CN105468821B - Utilize the TSV automatic positioning methods of smallest enclosing circle - Google Patents
Utilize the TSV automatic positioning methods of smallest enclosing circle Download PDFInfo
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Abstract
Using the TSV automatic positioning methods of smallest enclosing circle, belong to circuit design field；This method establishes plane right-angle coordinate to the domain of 3D integrated circuits first, will be in the coordinate projection to coordinate system of all standard blocks in all gauzes containing TSV.Then each gauze for containing TSV is handled respectively.All standard blocks in the gauze are formed into discrete point set, the smallest enclosing circle of these discrete points is solved using smallest enclosing circle algorithm, the coordinate in the center of circle is just the coordinate of all TSV of the gauze at this time.Above-mentioned processing finally is done to institute's wired network, obtains the coordinate of all TSV in 3D integrated circuits.The present invention has the advantages that：The determination of the positions institute wired network TSV may be implemented in the present invention；Because smallest enclosing circle is utilized to determine the position of TSV, be conducive to the interconnection length for shortening 3D integrated circuits.
Description
Technical field
The present invention relates to a kind of autoplacement technologies of 3D integrated circuits, belong to circuit design field, more particularly to a kind of
The TSV automatic positioning methods of 3D integrated circuits.
Background technology
With the development of IC industry, the number of transistors in IC chip gradually increases, the ruler of transistor
It is very little also smaller and smaller.Due to the increase of number of transistors in chip so that the length of interconnection increases, result in the power consumption of interconnection by
Being more than gradually the power consumption of transistor becomes the main power consumption of chip.The increase of interconnection length also result in wiring difficulty increase etc. its
Its problem.With the diminution of transistor size, semiconductor fabrication process also becomes closer to its physics limit, leads to transistor
Size is difficult to continue to zoom out down.The above factor all can hinder IC industry according to its development plan i.e. Moore's Law
Development.In addition, the substitute technology of conventional semiconductor devices can not all be realized big in a short time such as graphene and quantum computer
Sizable application, so 3D integrated circuits just become a feasible developing direction.
Different from the plane figure of traditional integrated circuit, transistor is not only distributed in same plane in 3D integrated circuits
On, but utilize the three-dimensional layout of the stacking realization transistor of multilayer chiop.3D integrated circuits tear original 2D integrated circuits open
It is divided into multiple chips, and is stacked up.The perpendicular interconnection of chip is realized by silicon hole (TSV) later, and significantly shortens water
The length of flat interconnection.Then solving TSV orientation problems just becomes an important aspect of 3D IC design.
In order to shorten interconnection length, the present invention proposes a kind of TSV automatic positioning methods using smallest enclosing circle, to every
One gauze containing TSV is respectively processed, these standard blocks are determined using the coordinate of all standard blocks in gauze
Smallest enclosing circle, the center of circle are the coordinate of TSV.
Invention content
The present invention provides a kind of TSV automatic positioning methods of 3D integrated circuits, pass through 3D integrated circuit standard units
Coordinate determines the coordinate of TSV using smallest enclosing circle algorithm, completes the positioning of TSV, realizes the purpose for shortening interconnection length；It should
The TSV automatic station-keeping systems of 3D integrated circuits include input unit, two boundary points determination circle unit, three boundary point circumscribed circle units
With four part of encirclement circle authentication unit.The effect of input unit is the domain of In-put design, is placed it in the coordinate system of foundation,
And establish boundary point set；Two boundary points determine that the effect of circle unit is to determine circle using the line of two boundary points for diameter；
Three boundary point circumscribed circle units are used to determine the circumscribed circle of three boundary points；Circle authentication unit is surrounded for judging that two boundary points determine
Whether the circle that circle unit and three boundary point circumscribed circle units obtain is to surround circle, and the unit for controlling boundary point set is no more than three
It is a.
