Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N60/00—Superconducting devices
  • H10N60/80—Constructional details
  • H10N60/805—Constructional details for Josephson-effect devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N60/00—Superconducting devices
  • H10N60/01—Manufacture or treatment
  • H10N60/0241—Manufacture or treatment of devices comprising nitrides or carbonitrides
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
  • G06N20/00—Machine learning
  • G06N20/10—Machine learning using kernel methods, e.g. support vector machines [SVM]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
  • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
  • H01L21/32058—Deposition of superconductive layers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
  • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
  • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
  • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
  • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
  • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
  • H01L23/53204—Conductive materials
  • H01L23/53285—Conductive materials containing superconducting materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N60/00—Superconducting devices
  • H10N60/01—Manufacture or treatment
  • H10N60/0912—Manufacture or treatment of Josephson-effect devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N60/00—Superconducting devices
  • H10N60/10—Junction-based devices
  • H10N60/12—Josephson-effect devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N60/00—Superconducting devices
  • H10N60/80—Constructional details
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Theoretical Computer Science (AREA)
• Software Systems (AREA)
• Data Mining & Analysis (AREA)
• Evolutionary Computation (AREA)
• Medical Informatics (AREA)
• Computer Vision & Pattern Recognition (AREA)
• Computing Systems (AREA)
• General Engineering & Computer Science (AREA)
• Mathematical Physics (AREA)
• Artificial Intelligence (AREA)
• Superconductor Devices And Manufacturing Methods Thereof (AREA)
• Recrystallisation Techniques (AREA)
• Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
• Semiconductor Integrated Circuits (AREA)

Applications Claiming Priority (2)

Publications (1)

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• 2019
  • 2019-04-29 US US16/396,992 patent/US11088310B2/en active Active
• 2020
  • 2020-03-20 CN CN202080021686.6A patent/CN113632233A/en active Pending
  • 2020-03-20 JP JP2021557159A patent/JP7430198B2/en active Active
  • 2020-03-20 EP EP20717098.6A patent/EP3963635A1/en active Pending
  • 2020-03-20 SG SG11202109843R patent/SG11202109843RA/en unknown
  • 2020-03-20 AU AU2020265711A patent/AU2020265711B2/en active Active
  • 2020-03-20 WO PCT/EP2020/057766 patent/WO2020221510A1/en unknown
  • 2020-03-20 BR BR112021021816A patent/BR112021021816A8/en unknown
  • 2020-03-20 MX MX2021012895A patent/MX2021012895A/en unknown
  • 2020-03-20 CA CA3137245A patent/CA3137245A1/en active Pending
  • 2020-03-20 KR KR1020217033038A patent/KR102574940B1/en active IP Right Grant
• 2021
  • 2021-10-13 IL IL287255A patent/IL287255B2/en unknown

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