JPWO2020137342A1 - 配線基板、それを用いた発光装置及び表示装置 - Google Patents
配線基板、それを用いた発光装置及び表示装置 Download PDFInfo
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- JPWO2020137342A1 JPWO2020137342A1 JP2020562968A JP2020562968A JPWO2020137342A1 JP WO2020137342 A1 JPWO2020137342 A1 JP WO2020137342A1 JP 2020562968 A JP2020562968 A JP 2020562968A JP 2020562968 A JP2020562968 A JP 2020562968A JP WO2020137342 A1 JPWO2020137342 A1 JP WO2020137342A1
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- 239000000758 substrate Substances 0.000 claims abstract description 87
- 239000011159 matrix material Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 abstract description 62
- 238000007689 inspection Methods 0.000 abstract description 20
- 239000011347 resin Substances 0.000 description 40
- 229920005989 resin Polymers 0.000 description 40
- 239000004020 conductor Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000005338 frosted glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
1a 第1の面
1b 第2の面
1h 辺部
1s 側面
2p 入力電極
6 駆動素子
14 発光素子
55 絶縁層
55a 切欠部
55ae 延在部
55ai 入口
55ak 拡幅部
55ao 奥行部
55h 絶縁層の端
55k 開口
60 側面配線
61 検査用電極
Claims (7)
- 第1の面と前記第1の面と反対側の第2の面と側面を有する基板と、
前記第1の面の辺部に配置された電極と、
前記基板上に配置された絶縁層と、
前記電極から前記側面を経て前記第2の面の側にわたって配置された側面配線と、を備える配線基板であって、
前記辺部における前記絶縁層の端に、前記絶縁層の奥の側に突出する切欠部があり、
前記切欠部は、入口の側に前記電極が配置されており、奥の側に前記電極が存在しない奥行部がある配線基板。 - 前記切欠部は、前記入口に拡幅部がある請求項1に記載の配線基板。
- 前記電極は、その全体が前記切欠部の中にある請求項1または2に記載の配線基板。
- 前記辺部を平面視したときに前記絶縁層の端が前記側面に達していない請求項1〜3のいずれか1項に記載の配線基板。
- 前記切欠部は、前記奥行部に前記辺部に平行な方向に延在する延在部がある請求項1〜4のいずれか1項に記載の配線基板。
- 請求項1〜5のいずれか1項に記載の配線基板を備える発光装置であって、
前記電極に接続される発光素子が前記第1の面の側に配置されており、
前記第2の面の側に、前記側面配線を介して前記発光素子に接続された駆動部が配置されている発光装置。 - 請求項1〜5のいずれか1項に記載の配線基板を備える表示装置であって、
前記電極に接続される複数の発光素子が前記第1の面の側にマトリックス状に配置されており、
前記第2の面の側に、前記側面配線を介して複数の前記発光素子に接続された駆動部が配置されている表示装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022212762A JP7449360B2 (ja) | 2018-12-26 | 2022-12-28 | 配線基板、それを用いた発光装置及び表示装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018243165 | 2018-12-26 | ||
JP2018243165 | 2018-12-26 | ||
PCT/JP2019/046599 WO2020137342A1 (ja) | 2018-12-26 | 2019-11-28 | 配線基板、それを用いた発光装置及び表示装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022212762A Division JP7449360B2 (ja) | 2018-12-26 | 2022-12-28 | 配線基板、それを用いた発光装置及び表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020137342A1 true JPWO2020137342A1 (ja) | 2021-11-04 |
JP7204782B2 JP7204782B2 (ja) | 2023-01-16 |
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Family Applications (2)
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JP2020562968A Active JP7204782B2 (ja) | 2018-12-26 | 2019-11-28 | 配線基板、それを用いた発光装置及び表示装置 |
JP2022212762A Active JP7449360B2 (ja) | 2018-12-26 | 2022-12-28 | 配線基板、それを用いた発光装置及び表示装置 |
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JP2022212762A Active JP7449360B2 (ja) | 2018-12-26 | 2022-12-28 | 配線基板、それを用いた発光装置及び表示装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11984547B2 (ja) |
EP (1) | EP3905850A4 (ja) |
JP (2) | JP7204782B2 (ja) |
CN (1) | CN113196879B (ja) |