To achieve the above object, the technical method that the present invention uses for using the TSV automatic positioning methods of smallest enclosing circle,
This method is a kind of TSV automatic positioning methods of 3D integrated circuits, initially sets up the plane rectangular coordinates of 3D integrated circuit diagrams
System, is respectively processed each gauze containing TSV, extracts the coordinate of all standard blocks in gauze；Then for one
Gauze is calculated the smallest enclosing circle for surrounding all standard blocks of the gauze, the center of circle is set to the coordinate of TSV；To each
A gauze carries out identical processing, finally determines the coordinate of all TSV.It is as follows：
S1. 3D integrated circuit planar rectangular coordinate systems A is established.The gauze for containing TSV for each extracts its all mark
The coordinate of quasi- unit, will be in these cell projections to coordinate system A.Following steps are executed to each gauze for having TSV respectively.
S2. the farthest unit of distance in the gauze is put into the point set of boundary, it is straight that the line of the two units, which is used in combination,
Diameter obtains a circle.Judge whether this circle is to surround circle, if so, just all using the center of circle of this circle as this gauze
The coordinate of TSV.Justify if not surrounding, the unit farthest apart from the center of circle is put into the last of set.At this point, there are three in set
Unit.
S3. farthest with wherein distance if three units in set are in same straight line or constitute obtuse triangle
Two units repeat S2 in determine circle process；If these three units are not at same straight line and cannot constitute obtuse angle triangle
Shape then finds out their circumscribed circle.Judge this circle whether be surround circle, if so, just using this justify the center of circle as this
The coordinate of all TSV of gauze.
S4. if the circle that S3 is obtained is not to surround circle, the unit farthest apart from the center of circle is put into the last of boundary point set,
And first unit in set is deleted, keep the element number in set to be no more than three.Repeat S3.
S5. S3, S4 are executed repeatedly, until the coordinate of TSV determines.S2-S4, Zhi Daosuo finally are repeated to each gauze
Until wired network has all been handled.
To realize that above-mentioned steps, the function of TSV automatic station-keeping system each units of the 3D integrated circuits are as follows.
The function of input unit is as follows：3D integrated circuit planar rectangular coordinate system A are initially set up, then to by processing gauze
Standard block coordinate extract, project in coordinate system A, as determine smallest enclosing circle discrete point, finally determine from
Apart from two units of lie farthest away in scatterplot, the two units are put into an ordered set, which is boundary point
Set.
Two boundary points determine that the function of circle unit is as follows：By two farthest unit lines of distance in the point set of boundary, then
Line is determined a circle as diameter.
The function of three boundary point circumscribed circle units is as follows：It is not conllinear using three in the point set of boundary and cannot constitute blunt
The unit of angle triangle determines the circumscribed circle of these three units.
The function of surrounding circle authentication unit is as follows：For judging that two boundary points determine circle unit and three boundary point circumscribed circle lists
Whether the circle that member obtains is encirclement circle, if it is not, the unit farthest apart from the center of circle is put into the last of boundary point set, and
If the unit in set is more than three, first unit will be deleted, the point in set is made to remain three.
The wherein reference axis scale of coordinate system A is consistent with the size of practical domain, and is accurate to nanoscale.
Layer where the present invention is only suitable for TSV quantity and TSV in each gauze uses when having determined.
The method of the present invention has the advantages that：The determination of the positions institute wired network TSV may be implemented in the present invention；Because sharp
The position of TSV is determined with smallest enclosing circle, so being conducive to shorten the interconnection length of 3D integrated circuits.
Description of the drawings
Fig. 1 is certain two layers cross-sectional view in 3D IC chips；
Fig. 2 is the flow chart that TSV is positioned using smallest enclosing circle；
Fig. 3 is the case where determining smallest enclosing circle at least with two boundary points；
Fig. 4 is the case where determining smallest enclosing circle at least with three boundary points；
Fig. 5 is the flow diagram for determining smallest enclosing circle；
Fig. 6 is the TSV positioning results of some gauze in two layers of 3D integrated circuit；
Fig. 7 is the legend of Fig. 6；
In figure：1, TSV, 2, standard block, 3, metal interconnecting wires, 4, metal layer, 5, substrate, 6, upper layer chip, 7, lower layer
Chip, 8, the standard block of certain gauze upper layer chip, 9, the standard block of certain gauze lower layer chip, 10, certain gauze is using minimum
Surround the TSV of circle positioning.
