JPWO2020149360A1 - 硬化物及び有機ｅｌ表示素子 - Google Patents
硬化物及び有機ｅｌ表示素子 Download PDFInfo
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- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
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- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- HMKGBOLFVMRQRP-UHFFFAOYSA-N tribenzyl(phenyl)azanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(CC=1C=CC=CC=1)CC1=CC=CC=C1 HMKGBOLFVMRQRP-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- ULNJZOIDTANZKR-UHFFFAOYSA-N tris[4-(4-acetylphenyl)sulfanylphenyl]sulfanium Chemical compound C1=CC(C(=O)C)=CC=C1SC1=CC=C([S+](C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=C1 ULNJZOIDTANZKR-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP2019007085 | 2019-01-18 | ||
| JP2019007085 | 2019-01-18 | ||
| PCT/JP2020/001255 WO2020149360A1 (ja) | 2019-01-18 | 2020-01-16 | 硬化物及び有機ｅｌ表示素子 |
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| JPWO2020149360A1 true JPWO2020149360A1 (ja) | 2021-11-25 |
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| JP2020512072A Pending JPWO2020149360A1 (ja) | 2019-01-18 | 2020-01-16 | 硬化物及び有機ｅｌ表示素子 |
Country Status (3)
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|---|---|
| JP (1) | JPWO2020149360A1 (ko) |
| KR (1) | KR20210116426A (ko) |
| WO (1) | WO2020149360A1 (ko) |
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| JP2014148650A (ja) * | 2013-02-04 | 2014-08-21 | Bridgestone Corp | 光硬化性エラストマー組成物、シール材、ハードディスクドライブ用ガスケットおよび装置 |
| JP2016066471A (ja) * | 2014-09-24 | 2016-04-28 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子封止用樹脂組成物、有機エレクトロルミネッセンス表示素子封止用樹脂シート、及び、有機エレクトロルミネッセンス表示素子 |
| JP2016160343A (ja) * | 2015-03-02 | 2016-09-05 | 富士フイルム株式会社 | 粘着シート、粘着フィルム、有機発光装置、および、粘着剤組成物 |
| WO2018151002A1 (ja) * | 2017-02-14 | 2018-08-23 | 積水化学工業株式会社 | 光硬化性樹脂組成物、有機ｅｌ表示素子用封止剤、有機ｅｌ表示素子、量子ドットデバイス用封止剤、及び、量子ドットデバイス |
| JP2019094485A (ja) * | 2017-11-24 | 2019-06-20 | デクセリアルズ株式会社 | 光硬化性樹脂組成物、及び画像表示装置の製造方法 |
| JP2019157029A (ja) * | 2018-03-15 | 2019-09-19 | 株式会社カネカ | ポリイソブチレン系重合体を含有する粘着剤組成物 |
| JP6590269B1 (ja) * | 2018-09-27 | 2019-10-16 | パナソニックＩｐマネジメント株式会社 | 有機ｅｌ素子封止用紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法、有機ｅｌ発光装置、及びタッチパネル |
| JP2019189769A (ja) * | 2018-04-26 | 2019-10-31 | 四国化成工業株式会社 | 光学素子封止用硬化性組成物及び光学素子封止用シート並びに光学素子装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6098091B2 (ja) | 2012-09-26 | 2017-03-22 | 凸版印刷株式会社 | 有機エレクトロルミネッセンスパネルの製造方法 |
-
2020
- 2020-01-16 WO PCT/JP2020/001255 patent/WO2020149360A1/ja active Application Filing
- 2020-01-16 KR KR1020217012039A patent/KR20210116426A/ko unknown
- 2020-01-16 JP JP2020512072A patent/JPWO2020149360A1/ja active Pending
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| WO2014017524A1 (ja) * | 2012-07-26 | 2014-01-30 | 電気化学工業株式会社 | 樹脂組成物 |
| JP2014148650A (ja) * | 2013-02-04 | 2014-08-21 | Bridgestone Corp | 光硬化性エラストマー組成物、シール材、ハードディスクドライブ用ガスケットおよび装置 |
| JP2016066471A (ja) * | 2014-09-24 | 2016-04-28 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子封止用樹脂組成物、有機エレクトロルミネッセンス表示素子封止用樹脂シート、及び、有機エレクトロルミネッセンス表示素子 |
| JP2016160343A (ja) * | 2015-03-02 | 2016-09-05 | 富士フイルム株式会社 | 粘着シート、粘着フィルム、有機発光装置、および、粘着剤組成物 |
| WO2018151002A1 (ja) * | 2017-02-14 | 2018-08-23 | 積水化学工業株式会社 | 光硬化性樹脂組成物、有機ｅｌ表示素子用封止剤、有機ｅｌ表示素子、量子ドットデバイス用封止剤、及び、量子ドットデバイス |
| JP2019094485A (ja) * | 2017-11-24 | 2019-06-20 | デクセリアルズ株式会社 | 光硬化性樹脂組成物、及び画像表示装置の製造方法 |
| JP2019157029A (ja) * | 2018-03-15 | 2019-09-19 | 株式会社カネカ | ポリイソブチレン系重合体を含有する粘着剤組成物 |
| JP2019189769A (ja) * | 2018-04-26 | 2019-10-31 | 四国化成工業株式会社 | 光学素子封止用硬化性組成物及び光学素子封止用シート並びに光学素子装置 |
| JP6590269B1 (ja) * | 2018-09-27 | 2019-10-16 | パナソニックＩｐマネジメント株式会社 | 有機ｅｌ素子封止用紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法、有機ｅｌ発光装置、及びタッチパネル |
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