|
US2488710A
(en)
*
|
1946-09-23 |
1949-11-22 |
Allegheny Ludlum Steel |
Enclosing shield for electrical applications
|
|
US4806703A
(en)
*
|
1988-01-11 |
1989-02-21 |
The Curran Company |
Panel system for EMI shielded enclosures
|
|
US4831211A
(en)
*
|
1988-06-08 |
1989-05-16 |
Rockwell International Corporation |
EMI/RFI sealed microphonics isolation apparatus and methods
|
|
JP3342189B2
(ja)
*
|
1994-08-18 |
2002-11-05 |
富士通株式会社 |
電子装置の筐体構造
|
|
DE59605897D1
(de)
*
|
1995-02-14 |
2000-10-26 |
Knuerr Mechanik Ag |
Rahmenkonstruktion für Gestelle und Gehäuse von Baugruppenträgern und Schränken zur Aufnahme von elektrischen und/oder elektronischen Bauteilen
|
|
US6193802B1
(en)
*
|
1995-09-25 |
2001-02-27 |
Applied Materials, Inc. |
Parallel plate apparatus for in-situ vacuum line cleaning for substrate processing equipment
|
|
US5661640A
(en)
*
|
1996-01-05 |
1997-08-26 |
Dell Usa, L.P. |
Computer chassis having a size-adjustable, TEM-shielded circuit board support plate structure therein
|
|
JPH1156248A
(ja)
*
|
1997-06-09 |
1999-03-02 |
Ajinomoto Co Inc |
油糧種子から高濃度油脂含有物と未変性タンパク質を分離、製造する方法
|
|
JPH11312886A
(ja)
*
|
1998-04-28 |
1999-11-09 |
Mitsubishi Electric Corp |
通信機器装置の筐体構造
|
|
JP4064540B2
(ja)
*
|
1998-08-11 |
2008-03-19 |
株式会社日立国際電気 |
プラズマｃｖｄ処理装置
|
|
JP3863352B2
(ja)
*
|
2000-06-26 |
2006-12-27 |
テクトロニクス・インターナショナル・セールス・ゲーエムベーハー |
電子機器筐体
|
|
JP2009260377A
(ja)
*
|
2001-12-25 |
2009-11-05 |
Tokyo Electron Ltd |
成膜方法及び処理装置
|
|
JP4460418B2
(ja)
*
|
2004-10-13 |
2010-05-12 |
東京エレクトロン株式会社 |
シールド体および真空処理装置
|
|
US9345183B2
(en)
*
|
2005-03-15 |
2016-05-17 |
Stealthdrive Canada Corp. |
EMI-shielding solutions for electronics enclosures using opposing three-dimensional shapes and channels formed in sheet metal
|
|
AU2007284072B2
(en)
*
|
2006-08-15 |
2011-01-20 |
Scott Hope |
A cage frame
|
|
US9184072B2
(en)
*
|
2007-07-27 |
2015-11-10 |
Mattson Technology, Inc. |
Advanced multi-workpiece processing chamber
|
|
US8673080B2
(en)
|
2007-10-16 |
2014-03-18 |
Novellus Systems, Inc. |
Temperature controlled showerhead
|
|
US8137467B2
(en)
*
|
2007-10-16 |
2012-03-20 |
Novellus Systems, Inc. |
Temperature controlled showerhead
|
|
US20090095218A1
(en)
*
|
2007-10-16 |
2009-04-16 |
Novellus Systems, Inc. |
Temperature controlled showerhead
|
|
KR200454281Y1
(ko)
*
|
2007-10-16 |
2011-06-23 |
노벨러스 시스템즈, 인코포레이티드 |
온도 제어 샤워헤드
|
|
KR200476124Y1
(ko)
*
|
2009-09-29 |
2015-01-30 |
어플라이드 머티어리얼스, 인코포레이티드 |
Ｒｆ전력공급 샤워헤드를 위한 편심 접지 복귀
|
|
CN106884157B
(zh)
*
|
2011-03-04 |
2019-06-21 |
诺发系统公司 |
混合型陶瓷喷淋头
|
|
US9293353B2
(en)
*
|
2011-04-28 |
2016-03-22 |
Lam Research Corporation |
Faraday shield having plasma density decoupling structure between TCP coil zones
