | 2020-03-20 | プレーナ型量子デバイスにおけるシリコン貫通ビアの製作 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US11088310B2 (zh) |
| EP (1) | EP3963635A1 (zh) |
| JP (1) | JP7430198B2 (zh) |
| KR (1) | KR102574940B1 (zh) |
| CN (1) | CN113632233A (zh) |
| AU (1) | AU2020265711B2 (zh) |
| BR (1) | BR112021021816A8 (zh) |
| CA (1) | CA3137245A1 (zh) |
| IL (1) | IL287255B2 (zh) |
| MX (1) | MX2021012895A (zh) |
| SG (1) | SG11202109843RA (zh) |
| WO (1) | WO2020221510A1 (zh) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210280763A1 (en) * | 2019-12-23 | 2021-09-09 | Microsoft Technology Licensing, Llc | Superconductor heterostructures for semiconductor-superconductor hybrid structures |
| CN113257988B (zh) * | 2020-04-01 | 2022-05-06 | 阿里巴巴集团控股有限公司 | 硬掩模及其制备方法、约瑟夫森结的制备方法及超导电路 |
| US11417819B2 (en) * | 2020-04-27 | 2022-08-16 | Microsoft Technology Licensing, Llc | Forming a bumpless superconductor device by bonding two substrates via a dielectric layer |
| US11038094B1 (en) * | 2021-01-19 | 2021-06-15 | Quantala LLC | Superconducting qubit with tapered junction wiring |
| US11784111B2 (en) | 2021-05-28 | 2023-10-10 | Advanced Semiconductor Engineering, Inc. | Semiconductor device and method for manufacturing the same |
| US11631631B2 (en) * | 2021-05-28 | 2023-04-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor device including via structure for vertical electrical connection |
| NL2030907B1 (en) * | 2022-02-11 | 2023-08-18 | Quantware Holding B V | Quantum computing apparatus with interposer, method of fabrication thereof, method of performing a quantum computing operation, quantum computing apparatus comprising tantalum nitride and a method of fabrication thereof |
| WO2023188391A1 (ja) * | 2022-03-31 | 2023-10-05 | 富士通株式会社 | 量子デバイス及び量子デバイスの製造方法 |
| CN115440879B (zh) * | 2022-06-16 | 2023-04-25 | 合肥本源量子计算科技有限责任公司 | 超导硅片及其制备方法 |
| GB2626184A (en) * | 2023-01-13 | 2024-07-17 | Oxford Instruments Nanotechnology Tools Ltd | Methods of manufacturing superconducting via through semiconductor wafer |
| WO2024154358A1 (ja) * | 2023-01-20 | 2024-07-25 | 富士通株式会社 | デバイスおよびデバイスの製造方法 |
| CN118139515B (zh) * | 2024-05-06 | 2024-08-13 | 中国科学技术大学 | 基于通孔结构的超导量子比特器件 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6427294A (en) * | 1987-04-27 | 1989-01-30 | Fujitsu Ltd | Multilayer circuit board for superconducting ceramics circuit and manufacture thereof |
| JP2003298232A (ja) | 2002-04-02 | 2003-10-17 | Sony Corp | 多層配線基板の製造方法および多層配線基板 |
| US8580682B2 (en) * | 2010-09-30 | 2013-11-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cost-effective TSV formation |
| US9012322B2 (en) * | 2013-04-05 | 2015-04-21 | Intermolecular, Inc. | Selective etching of copper and copper-barrier materials by an aqueous base solution with fluoride addition |
| US10671559B2 (en) | 2014-03-21 | 2020-06-02 | Google Llc | Chips including classical and quantum computing processors |
| US9524470B1 (en) | 2015-06-12 | 2016-12-20 | International Business Machines Corporation | Modular array of vertically integrated superconducting qubit devices for scalable quantum computing |
| US10658424B2 (en) * | 2015-07-23 | 2020-05-19 | Massachusetts Institute Of Technology | Superconducting integrated circuit |
| US10396269B2 (en) | 2015-11-05 | 2019-08-27 | Massachusetts Institute Of Technology | Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits |
| US10242968B2 (en) * | 2015-11-05 | 2019-03-26 | Massachusetts Institute Of Technology | Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages |
| CN105468821B (zh) | 2015-11-15 | 2018-11-02 | 北京工业大学 | 利用最小包围圆的tsv自动定位方法 |
| US10381541B2 (en) * | 2016-10-11 | 2019-08-13 | Massachusetts Institute Of Technology | Cryogenic electronic packages and methods for fabricating cryogenic electronic packages |
| CN107564868B (zh) | 2017-07-07 | 2019-08-02 | 清华大学 | 一种超导量子计算芯片的集成封装结构和方法 |
| US10446736B2 (en) * | 2017-11-27 | 2019-10-15 | International Business Machines Corporation | Backside coupling with superconducting partial TSV for transmon qubits |
| US10305015B1 (en) * | 2017-11-30 | 2019-05-28 | International Business Machines Corporation | Low loss architecture for superconducting qubit circuits |
| US10243132B1 (en) * | 2018-03-23 | 2019-03-26 | International Business Machines Corporation | Vertical josephson junction superconducting device |
| US10497746B1 (en) * | 2018-05-25 | 2019-12-03 | International Business Machines Corporation | Three-dimensional integration for qubits on crystalline dielectric |
-
2019
- 2019-04-29 US US16/396,992 patent/US11088310B2/en active Active
-
2020
- 2020-03-20 CN CN202080021686.6A patent/CN113632233A/zh active Pending
- 2020-03-20 WO PCT/EP2020/057766 patent/WO2020221510A1/en unknown
- 2020-03-20 AU AU2020265711A patent/AU2020265711B2/en active Active
- 2020-03-20 KR KR1020217033038A patent/KR102574940B1/ko active IP Right Grant
- 2020-03-20 EP EP20717098.6A patent/EP3963635A1/en active Pending
- 2020-03-20 BR BR112021021816A patent/BR112021021816A8/pt active Search and Examination
- 2020-03-20 SG SG11202109843R patent/SG11202109843RA/en unknown
- 2020-03-20 JP JP2021557159A patent/JP7430198B2/ja active Active
- 2020-03-20 MX MX2021012895A patent/MX2021012895A/es unknown
- 2020-03-20 CA CA3137245A patent/CA3137245A1/en active Pending
-
2021
- 2021-10-13 IL IL287255A patent/IL287255B2/en unknown
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