Specific implementation mode
Below in conjunction with attached drawing, the present invention will be further described.
It is as shown in Figure 1 the cross-sectional view of two layers of 3D IC chips, which includes
TSV1, standard block 2, metal interconnecting wires 3, metal layer 4, substrate 5, upper layer chip 6 and lower layer chip 7；The present invention includes four
Unit, respectively input unit, two boundary points determine circle unit, three boundary point circumscribed circle units and surround circle authentication unit；This
3D integrated circuits in invention are a kind of three-dimensional chip structures, and each layer of 3D integrated circuits is all two-dimentional chip；Upper layer chip 6
Two layers of general structure in 3D integrated circuits is represented with lower layer chip 7；TSV1 is the through-silicon via structure for penetrating chip substrate 5,
Realize the communication between upper layer chip 6 and lower layer chip 7；Standard block 2 in chip is that integrated circuit is realized to signal
The element of reason and storage, and pass through the signal transmission between metal interconnecting wires 3 and TSV1 realization standard blocks 2.
Determining the smallest enclosing circle of discrete point, there are two kinds of situations.As shown in Figure 3：At least determined most by two boundary points
Small encirclement circle, it is the circle that diameter is constituted that smallest enclosing circle, which is exactly this 2 lines, at this time；As shown in Figure 4：At least by three boundaries
The determining smallest enclosing circle of point, smallest enclosing circle is exactly the circumscribed circle for the triangle that these three points are constituted at this time.
It is the specific implementation step of the present invention below, is illustrated by taking Fig. 5 and Fig. 6 as an example.
Input unit includes the plane rectangular coordinates of the coordinate and domain of each gauze Plays unit 2 containing TSV1
System；Such as the standard block 8 of the upper layer chip of the coordinate system and its gauze in Fig. 6 and the standard block 9 of lower layer chip；Its work(
The plane right-angle coordinate of domain can be used to establish, extract the coordinate of all standard blocks of some gauze, and project to coordinate
In system.
S1. 3D integrated circuit rectangular coordinate system A (as shown in Figure 6) are established using input unit, from all lines containing TSV
The coordinate of extraction standard unit in net, and project in coordinate system A.Following place is carried out to each gauze containing TSV respectively
Reason.
Two boundary points determine that circle unit includes the standard block in plane right-angle coordinate, boundary point set, and set
2.The unit determines circle using the line of two farthest units of distance in set.It includes rectangular co-ordinate to surround circle authentication unit
Standard block 2 in system, the conjunction of boundary point set sum aggregate, and determine circle unit or three boundary point circumscribed circle units by two boundary points
Identified circle.Its function is for judging whether a circle is to surround circle, if it is not, will be by the unit farthest apart from the center of circle
It is put into set finally, and the element number in set is kept not exceed three.
S2. by taking the gauze in Fig. 5 1. as an example, wherein containing there are four be not entirely in same layer standard block a, b, c and
d.As Fig. 5 2. shown in, distance farthest two units a and d will be put into the point set P of boundary first, and utilize the two lists
The line of member is that diameter determines a circle, center of circle t.Because the TSV of the gauze cannot as Fig. 3 by two boundary points just
It was determined that so the circle is not the encirclement circle of all units of the gauze.Then set P will be put into apart from center of circle t farthest cells b
It is last.
Three boundary point circumscribed circle units include the standard block in plane right-angle coordinate, boundary point set, and set
2.The unit determines circumscribed circle using the triangle that three units in set are constituted.
S3. such as Fig. 5's is 3. shown, and the unit in set P is a, d and b at this time.Because triangle adb is not obtuse angle triangle
Shape, so determining the circumscribed circle of triangle adb, center of circle t using three boundary circumscribed circle units.However the circle is nor the gauze
The encirclements of all units is justified, and it is last that the unit c farthest apart from center of circle t is then put into set P, and deletes first unit in P,
That is unit a.