|
|
CN102802386B
(zh)
*
|
2011-05-25 |
2016-04-20 |
莱尔德电子材料(深圳)有限公司 |
电磁干扰屏蔽组件
|
|
US9947512B2
(en)
*
|
2011-10-25 |
2018-04-17 |
Lam Research Corporation |
Window and mounting arrangement for twist-and-lock gas injector assembly of inductively coupled plasma chamber
|
|
US8780004B1
(en)
*
|
2012-01-31 |
2014-07-15 |
Western Digital Technologies, Inc. |
Dual configuration enclosure with optional shielding
|
|
US8987872B2
(en)
*
|
2013-03-11 |
2015-03-24 |
Qualcomm Incorporated |
Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages
|
|
US9018111B2
(en)
*
|
2013-07-22 |
2015-04-28 |
Asm Ip Holding B.V. |
Semiconductor reaction chamber with plasma capabilities
|
|
US9758349B2
(en)
*
|
2013-08-09 |
2017-09-12 |
Man-D-Tec, Inc. |
Elevator ventilation fan assembly
|
|
US9543158B2
(en)
*
|
2014-12-04 |
2017-01-10 |
Lam Research Corporation |
Technique to deposit sidewall passivation for high aspect ratio cylinder etch
|
|
US20150129131A1
(en)
*
|
2013-11-14 |
2015-05-14 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Semiconductor processing apparatus and pre-clean system
|
|
US20150185792A1
(en)
*
|
2013-12-26 |
2015-07-02 |
Shih-Wun Li |
DUAL-layer SYSTEM COMPUTER ENCLOSURE
|
|
US10081869B2
(en)
*
|
2014-06-10 |
2018-09-25 |
Lam Research Corporation |
Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substrates
|
|
US10047438B2
(en)
*
|
2014-06-10 |
2018-08-14 |
Lam Research Corporation |
Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas
|
|
US20160379851A1
(en)
*
|
2015-06-29 |
2016-12-29 |
Bharath Swaminathan |
Temperature controlled substrate processing
|
|
US10879041B2
(en)
*
|
2015-09-04 |
2020-12-29 |
Applied Materials, Inc. |
Method and apparatus of achieving high input impedance without using ferrite materials for RF filter applications in plasma chambers
|
|
US10373794B2
(en)
*
|
2015-10-29 |
2019-08-06 |
Lam Research Corporation |
Systems and methods for filtering radio frequencies from a signal of a thermocouple and controlling a temperature of an electrode in a plasma chamber
|
|
US20170194174A1
(en)
*
|
2015-12-30 |
2017-07-06 |
Applied Materials, Inc. |
Quad chamber and platform having multiple quad chambers
|
|
US9773643B1
(en)
*
|
2016-06-30 |
2017-09-26 |
Lam Research Corporation |
Apparatus and method for deposition and etch in gap fill
|
|
JP2018014406A
(ja)
*
|
2016-07-21 |
2018-01-25 |
富士通株式会社 |
筐体及び電子機器
|
|
KR102157824B1
(ko)
*
|
2016-08-01 |
2020-09-18 |
어플라이드 머티어리얼스, 인코포레이티드 |
저-손상 및 고-스루풋 플라즈마 프로세싱을 위한 대면적 vhf pecvd 챔버
|
|
KR102330098B1
(ko)
*
|
2017-04-24 |
2021-11-23 |
주성엔지니어링(주) |
기판 처리 장치
|
|
TWI886120B
(zh)
|
2019-03-28 |
2025-06-11 |
美商蘭姆研究公司 |
護罩殼及具有該護罩殼的設備
|