JPWO2020166702A5 - - Google Patents
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- JPWO2020166702A5 JPWO2020166702A5 JP2020572337A JP2020572337A JPWO2020166702A5 JP WO2020166702 A5 JPWO2020166702 A5 JP WO2020166702A5 JP 2020572337 A JP2020572337 A JP 2020572337A JP 2020572337 A JP2020572337 A JP 2020572337A JP WO2020166702 A5 JPWO2020166702 A5 JP WO2020166702A5
- Authority
- JP
- Japan
- Prior art keywords
- cleaning composition
- cleaning
- organic solvent
- composition according
- ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023011409A JP7583377B2 (ja) | 2019-02-15 | 2023-01-27 | 洗浄剤組成物及び洗浄方法 |
| JP2023011410A JP7545123B2 (ja) | 2019-02-15 | 2023-01-27 | 洗浄剤組成物の製造方法及び加工された半導体基板の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019026052 | 2019-02-15 | ||
| JP2019026052 | 2019-02-15 | ||
| PCT/JP2020/005808 WO2020166702A1 (ja) | 2019-02-15 | 2020-02-14 | 洗浄剤組成物及び洗浄方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023011410A Division JP7545123B2 (ja) | 2019-02-15 | 2023-01-27 | 洗浄剤組成物の製造方法及び加工された半導体基板の製造方法 |
| JP2023011409A Division JP7583377B2 (ja) | 2019-02-15 | 2023-01-27 | 洗浄剤組成物及び洗浄方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020166702A1 JPWO2020166702A1 (ja) | 2021-12-16 |
| JPWO2020166702A5 true JPWO2020166702A5 (https=) | 2022-07-28 |
| JP7219423B2 JP7219423B2 (ja) | 2023-02-08 |
Family
ID=72044223
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020572337A Active JP7219423B2 (ja) | 2019-02-15 | 2020-02-14 | 洗浄剤組成物及び洗浄方法 |
| JP2023011409A Active JP7583377B2 (ja) | 2019-02-15 | 2023-01-27 | 洗浄剤組成物及び洗浄方法 |
| JP2023011410A Active JP7545123B2 (ja) | 2019-02-15 | 2023-01-27 | 洗浄剤組成物の製造方法及び加工された半導体基板の製造方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023011409A Active JP7583377B2 (ja) | 2019-02-15 | 2023-01-27 | 洗浄剤組成物及び洗浄方法 |
| JP2023011410A Active JP7545123B2 (ja) | 2019-02-15 | 2023-01-27 | 洗浄剤組成物の製造方法及び加工された半導体基板の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11866676B2 (https=) |
| JP (3) | JP7219423B2 (https=) |
| KR (2) | KR102541336B1 (https=) |
| CN (1) | CN113439325B (https=) |
| TW (1) | TWI828863B (https=) |
| WO (1) | WO2020166702A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021106460A1 (ja) * | 2019-11-25 | 2021-06-03 | 昭和電工株式会社 | 分解洗浄組成物の製造方法 |
| KR102804998B1 (ko) * | 2020-03-23 | 2025-05-09 | 닛산 가가쿠 가부시키가이샤 | 반도체 기판의 세정 방법, 가공된 반도체 기판의 제조 방법 및 박리용 조성물 |
| WO2022244593A1 (ja) * | 2021-05-21 | 2022-11-24 | 昭和電工株式会社 | 分解洗浄組成物及びその製造方法、並びに接着性ポリマーの洗浄方法 |
| TW202504983A (zh) * | 2021-09-16 | 2025-02-01 | 日商日產化學股份有限公司 | 半導體基板之洗淨方法、加工後之半導體基板之製造方法、以及剝離及溶解用組成物 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003129089A (ja) * | 2001-10-24 | 2003-05-08 | Daikin Ind Ltd | 洗浄用組成物 |
| US6818608B2 (en) | 2002-02-01 | 2004-11-16 | John C. Moore | Cured polymers dissolving compositions |
| US6652665B1 (en) * | 2002-05-31 | 2003-11-25 | International Business Machines Corporation | Method of removing silicone polymer deposits from electronic components |
| US20060003910A1 (en) * | 2004-06-15 | 2006-01-05 | Hsu Jiun Y | Composition and method comprising same for removing residue from a substrate |
| US8030263B2 (en) * | 2004-07-01 | 2011-10-04 | Air Products And Chemicals, Inc. | Composition for stripping and cleaning and use thereof |
| JP2007109744A (ja) * | 2005-10-11 | 2007-04-26 | Tokuyama Corp | 基板洗浄液 |
| WO2008044608A1 (fr) | 2006-10-06 | 2008-04-17 | Sumitomo Chemical Company, Limited | Procédé destiné à produire un polymère polaire et composé d'organosilicium |
| DE102011088885A1 (de) * | 2011-12-16 | 2013-06-20 | Wacker Chemie Ag | Siliconlöser |
| JP2014133855A (ja) | 2012-12-11 | 2014-07-24 | Fujifilm Corp | シロキサン樹脂の除去剤、それを用いたシロキサン樹脂の除去方法並びに半導体基板製品及び半導体素子の製造方法 |
| KR102180284B1 (ko) * | 2015-01-13 | 2020-11-18 | 동우 화인켐 주식회사 | 실리콘계 수지 제거용 조성물 및 이를 이용한 박막 기판 제조 방법 |
| CN107034028B (zh) * | 2015-12-04 | 2021-05-25 | 三星电子株式会社 | 用于除去有机硅树脂的组合物、使用其薄化基材和制造半导体封装体的方法及使用其的系统 |
| CN105543008A (zh) * | 2015-12-30 | 2016-05-04 | 上海新阳半导体材料股份有限公司 | 一种用于低k介电材料的清洗处理的清洗液组合物 |
| US11183415B2 (en) * | 2016-06-22 | 2021-11-23 | Nissan Chemical Corporation | Adhesive containing polydimethyl siloxane |
| WO2018216732A1 (ja) * | 2017-05-24 | 2018-11-29 | 日産化学株式会社 | エポキシ変性ポリシロキサンを含有する仮接着剤 |
| CN112602174B (zh) * | 2018-10-16 | 2023-12-08 | 株式会社力森诺科 | 组合物、粘接性聚合物的清洗方法、器件晶圆的制造方法和支撑晶圆的再生方法 |
-
2020
- 2020-02-14 US US17/430,962 patent/US11866676B2/en active Active
- 2020-02-14 JP JP2020572337A patent/JP7219423B2/ja active Active
- 2020-02-14 KR KR1020217029056A patent/KR102541336B1/ko active Active
- 2020-02-14 WO PCT/JP2020/005808 patent/WO2020166702A1/ja not_active Ceased
- 2020-02-14 CN CN202080014674.0A patent/CN113439325B/zh active Active
- 2020-02-14 KR KR1020237018765A patent/KR102783945B1/ko active Active
- 2020-02-15 TW TW109104890A patent/TWI828863B/zh active
-
2023
- 2023-01-27 JP JP2023011409A patent/JP7583377B2/ja active Active
- 2023-01-27 JP JP2023011410A patent/JP7545123B2/ja active Active
-
2024
- 2024-01-09 US US18/407,867 patent/US20240218293A1/en active Pending
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