JPWO2020115952A1 - 静電チャック、真空処理装置及び基板処理方法 - Google Patents
静電チャック、真空処理装置及び基板処理方法 Download PDFInfo
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Abstract
Description
1a、2a…破線
5…真空処理装置
10…チャックプレート
100…排気路
10E…領域
10d、20d、50d…下面
10u、20u、50u…上面
110…溝
111、112a、112b、112c…溝部
113、113e…凸部
114…谷部
120、220、320、520…貫通孔
130、131、132a、132b、132c…堤部
20…チャック基体
30…ネジ
40、41…電極
42…電源
50…支持台
50w…側面
51…真空容器
52…防着板
55…排気機構
60…搬送機構
80…接着剤層
81…絶縁層
90…基板
91…保護層
1000…イオン注入装置
1001…イオン源
1002…質量分離器
1003…質量分離スリット
1004…加速管
1005…四重極レンズ
1006…走査器
1007…平行化装置
Claims (8)
- 基板を支持する第1面と、前記第1面とは反対側の第2面とを有するチャックプレートを具備し、前記基板を前記第1面で支持した際に前記基板と前記第1面との間において前記基板から放出されるガスを前記基板と前記第1面との間から排気する排気路が設けられた静電チャック。
- 請求項1に記載の静電チャックであって、
前記排気路は、
前記第1面に設けられた溝と、
前記溝に連通し、前記第1面から前記第2面にまで貫通する第1貫通孔と
を有する静電チャック。 - 請求項2に記載の静電チャックであって、
前記溝は、
前記チャックプレートの中心から前記チャックプレートの外に向かう方向に延在する複数の第1溝部と、
前記複数の第1溝部に交差し、前記チャックプレートの前記中心を中心として環状に形成された複数の第2溝部と
を有する静電チャック。 - 請求項1に記載の静電チャックであって、
前記排気路は、
前記第1面に設けられた線状の堤部と、
前記第1面から前記第2面にまで貫通する第1貫通孔と
を有する静電チャック。 - 請求項1〜4のいずれか1つに記載の静電チャックであって、
前記第1面に、複数の凸部と、前記複数の凸部を囲む環状の凸部とが設けられ、
前記複数の凸部の前記第1面からの高さが前記環状の凸部の高さ以下に構成されている
静電チャック。 - 請求項1〜5のいずれか1つに記載の静電チャックであって、
前記チャックプレートの前記第2面に対向する第3面と、前記第3面と反対側の第4面とを有するチャック基体をさらに具備し、
前記チャック基体には、前記第3面から前記第4面にまで貫通する第2貫通孔が設けられ、前記第2貫通孔が前記第1貫通孔に連通可能に構成された
静電チャック。 - 真空容器と、
前記真空容器に収容され、基板を支持する第1面と、前記第1面とは反対側の第2面とを有するチャックプレートを具備し、前記基板を前記第1面で支持した際に前記基板と前記第1面との間において前記基板から放出されるガスを前記基板と前記第1面との間から排気する排気路が設けられた静電チャックと、
前記真空容器に収容され、前記静電チャックを支持する第5面と、前記第5面とは反対側の第6面とを有する支持台と、
前記支持台を囲み、前記静電チャックが配置される第1領域と、前記支持台が配置される第2領域とに前記真空容器の内部を区画する防着板と、
を具備し、
前記支持台には、前記排気路を通じて導かれた前記ガスを前記第2領域にまで排気する別の排気路が設けられている真空処理装置。 - 基板を支持する第1面と、前記第1面とは反対側の第2面とを有し、弾性体で構成されたチャックプレートを具備し、前記基板を前記第1面で支持した際に前記基板と前記第1面との間において前記基板から放出されるガスを前記基板と前記第1面との間から排気する排気路が前記チャックプレートに設けられた静電チャックを準備し、
凸状のエンボス加工により複数の凸部が形成された前記第1面に前記基板を載置し、
前記第1面に前記基板を静電吸着することにより、前記第1面に前記基板が載置されたときの前記複数の凸部の前記第1面からの高さh0を前記高さh0よりも低い高さh1に調整し、
前記基板にプロセス加工を施し、
前記静電吸着を緩和することにより、前記プロセス加工中に発した前記ガスを前記基板と前記第1面との間から排気する
基板処理方法。
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JP2018228266 | 2018-12-05 | ||
JP2018228266 | 2018-12-05 | ||
PCT/JP2019/031443 WO2020115952A1 (ja) | 2018-12-05 | 2019-08-08 | 静電チャック、真空処理装置及び基板処理方法 |
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JP5035884B2 (ja) * | 2007-03-27 | 2012-09-26 | 東京エレクトロン株式会社 | 熱伝導シート及びこれを用いた被処理基板の載置装置 |
US8540819B2 (en) * | 2008-03-21 | 2013-09-24 | Ngk Insulators, Ltd. | Ceramic heater |
JP6010433B2 (ja) * | 2012-11-15 | 2016-10-19 | 東京エレクトロン株式会社 | 基板載置台および基板処理装置 |
KR102139682B1 (ko) * | 2013-08-05 | 2020-07-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 얇은 기판 취급을 위한 정전 캐리어 |
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JP2018085408A (ja) * | 2016-11-22 | 2018-05-31 | 株式会社ディスコ | 減圧処理装置 |
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JP2003282690A (ja) * | 2002-03-25 | 2003-10-03 | Toto Ltd | 静電チャック |
JP2012216774A (ja) * | 2011-04-01 | 2012-11-08 | Hitachi Kokusai Electric Inc | 基板処理装置、半導体装置の製造方法、基板処理方法及びサセプタカバー |
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