S4. such as Fig. 5's is 4. shown, and the unit in gathering at this time is d, b and c.Because triangle dbc is obtuse triangle,
So determining circle unit using two boundary points, a circle is determined as diameter using the line apart from farthest unit b and c, the center of circle is
t.Because the circle is not the encirclement circle of all units of the gauze, the farthest unit a of distance t are put into the last of set P, and
Delete first unit, i.e. unit d in P.As Fig. 5 5. shown in, at this time the unit in set P be b, c and a.Because of triangle
Bca is not obtuse triangle, so determining the circumscribed circle of triangle bca, center of circle t using three boundary circumscribed circle units.Because
The circle is the encirclement circle of all units of the gauze, and encirclement circle is the circumscribed circle that three boundary points determine, and eliminates two sides
Boundary's point determines the possibility for surrounding circle, so the circle is the smallest enclosing circle of all units of the gauze.At this time by all TSV of the gauze
Coordinate be assigned a value of the coordinate of center of circle t.Fig. 6 is that certain gauze determines TSV10's using smallest enclosing circle in two layers of 3D integrated circuit
As a result.
S5. to all, the gauze containing TSV carries out the processing such as S2-S4, until the positions TSV of institute's wired network are all determined as
Only.
The present invention establishes plane right-angle coordinate to the domain of 3D integrated circuits first, will be in all gauzes containing TSV
In the coordinate projection to coordinate system of all standard blocks.Then each gauze for containing TSV is handled respectively.By the line
All standard blocks form discrete point set in net, and the smallest enclosing circle of these discrete points is solved using smallest enclosing circle algorithm, this
The coordinate of Shi Yuanxin is just the coordinate of all TSV of the gauze.Above-mentioned processing finally is done to institute's wired network, is obtained in 3D integrated circuits
The coordinate of all TSV.
Claims (9)
1. using the TSV automatic positioning methods of smallest enclosing circle, this method is a kind of automatic positioning sides TSV of 3D integrated circuits
Method, it is characterised in that：The plane right-angle coordinate for initially setting up 3D integrated circuit diagrams distinguishes each gauze containing TSV
It is handled, extracts the coordinate of all standard blocks in gauze；Then it for each gauze, is calculated and owns the gauze
The center of circle, is set to the coordinate of TSV by the smallest enclosing circle that standard block surrounds；Identical processing is carried out to each gauze, finally
Determine the coordinate of all TSV；It is as follows：
S1. 3D integrated circuit planar rectangular coordinate systems A is established；The gauze for containing TSV for each extracts its all standard list
The coordinate of member, will be in these cell projections to coordinate system A；Following steps are executed to each gauze for having TSV respectively；
S2. the farthest unit of distance in the gauze is put into the point set of boundary, it is that diameter obtains that the line of the two units, which is used in combination,
To a circle；Judge whether this circle is to surround circle, if so, just using the center of circle of this circle as all TSV's of this gauze
Coordinate；Justify if not surrounding, the unit farthest apart from the center of circle is put into the last of set；At this point, there are three units in set；
S3. if three units in set are in same straight line or constitute obtuse triangle, with wherein apart from farthest two
A unit repeats to determine the process of circle in S2；If these three units are not at same straight line and cannot constitute obtuse triangle,
Then find out their circumscribed circle；Judge whether this circle is to surround circle, if so, just using the center of circle of this circle as this gauze
The coordinate of all TSV；
S4. if the circle that S3 is obtained is not to surround circle, the unit farthest apart from the center of circle is put into the last of boundary point set, and delete
Except first unit in set, the element number in set is kept to be no more than three；Repeat S3；
S5. S3, S4 are executed repeatedly, until the coordinate of TSV determines；S2-S4 finally is repeated to each gauze, until institute is wired
Until net has all been handled；
Each step is implemented as follows：
S1. 3D integrated circuit rectangular coordinate system A, the extraction standard list from all gauzes containing TSV are established using input unit
The coordinate of member, and project in coordinate system A；Following processing is carried out to each gauze containing TSV respectively；
Two boundary points determine that circle unit includes the standard block (2) in plane right-angle coordinate, boundary point set, and set；
