CN116334588A - 喷头护罩 - Google Patents

喷头护罩 Download PDF

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Publication number
CN116334588A
CN116334588A CN202310180191.3A CN202310180191A CN116334588A CN 116334588 A CN116334588 A CN 116334588A CN 202310180191 A CN202310180191 A CN 202310180191A CN 116334588 A CN116334588 A CN 116334588A
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CN
China
Prior art keywords
flange
edge
side member
overlaps
protective case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310180191.3A
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English (en)
Chinese (zh)
Inventor
安德鲁·波尔斯
克里斯多夫·拉姆赛尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN116334588A publication Critical patent/CN116334588A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45565—Shower nozzles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32899—Multiple chambers, e.g. cluster tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0049—Casings being metallic containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/026—Shields
    • H01J2237/0266—Shields electromagnetic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Glass Compositions (AREA)
  • Massaging Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Vehicle Body Suspensions (AREA)
CN202310180191.3A 2019-03-28 2020-03-25 喷头护罩 Pending CN116334588A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962825344P 2019-03-28 2019-03-28
US62/825,344 2019-03-28
PCT/US2020/024549 WO2020198267A1 (en) 2019-03-28 2020-03-25 Showerhead shroud
CN202080025678.9A CN113646466A (zh) 2019-03-28 2020-03-25 喷头护罩

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202080025678.9A Division CN113646466A (zh) 2019-03-28 2020-03-25 喷头护罩

Publications (1)

Publication Number Publication Date
CN116334588A true CN116334588A (zh) 2023-06-27

Family

ID=72611750

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202310180191.3A Pending CN116334588A (zh) 2019-03-28 2020-03-25 喷头护罩
CN202080025678.9A Pending CN113646466A (zh) 2019-03-28 2020-03-25 喷头护罩

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202080025678.9A Pending CN113646466A (zh) 2019-03-28 2020-03-25 喷头护罩

Country Status (7)

Country Link
US (2) US20220093372A1 (https=)
JP (2) JP7547362B2 (https=)
KR (2) KR102890569B1 (https=)
CN (2) CN116334588A (https=)
SG (1) SG11202110566PA (https=)
TW (2) TWI886120B (https=)
WO (1) WO2020198267A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI886120B (zh) * 2019-03-28 2025-06-11 美商蘭姆研究公司 護罩殼及具有該護罩殼的設備
US20250251140A1 (en) * 2022-04-22 2025-08-07 Lam Research Corporation Heat guard
WO2024097853A1 (en) * 2022-11-03 2024-05-10 Lam Research Corporation Segregated reactant delivery using showerhead and shroud
US20250022688A1 (en) * 2023-07-11 2025-01-16 Tokyo Electron Limited Plasma processing method and apparatus

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JPH0864978A (ja) * 1994-08-18 1996-03-08 Fujitsu Ltd 電子装置の筐体構造
US5735411A (en) * 1995-02-14 1998-04-07 Knurr-Mechanik Fur Die Elektronik Aktiengesellschaft Constructional system
CN102802386A (zh) * 2011-05-25 2012-11-28 莱尔德电子材料(深圳)有限公司 电磁干扰屏蔽组件
CN104040024A (zh) * 2011-10-25 2014-09-10 朗姆研究公司 用于电感耦合等离子体室的旋转闭锁气体喷射器总成的窗和安装装置
US20170069464A1 (en) * 2015-09-04 2017-03-09 Applied Materials, Inc. Method and apparatus of achieving high input impedance without using ferrite materials for rf filter applications in plasma chambers

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864978A (ja) * 1994-08-18 1996-03-08 Fujitsu Ltd 電子装置の筐体構造
US5735411A (en) * 1995-02-14 1998-04-07 Knurr-Mechanik Fur Die Elektronik Aktiengesellschaft Constructional system
CN102802386A (zh) * 2011-05-25 2012-11-28 莱尔德电子材料(深圳)有限公司 电磁干扰屏蔽组件
CN104040024A (zh) * 2011-10-25 2014-09-10 朗姆研究公司 用于电感耦合等离子体室的旋转闭锁气体喷射器总成的窗和安装装置
US20170069464A1 (en) * 2015-09-04 2017-03-09 Applied Materials, Inc. Method and apparatus of achieving high input impedance without using ferrite materials for rf filter applications in plasma chambers

Also Published As

Publication number Publication date
SG11202110566PA (en) 2021-10-28
CN113646466A (zh) 2021-11-12
US11488810B2 (en) 2022-11-01
KR102890569B1 (ko) 2025-11-24
TWI886120B (zh) 2025-06-11
WO2020198267A1 (en) 2020-10-01
JP7547362B2 (ja) 2024-09-09
JP2022523262A (ja) 2022-04-21
JP2024167308A (ja) 2024-12-03
KR102445935B1 (ko) 2022-09-20
KR20220132047A (ko) 2022-09-29
KR20210134427A (ko) 2021-11-09
US20220110230A1 (en) 2022-04-07
TW202542358A (zh) 2025-11-01
TW202104656A (zh) 2021-02-01
US20220093372A1 (en) 2022-03-24

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