BR112021018020A2 - Dispositivo emissor de luz para exibição e aparelho de exibição incluindo o mesmo - Google Patents

Dispositivo emissor de luz para exibição e aparelho de exibição incluindo o mesmo

Info

Publication number
BR112021018020A2
BR112021018020A2 BR112021018020A BR112021018020A BR112021018020A2 BR 112021018020 A2 BR112021018020 A2 BR 112021018020A2 BR 112021018020 A BR112021018020 A BR 112021018020A BR 112021018020 A BR112021018020 A BR 112021018020A BR 112021018020 A2 BR112021018020 A2 BR 112021018020A2
Authority
BR
Brazil
Prior art keywords
semiconductor layer
conductive semiconductor
led stack
light
led
Prior art date
Application number
BR112021018020A
Other languages
English (en)
Inventor
Seob Shin Chan
Joon Lee Ho
Geun Lee Seom
Kyu Jang Seong
Original Assignee
Seoul Viosys Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seoul Viosys Co Ltd filed Critical Seoul Viosys Co Ltd
Publication of BR112021018020A2 publication Critical patent/BR112021018020A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/163—Wearable computers, e.g. on a belt
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/0004—Devices characterised by their operation
    • H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/42—Transparent materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • G02B27/017—Head mounted
    • G02B2027/0178—Eyeglass type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • G02B27/017—Head mounted
    • G02B27/0172—Head mounted characterised by optical features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

dispositivo emissor de luz para exibição e aparelho de exibição incluindo o mesmo. inclui um elemento emissor de luz para um visor que, de acordo com uma modalidade, compreende uma primeira pilha de led; uma segunda pilha de led disposta abaixo da primeira pilha de led; uma terceira pilha de led disposta abaixo da segunda pilha de led; e pads de colisão dispostos na primeira pilha de led, em que cada uma da primeira à terceira pilhas de led inclui uma primeira camada semicondutora condutora e uma segunda camada semicondutora condutora disposta abaixo da primeira camada semicondutora condutora. a primeira pilha de led inclui uma primeira camada semicondutora condutora exposta através de uma segunda camada semicondutora condutora e tem orifícios de passagem superiores que passam através da primeira camada semicondutora condutora, a segunda pilha de led inclui uma primeira camada semicondutora condutora exposta através de uma segunda camada semicondutora condutora, e tem orifícios de passagem inferiores que passam através da primeira camada semicondutora condutora, a terceira pilha de led inclui uma primeira camada semicondutora condutora exposta através de uma segunda camada semicondutora condutora e os pads de colisão são eletricamente conectados à segunda pilha de led e à terceira pilha de led usando os orifícios de passagem superiores e os orifícios de passagem inferiores.
BR112021018020A 2019-03-13 2020-03-12 Dispositivo emissor de luz para exibição e aparelho de exibição incluindo o mesmo BR112021018020A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962817704P 2019-03-13 2019-03-13
US16/815,823 US11211528B2 (en) 2019-03-13 2020-03-11 Light emitting device for display and display apparatus having the same
PCT/KR2020/003451 WO2020185006A1 (ko) 2019-03-13 2020-03-12 디스플레이용 발광 소자 및 그것을 가지는 디스플레이 장치

Publications (1)

Publication Number Publication Date
BR112021018020A2 true BR112021018020A2 (pt) 2021-11-23

Family

ID=72423543

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112021018020A BR112021018020A2 (pt) 2019-03-13 2020-03-12 Dispositivo emissor de luz para exibição e aparelho de exibição incluindo o mesmo

Country Status (8)