WO (1) | WO2020137342A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020058282A1 (en) * | 2018-09-20 | 2020-03-26 | Schreder S.A. | Light emitting device with adaptable glare class |
US11821620B2 (en) * | 2020-03-19 | 2023-11-21 | Schreder S.A. | Light emitting device with adaptable glare class |
JPWO2022054943A1 (ja) * | 2020-09-14 | 2022-03-17 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001033802A (ja) * | 1999-07-15 | 2001-02-09 | Rohm Co Ltd | 液晶表示モジュール |
JP2015133394A (ja) * | 2014-01-10 | 2015-07-23 | 住友電工プリントサーキット株式会社 | プリント回路板、及びプリント回路板の製造方法 |
US20180190631A1 (en) * | 2016-12-30 | 2018-07-05 | Lg Display Co., Ltd. | Display device and multi-screen display device using the same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3048722B2 (ja) * | 1991-12-04 | 2000-06-05 | 日本シイエムケイ株式会社 | プリント配線板 |
TW535352B (en) * | 2000-05-30 | 2003-06-01 | Alps Electric Co Ltd | Surface-mounting type electronic circuit unit |
JP2003078226A (ja) * | 2001-08-31 | 2003-03-14 | Noritake Co Ltd | 厚膜配線基板およびその製造方法 |
JP4579074B2 (ja) | 2005-07-15 | 2010-11-10 | 三菱電機株式会社 | フレキシブル回路基板及びこれを用いた表示装置 |
JP2008135574A (ja) * | 2006-11-28 | 2008-06-12 | Kyocera Corp | 配線基板およびそれを用いた半導体装置とプローブカード |
JP2012074478A (ja) * | 2010-09-28 | 2012-04-12 | Asahi Glass Co Ltd | 発光素子用基板および発光装置 |
CN105144856B (zh) * | 2013-04-26 | 2018-01-09 | 株式会社村田制作所 | 多层布线基板及其制造方法、以及探针卡用基板 |
JP6305759B2 (ja) * | 2013-12-26 | 2018-04-04 | 株式会社ジャパンディスプレイ | 表示装置 |
EP3282488A4 (en) * | 2015-04-22 | 2018-05-02 | Toppan Printing Co., Ltd. | Thin-film transistor array formation substrate, image display device substrate, and thin-film transistor array formation substrate manufacturing method |
KR20170059523A (ko) * | 2015-11-20 | 2017-05-31 | 삼성디스플레이 주식회사 | 표시 장치, 타일형 표시 장치 및 이의 제조 방법 |
-
2019
- 2019-11-28 WO PCT/JP2019/046599 patent/WO2020137342A1/ja unknown
- 2019-11-28 JP JP2020562968A patent/JP7204782B2/ja active Active
- 2019-11-28 EP EP19902436.5A patent/EP3905850A4/en active Pending
- 2019-11-28 CN CN201980083843.3A patent/CN113196879B/zh active Active
- 2019-11-28 US US17/312,870 patent/US11984547B2/en active Active
-
2022
- 2022-12-28 JP JP2022212762A patent/JP7449360B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001033802A (ja) * | 1999-07-15 | 2001-02-09 | Rohm Co Ltd | 液晶表示モジュール |
JP2015133394A (ja) * | 2014-01-10 | 2015-07-23 | 住友電工プリントサーキット株式会社 | プリント回路板、及びプリント回路板の製造方法 |
US20180190631A1 (en) * | 2016-12-30 | 2018-07-05 | Lg Display Co., Ltd. | Display device and multi-screen display device using the same |
Also Published As
Publication number | Publication date |
---|---|
EP3905850A1 (en) | 2021-11-03 |
US11984547B2 (en) | 2024-05-14 |
EP3905850A4 (en) | 2022-09-21 |
JP7204782B2 (ja) | 2023-01-16 |
CN113196879B (zh) | 2024-04-23 |
CN113196879A (zh) | 2021-07-30 |
JP7449360B2 (ja) | 2024-03-13 |
JP2023057554A (ja) | 2023-04-21 |
US20220045250A1 (en) | 2022-02-10 |
WO2020137342A1 (ja) | 2020-07-02 |
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