JPWO2020185006A5 - - Google Patents

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Publication number
JPWO2020185006A5
JPWO2020185006A5 JP2021555039A JP2021555039A JPWO2020185006A5 JP WO2020185006 A5 JPWO2020185006 A5 JP WO2020185006A5 JP 2021555039 A JP2021555039 A JP 2021555039A JP 2021555039 A JP2021555039 A JP 2021555039A JP WO2020185006 A5 JPWO2020185006 A5 JP WO2020185006A5
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JP
Japan
Prior art keywords
led stack
semiconductor layer
conductivity type
type semiconductor
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021555039A
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English (en)
Japanese (ja)
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JP2022524838A (ja
JP7460650B2 (ja
Publication date
Priority claimed from US16/815,823 external-priority patent/US11211528B2/en
Application filed filed Critical
Publication of JP2022524838A publication Critical patent/JP2022524838A/ja
Publication of JPWO2020185006A5 publication Critical patent/JPWO2020185006A5/ja
Application granted granted Critical
Publication of JP7460650B2 publication Critical patent/JP7460650B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021555039A 2019-03-13 2020-03-12 ディスプレイ用発光素子及びそれを有するディスプレイ装置 Active JP7460650B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962817704P 2019-03-13 2019-03-13
US62/817,704 2019-03-13
US16/815,823 2020-03-11
US16/815,823 US11211528B2 (en) 2019-03-13 2020-03-11 Light emitting device for display and display apparatus having the same
PCT/KR2020/003451 WO2020185006A1 (fr) 2019-03-13 2020-03-12 Élément électroluminescent pour dispositif d'affichage et dispositif d'affichage le comprenant

Publications (3)

Publication Number Publication Date
JP2022524838A JP2022524838A (ja) 2022-05-10
JPWO2020185006A5 true JPWO2020185006A5 (fr) 2023-03-10
JP7460650B2 JP7460650B2 (ja) 2024-04-02

Family

ID=72423543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021555039A Active JP7460650B2 (ja) 2019-03-13 2020-03-12 ディスプレイ用発光素子及びそれを有するディスプレイ装置

Country Status (8)

Country Link
US (2) US11211528B2 (fr)
EP (1) EP3940775A4 (fr)
JP (1) JP7460650B2 (fr)
KR (1) KR20210127932A (fr)
CN (2) CN113557606A (fr)
BR (1) BR112021018020A2 (fr)
MX (1) MX2021010505A (fr)
WO (1) WO2020185006A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11489002B2 (en) * 2019-10-29 2022-11-01 Seoul Viosys Co., Ltd. LED display apparatus
CN213071133U (zh) * 2019-11-15 2021-04-27 首尔伟傲世有限公司 显示器用发光元件及显示装置
US11437353B2 (en) * 2019-11-15 2022-09-06 Seoul Viosys Co., Ltd. Light emitting device for display and display apparatus having the same
US20210375980A1 (en) * 2020-05-28 2021-12-02 Seoul Viosys Co., Ltd. Light emitting device and display apparatus having the same

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625201A (en) * 1994-12-12 1997-04-29 Motorola Multiwavelength LED devices and methods of fabrication
US7271420B2 (en) 2004-07-07 2007-09-18 Cao Group, Inc. Monolitholic LED chip to emit multiple colors
US8058663B2 (en) 2007-09-26 2011-11-15 Iii-N Technology, Inc. Micro-emitter array based full-color micro-display
US7732803B2 (en) 2008-05-01 2010-06-08 Bridgelux, Inc. Light emitting device having stacked multiple LEDS
KR101458958B1 (ko) 2008-06-10 2014-11-13 삼성전자주식회사 반도체 칩, 반도체 패키지 및 반도체 칩의 제조 방법
US9941319B2 (en) * 2010-10-13 2018-04-10 Monolithic 3D Inc. Semiconductor and optoelectronic methods and devices
JP5002703B2 (ja) 2010-12-08 2012-08-15 株式会社東芝 半導体発光素子
KR101293647B1 (ko) 2012-07-27 2013-08-13 삼성코닝정밀소재 주식회사 투명 전도성 산화물 박막 기판, 그 제조방법, 이를 포함하는 유기전계발광소자 및 광전지
JP2014175427A (ja) 2013-03-07 2014-09-22 Toshiba Corp 半導体発光素子及びその製造方法
TW201438188A (zh) 2013-03-25 2014-10-01 Miracle Technology Co Ltd 堆疊式發光二極體陣列結構
JP2015012244A (ja) 2013-07-01 2015-01-19 株式会社東芝 半導体発光素子
DE102016104280A1 (de) 2016-03-09 2017-09-14 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
KR102513080B1 (ko) 2016-04-04 2023-03-24 삼성전자주식회사 Led 광원 모듈 및 디스플레이 장치
KR20190001050A (ko) * 2017-06-26 2019-01-04 주식회사 루멘스 칩 적층 구조를 갖는 led 픽셀 소자
US10892296B2 (en) * 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting device having commonly connected LED sub-units
US11527519B2 (en) * 2017-11-27 2022-12-13 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US10748881B2 (en) * 2017-12-05 2020-08-18 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US10886327B2 (en) * 2017-12-14 2021-01-05 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US10862006B2 (en) * 2018-08-17 2020-12-08 Seoul Viosys Co., Ltd. Light emitting device
US10879419B2 (en) * 2018-08-17 2020-12-29 Seoul Viosys Co., Ltd. Light emitting device
US11430929B2 (en) * 2018-09-14 2022-08-30 Seoul Viosys Co., Ltd. Light emitting device having a stacked structure
US11502230B2 (en) * 2018-11-02 2022-11-15 Seoul Viosys Co., Ltd. Light emitting device
US11158665B2 (en) * 2018-11-05 2021-10-26 Seoul Viosys Co., Ltd. Light emitting device
US11271136B2 (en) * 2018-11-07 2022-03-08 Seoul Viosys Co., Ltd Light emitting device
US11967605B2 (en) * 2018-11-13 2024-04-23 Seoul Viosys Co., Ltd. Light emitting device
US11362073B2 (en) * 2019-02-08 2022-06-14 Seoul Viosys Co., Ltd. Light emitting device including multiple transparent electrodes for display and display apparatus having the same
US11387383B2 (en) * 2019-02-14 2022-07-12 Seoul Viosys Co., Ltd. Method of transferring light emitting device for display and display apparatus

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