Two boundary points determine that circle unit determines circle using the line of two farthest units of distance in set；Surrounding circle authentication unit includes
Standard block (2) in rectangular coordinate system, the conjunction of boundary point set sum aggregate, and determine circle unit or three boundary points by two boundary points
Circle determined by circumscribed circle unit；Its function is for judging whether one circle is that encirclement is justified, if it is not, will will be apart from the center of circle
Farthest unit is put into set finally, and the element number in set is kept not exceed three；
S2. gauze is containing there are four standard block a, b, c and the d for being not entirely in same layer；First by two farthest lists of distance
First a and d is put into the point set P of boundary, and is that diameter determines a circle, center of circle t, by distance using the line of the two units
Center of circle t farthest cells b is put into the last of set P；
Three boundary point circumscribed circle units include the standard block (2) in plane right-angle coordinate, boundary point set, and set；
Three boundary point circumscribed circle units determine circumscribed circle using the triangle that three units in set are constituted；
S3. the unit in set P is a, d and b；Because triangle adb is not obtuse triangle, three boundary circumscribed circles are utilized
Unit determines the circumscribed circle of triangle adb, center of circle t；However the circle nor all units of the gauze encirclement circle, then will
It is last that the unit c farthest apart from center of circle t is put into set P, and deletes first unit in P, i.e. unit a；
S4. the unit in gathering is d, b and c；Because triangle dbc is obtuse triangle, is determined and justified using two boundary points
Unit determines a circle, center of circle t using the line apart from farthest unit b and c as diameter；Because the circle is not the gauze institute
There is the encirclement of unit to justify, so the farthest unit a of distance t are put into the last of set P, and deletes first unit in P, i.e., singly
First d；The unit in set P is b, c and a at this time；It is external using three boundaries because triangle bca is not obtuse triangle
Circle unit determines the circumscribed circle of triangle bca, center of circle t；Because the circle is the encirclement circle of all units of the gauze, and the encirclement
Circle is the circumscribed circle that three boundary points determine, and eliminates two boundary points and determine the possibility for surrounding circle, so the circle is the gauze
The smallest enclosing circle of all units；The coordinate of all TSV of the gauze is assigned a value of to the coordinate of center of circle t at this time；
S5. to all, the gauze containing TSV carries out the processing such as S2-S4, until the positions TSV of institute's wired network all determine；
Plane right-angle coordinate is established to the domain of 3D integrated circuits first, by all standard lists in all gauzes containing TSV
In the coordinate projection to coordinate system of member；Then each gauze for containing TSV is handled respectively；By all marks in the gauze
Quasi- unit forms discrete point set, the smallest enclosing circle of these discrete points is solved using smallest enclosing circle algorithm, at this time the seat in the center of circle
Mark is just the coordinate of all TSV of the gauze；Above-mentioned processing finally is done to institute's wired network, obtains all TSV in 3D integrated circuits
Coordinate.
2. the TSV automatic positioning methods according to claim 1 using smallest enclosing circle, it is characterised in that：Realize the 3D
The function of system each unit of the TSV automatic positioning methods of integrated circuit is as follows；
The function of input unit is as follows：3D integrated circuit planar rectangular coordinate system A are initially set up, then to by the mark of processing gauze
Quasi- unit coordinate extracts, and projects in coordinate system A, as the discrete point for determining smallest enclosing circle, finally determines discrete point
The two units are put into an ordered set by middle two units apart from lie farthest away, which is boundary point set.
3. the TSV automatic positioning methods according to claim 1 using smallest enclosing circle, it is characterised in that：Two boundary points
Determine that the function of circle unit is as follows：By two farthest unit lines of distance in the point set of boundary, then using line as diameter
Determine a circle.
4. the TSV automatic positioning methods according to claim 1 using smallest enclosing circle, it is characterised in that：Three boundary points
The function of circumscribed circle unit is as follows：The unit not conllinear and that obtuse triangle cannot be constituted using three in the point set of boundary,
Determine the circumscribed circle of these three units.