Country Link
US (2) US11211528B2 (pt)
EP (1) EP3940775A4 (pt)
JP (1) JP7460650B2 (pt)
KR (1) KR20210127932A (pt)
CN (2) CN211929519U (pt)
BR (1) BR112021018020A2 (pt)
MX (1) MX2021010505A (pt)
WO (1) WO2020185006A1 (pt)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11489002B2 (en) * 2019-10-29 2022-11-01 Seoul Viosys Co., Ltd. LED display apparatus
US11437353B2 (en) * 2019-11-15 2022-09-06 Seoul Viosys Co., Ltd. Light emitting device for display and display apparatus having the same
CN213071133U (zh) * 2019-11-15 2021-04-27 首尔伟傲世有限公司 显示器用发光元件及显示装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625201A (en) * 1994-12-12 1997-04-29 Motorola Multiwavelength LED devices and methods of fabrication
US7271420B2 (en) 2004-07-07 2007-09-18 Cao Group, Inc. Monolitholic LED chip to emit multiple colors
US8058663B2 (en) 2007-09-26 2011-11-15 Iii-N Technology, Inc. Micro-emitter array based full-color micro-display
US7732803B2 (en) 2008-05-01 2010-06-08 Bridgelux, Inc. Light emitting device having stacked multiple LEDS
KR101458958B1 (ko) 2008-06-10 2014-11-13 삼성전자주식회사 반도체 칩, 반도체 패키지 및 반도체 칩의 제조 방법
US9941319B2 (en) 2010-10-13 2018-04-10 Monolithic 3D Inc. Semiconductor and optoelectronic methods and devices
JP5002703B2 (ja) 2010-12-08 2012-08-15 株式会社東芝 半導体発光素子
KR101293647B1 (ko) 2012-07-27 2013-08-13 삼성코닝정밀소재 주식회사 투명 전도성 산화물 박막 기판, 그 제조방법, 이를 포함하는 유기전계발광소자 및 광전지
JP2014175427A (ja) 2013-03-07 2014-09-22 Toshiba Corp 半導体発光素子及びその製造方法
TW201438188A (zh) 2013-03-25 2014-10-01 Miracle Technology Co Ltd 堆疊式發光二極體陣列結構
JP2015012244A (ja) 2013-07-01 2015-01-19 株式会社東芝 半導体発光素子
DE102016104280A1 (de) 2016-03-09 2017-09-14 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
KR102513080B1 (ko) 2016-04-04 2023-03-24 삼성전자주식회사 Led 광원 모듈 및 디스플레이 장치
KR20190001050A (ko) * 2017-06-26 2019-01-04 주식회사 루멘스 칩 적층 구조를 갖는 led 픽셀 소자
US10892296B2 (en) * 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting device having commonly connected LED sub-units
US11527519B2 (en) * 2017-11-27 2022-12-13 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US10748881B2 (en) * 2017-12-05 2020-08-18 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US10886327B2 (en) * 2017-12-14 2021-01-05 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US10879419B2 (en) * 2018-08-17 2020-12-29 Seoul Viosys Co., Ltd. Light emitting device
US10862006B2 (en) * 2018-08-17 2020-12-08 Seoul Viosys Co., Ltd. Light emitting device
US11430929B2 (en) * 2018-09-14 2022-08-30 Seoul Viosys Co., Ltd. Light emitting device having a stacked structure
US11502230B2 (en) * 2018-11-02 2022-11-15 Seoul Viosys Co., Ltd. Light emitting device
US11158665B2 (en) * 2018-11-05 2021-10-26 Seoul Viosys Co., Ltd. Light emitting device
US11271136B2 (en) * 2018-11-07 2022-03-08 Seoul Viosys Co., Ltd Light emitting device
US11967605B2 (en) * 2018-11-13 2024-04-23 Seoul Viosys Co., Ltd. Light emitting device
US11362073B2 (en) * 2019-02-08 2022-06-14 Seoul Viosys Co., Ltd. Light emitting device including multiple transparent electrodes for display and display apparatus having the same
US11387383B2 (en) * 2019-02-14 2022-07-12 Seoul Viosys Co., Ltd. Method of transferring light emitting device for display and display apparatus

Also Published As

Publication number Publication date
JP2022524838A (ja) 2022-05-10
US20200295228A1 (en) 2020-09-17
EP3940775A1 (en) 2022-01-19
CN211929519U (zh) 2020-11-13
MX2021010505A (es) 2022-01-18
CN113557606A (zh) 2021-10-26
WO2020185006A1 (ko) 2020-09-17
US20220158031A1 (en) 2022-05-19
EP3940775A4 (en) 2022-12-14
KR20210127932A (ko) 2021-10-25
JP7460650B2 (ja) 2024-04-02
US11211528B2 (en) 2021-12-28

Similar Documents

Publication Publication Date Title
BR112021018020A2 (pt) Dispositivo emissor de luz para exibição e aparelho de exibição incluindo o mesmo
EP3506353A3 (en) Displaying apparatus having light emitting device
BR112018013514A2 (pt) estrutura de empacotamento, dispositivo eletrônico e método de empacotamento
BR112018003233A2 (pt) embalagem de dispositivo integrado compreendendo ponte em camada litográfica
BR112019026866A2 (pt) Painel de exibição eletroluminescente e dispositivo de exibição
BR112017012829A2 (pt) dispositivo optoeletrônico com diodos emissores de luz
BR112018001783A2 (pt) estrutura de pacote sobre pacote (pop) incluindo várias matrizes
SG10201805091VA (en) Semiconductor package and method of manufacturing the same
CL2015003607A1 (es) Mejoras en o relacionadas con conjuntos de lentes
SG10201803738UA (en) Semiconductor device
BR112013028110A2 (pt) painel com um elemento de conexão elétrica
BR112022008047A2 (pt) Aparelho de exibição
BR112012032559A2 (pt) encapsulamento de semicondutores empilhados
BR112018006931A2 (pt) ?dispositivo emissor de luz, e, módulo emissor de luz?
SG155793A1 (en) Upgradeable and repairable semiconductor packages and methods
BR112018006678A2 (pt) dispositivo de embalagem-em-embalagem (pop) compreendendo um controlador de intervalo entre embalagens de circuito integrado (ic)
BR112017025261B8 (pt) Dispositivo de imagem
BR112014002246A2 (pt) dispositivo semicondutor
TW201613142A (en) Light-emitting unit and semiconductor light-emitting device
BR112022007494A2 (pt) Aparelho de exibição
TW201613060A (en) Semiconductor device having terminals formed on a chip package including a plurality of semiconductor chips and manufacturing method thereof
BR112017018820A2 (pt) chip
BR112021016971A2 (pt) Unidade de pixel, módulo de unidade de pixel e aparelho de exibição
BR112022003551A8 (pt) Dispositivos de rfid insensíveis à rotação e métodos de formação dos mesmos
BR112018010184A2 (pt) transferência de partículas seletivas de um dispositivo para outro