JPWO2020100769A1 - 電子装置 - Google Patents
電子装置 Download PDFInfo
- Publication number
- JPWO2020100769A1 JPWO2020100769A1 JP2020555650A JP2020555650A JPWO2020100769A1 JP WO2020100769 A1 JPWO2020100769 A1 JP WO2020100769A1 JP 2020555650 A JP2020555650 A JP 2020555650A JP 2020555650 A JP2020555650 A JP 2020555650A JP WO2020100769 A1 JPWO2020100769 A1 JP WO2020100769A1
- Authority
- JP
- Japan
- Prior art keywords
- heat storage
- storage material
- heat
- electronic device
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005338 heat storage Methods 0.000 claims abstract description 160
- 239000011232 storage material Substances 0.000 claims description 128
- 239000000203 mixture Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 230000005855 radiation Effects 0.000 claims description 16
- 239000000463 material Substances 0.000 abstract description 7
- 150000001875 compounds Chemical class 0.000 description 45
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 19
- -1 oxypropylene group Chemical group 0.000 description 19
- 239000003795 chemical substances by application Substances 0.000 description 16
- 239000002775 capsule Substances 0.000 description 13
- 238000009434 installation Methods 0.000 description 10
- 239000007788 liquid Substances 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- 229920003319 Araldite® Polymers 0.000 description 9
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 9
- 125000003700 epoxy group Chemical group 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 125000000962 organic group Chemical group 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 150000002484 inorganic compounds Chemical class 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 125000006353 oxyethylene group Chemical group 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000002981 blocking agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000012169 petroleum derived wax Substances 0.000 description 1
- 235000019381 petroleum wax Nutrition 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 125000006239 protecting group Chemical group 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (12)
- 回路基板と、
前記回路基板の一方面側に設けられた電子部品と、
前記回路基板及び前記電子部品を収容する筐体と、
前記電子部品で発生する熱を蓄熱可能なように設けられた蓄熱材と、を備える電子装置。 - 前記蓄熱材が、前記回路基板及び前記筐体の少なくとも一方に接するように設けられている、請求項1に記載の電子装置。
- 前記蓄熱材が、前記回路基板に接するように設けられている、請求項1又は2に記載の電子装置。
- 前記蓄熱材が、前記回路基板の前記電子部品が設けられている側の面に接するように設けられている、請求項1〜3のいずれか一項に記載の電子装置。
- 前記蓄熱材が、前記回路基板の前記電子部品が設けられている側と反対側の面に接するように設けられている、請求項1〜4のいずれか一項に記載の電子装置。
- 前記蓄熱材が、前記筐体に接するように設けられている、請求項1〜5のいずれか一項に記載の電子装置。
- 前記蓄熱材が、前記筐体の内面に接するように設けられている、請求項1〜6のいずれか一項に記載の電子装置。
- 前記蓄熱材が、前記筐体の外面に接するように設けられている、請求項1〜7のいずれか一項に記載の電子装置。
- 前記電子部品を覆うように前記回路基板上に設けられた樹脂部材を更に備え、
前記蓄熱材が、前記樹脂部材に接するように設けられている、請求項1〜8のいずれか一項に記載の電子装置。 - 前記筐体の内部又は外部に設けられた放熱フィンを更に備え、
前記蓄熱材が、前記放熱フィンに接するように設けられている、請求項1〜9のいずれか一項に記載の電子装置。 - 前記蓄熱材が、硬化性成分を含有する組成物の硬化物である、請求項1〜10のいずれか一項に記載の電子装置。
- 前記電子装置がエンジンコントロールユニットである、請求項1〜11のいずれか一項に記載の電子装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018213549 | 2018-11-14 | ||
JP2018213549 | 2018-11-14 | ||
PCT/JP2019/043994 WO2020100769A1 (ja) | 2018-11-14 | 2019-11-08 | 電子装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2020100769A1 true JPWO2020100769A1 (ja) | 2021-10-14 |
Family
ID=70730522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020555650A Pending JPWO2020100769A1 (ja) | 2018-11-14 | 2019-11-08 | 電子装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2020100769A1 (ja) |
WO (1) | WO2020100769A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08148618A (ja) * | 1994-11-22 | 1996-06-07 | Hitachi Ltd | 放熱構造 |
JPH10135381A (ja) * | 1996-10-25 | 1998-05-22 | Nec Corp | 潜熱利用型ヒートシンク |
JP2003142864A (ja) * | 2001-11-01 | 2003-05-16 | Hitachi Ltd | 電子装置 |
JP2005129820A (ja) * | 2003-10-27 | 2005-05-19 | Mitsubishi Electric Corp | 電子回路装置 |
WO2013014718A1 (ja) * | 2011-07-26 | 2013-01-31 | パナソニック株式会社 | 電子機器 |
JP2015029036A (ja) * | 2013-06-27 | 2015-02-12 | ソニー株式会社 | 電子機器および電子機器の制御方法 |
JP2018170745A (ja) * | 2017-03-30 | 2018-11-01 | キヤノン株式会社 | 撮像装置 |
-
2019
- 2019-11-08 JP JP2020555650A patent/JPWO2020100769A1/ja active Pending
- 2019-11-08 WO PCT/JP2019/043994 patent/WO2020100769A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08148618A (ja) * | 1994-11-22 | 1996-06-07 | Hitachi Ltd | 放熱構造 |
JPH10135381A (ja) * | 1996-10-25 | 1998-05-22 | Nec Corp | 潜熱利用型ヒートシンク |
JP2003142864A (ja) * | 2001-11-01 | 2003-05-16 | Hitachi Ltd | 電子装置 |
JP2005129820A (ja) * | 2003-10-27 | 2005-05-19 | Mitsubishi Electric Corp | 電子回路装置 |
WO2013014718A1 (ja) * | 2011-07-26 | 2013-01-31 | パナソニック株式会社 | 電子機器 |
JP2015029036A (ja) * | 2013-06-27 | 2015-02-12 | ソニー株式会社 | 電子機器および電子機器の制御方法 |
JP2018170745A (ja) * | 2017-03-30 | 2018-11-01 | キヤノン株式会社 | 撮像装置 |
Also Published As
Publication number | Publication date |
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WO2020100769A1 (ja) | 2020-05-22 |
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