5. the TSV automatic positioning methods according to claim 1 using smallest enclosing circle, it is characterised in that：Circle is surrounded to test
The function of demonstrate,proving unit is as follows：For judge two boundary points determine circle unit and the obtained circle of three boundary point circumscribed circle units whether be
Circle is surrounded, if it is not, the unit farthest apart from the center of circle is put into the last of boundary point set, and if unit in set
More than three, first unit will be deleted, the point in set is made to remain three.
6. the TSV automatic positioning methods according to claim 1 using smallest enclosing circle, it is characterised in that：Coordinate system A's
Reference axis scale is consistent with the size of practical domain, and is accurate to nanoscale.
7. the TSV automatic positioning methods according to claim 1 using smallest enclosing circle, it is characterised in that：Realize the TSV
The 3D IC chips of automatic positioning method include TSV (1), standard block (2), metal interconnecting wires (3), metal layer (4), lining
Bottom (5), upper layer chip (6) and lower layer chip (7)；3D IC chips include four units, respectively input unit, two sides
Boundary's point determines circle unit, three boundary point circumscribed circle units and surrounds circle authentication unit；3D integrated circuits are a kind of three-dimensional chip knots
Each layer of structure, 3D integrated circuits is all two-dimentional chip；Upper layer chip (6) and lower layer chip (7) represent in 3D integrated circuits
Two layers of general structure；TSV (1) is the through-silicon via structure for penetrating chip substrate (5), realizes upper layer chip (6) and lower layer chip
(7) communication between；Standard block (2) in chip is basic composition portion of the integrated circuit realization to signal processing and storage
Point, and pass through the signal transmission between metal interconnecting wires (3) and TSV (1) realization standard blocks (2).
8. the TSV automatic positioning methods according to claim 1 using smallest enclosing circle, it is characterised in that：It determines discrete
There are two kinds of situations for the smallest enclosing circle of point；The smallest enclosing circle at least determined by two boundary points, smallest enclosing circle is just at this time
It is the circle that this 2 lines are diameter composition；The smallest enclosing circle at least determined by three boundary points, smallest enclosing circle is just at this time
It is the circumscribed circle for the triangle that these three points are constituted.
9. the TSV automatic positioning methods according to claim 1 using smallest enclosing circle, it is characterised in that：Input unit
The plane right-angle coordinate of coordinate and domain including each gauze Plays unit (2) containing TSV；Its function is for establishing
The plane right-angle coordinate of domain, extracts the coordinate of all standard blocks of some gauze, and projects in coordinate system.
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| CN108521791B (en) * | 2017-07-18 | 2022-07-01 | 深圳市大疆创新科技有限公司 | Positioning method, unmanned aerial vehicle and machine-readable storage medium |
| US11088310B2 (en) | 2019-04-29 | 2021-08-10 | International Business Machines Corporation | Through-silicon-via fabrication in planar quantum devices |
| CN118067141B (en) * | 2024-03-25 | 2024-07-05 | 腾讯科技（深圳）有限公司 | Data processing method, device, electronic equipment and storage medium |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102542096A (en) * | 2011-11-23 | 2012-07-04 | 北京工业大学 | TSV (through silicon via) center point positioning method for 3D (three dimension) integrated circuits |
| CN103678770A (en) * | 2013-11-13 | 2014-03-26 | 北京工业大学 | Noise-reduction-based automatic layout method for positions of TSVs in 3D integrated circuit |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102542096A (en) * | 2011-11-23 | 2012-07-04 | 北京工业大学 | TSV (through silicon via) center point positioning method for 3D (three dimension) integrated circuits |
| CN103678770A (en) * | 2013-11-13 | 2014-03-26 | 北京工业大学 | Noise-reduction-based automatic layout method for positions of TSVs in 3D integrated circuit |
Non-Patent Citations (1)
| Title |
|---|
| 离散点集最小包围圆算法分析与改进;李红军 等;《图学学报》;20120430;第33卷(第2期);34-38 * |
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