JPWO2020059061A1 - 超音波振動接合装置 - Google Patents
超音波振動接合装置 Download PDFInfo
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- 230000007246 mechanism Effects 0.000 claims description 61
- 238000003825 pressing Methods 0.000 claims description 55
- 239000000758 substrate Substances 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 16
- 238000001514 detection method Methods 0.000 claims description 12
- 230000003028 elevating effect Effects 0.000 abstract description 79
- 238000000034 method Methods 0.000 description 21
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- 238000010586 diagram Methods 0.000 description 8
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- 230000015572 biosynthetic process Effects 0.000 description 2
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- 239000010409 thin film Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/746—Joining plastics material to non-plastics material to inorganic materials not provided for in groups B29C66/742 - B29C66/744
- B29C66/7465—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/9241—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force or the mechanical power
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L21/607—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
- H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/922—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/9221—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force or the mechanical power
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Sustainable Energy (AREA)
- Electromagnetism (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
(基本構成)
図1はこの発明の実施の形態1である超音波振動接合装置の構造を模式的に示す説明図である。図2は実施の形態1の超音波振動接合装置の構造の一部を模式的に示す説明図である。図1及び図2それぞれにXYZ直交座標系を記している。図1はXZ平面から視た正面図に相当し、図2はYZ平面から視た側面図に相当する。
図3は実施の形態1の超音波振動接合装置の制御系を模式的に示すブロック図である。同図に示すように、実施の形態1の超音波振動接合装置は制御部15をさらに有している。制御部15は、昇降用サーボモータ2、エアシリンダ4、超音波接合用ヘッド部6内の超音波振動子17及び駆動部19の駆動を制御する制御動作を実行する。
このように、実施の形態1の超音波振動接合装置は、エアシリンダ4内におけるピストン25の高さ方向(Z方向)における高さ位置が、所定位置であるか所定位置より高い位置にあるかを検出可能な位置検出部7を設けることにより、ステップS3の実行後において上記接合部接触状態の有無を迅速、かつ正確に認識することができる。
(基本構成)
図6はこの発明の実施の形態2である超音波振動接合装置の構造を模式的に示す説明図である。図6にXYZ直交座標系を記している。
図7は実施の形態2の超音波振動接合装置の制御系を模式的に示すブロック図である。図7に示すように、実施の形態2において、制御部15Xは、昇降用サーボモータ2X、エアシリンダ41〜43、超音波接合用ヘッド部61〜63それぞれ内の超音波振動子17及び駆動部19Xの駆動を制御する制御動作を実行している。
このように、実施の形態2の超音波振動接合装置は、エアシリンダ41〜43それぞれに位置検出部7を設けることにより、ステップS13の実行後において上記全体接合部接触状態を迅速、かつ正確に認識することができる。
この発明は詳細に説明されたが、上記した説明は、すべての局面において、例示であって、この発明がそれに限定されるものではない。例示されていない無数の変形例が、この発明の範囲から外れることなく想定され得るものと解される。
2,2X 昇降用サーボモータ
3 昇降用スライダ
4,41〜43 エアシリンダ
5,51〜53 加圧用スライダ
6,61〜63 超音波接合用ヘッド部
7 位置検出部
11 3ヘッド走行フレーム
13 共通昇降用スライダ
16 超音波ホーン
16a 超音波接合部
17 超音波振動子
30 テーブル
31 ガラス基板
33 電極
Claims (6)
- 接合対象物(31,33)を載置するテーブル(30)と、
超音波接合部(16a)から超音波振動を印加する超音波振動動作を実行する超音波接合用ヘッド部(6,61〜63)と、
前記超音波接合用ヘッド部に連結され、前記超音波接合用ヘッド部に対し前記テーブル側に向けて加圧する加圧動作を実行する加圧機構(4,41〜43)と、
前記超音波接合用ヘッド部及び前記加圧機構を一括して下降させる下降動作を実行する下降機構(2,2X)と、
前記超音波接合用ヘッド部による前記超音波振動動作、前記加圧機構による前記加圧動作、及び前記下降機構による前記下降動作を制御する制御動作を実行する制御部(15)とを備える、
超音波振動接合装置。 - 請求項1記載の超音波振動接合装置であって、
前記加圧機構はエアシリンダを含み、前記エアシリンダはピストンロッドを介して前記超音波接合用ヘッド部に連結され、
前記エアシリンダのピストンロッドから前記超音波接合用ヘッド部に加圧用押圧力が付与される、
超音波振動接合装置。 - 請求項2記載の超音波振動接合装置であって、
前記制御部は、
前記下降機構は下降用押圧力(F1)で前記下降動作を実行し、
前記加圧機構は前記加圧用押圧力(F2,F21〜F23)で前記加圧動作を実行し、
前記下降用押圧力は前記加圧用押圧力よりも大きくなるように設定され、
前記制御部が実行する前記制御動作は、
(a) 前記超音波接合用ヘッド部の前記超音波接合部が前記接合対象物の印加部の上方に位置するように配置するステップと、
(b) 前記加圧機構に前記加圧動作を実行させるステップと、
(c) 前記下降機構に前記下降動作を実行させるステップと、
(d) 前記接合対象物の印加部に前記超音波接合部が接触する接合部接触状態の認識をトリガとして、前記超音波接合用ヘッド部に前記超音波振動動作を実行させるステップとを含む、
超音波振動接合装置。 - 請求項3記載の超音波振動接合装置であって、
前記エアシリンダは、内部のピストンの位置を検知する位置検出部(7)をさらに有する、
超音波振動接合装置。 - 請求項1から請求項4のうち、いずれか1項に記載の超音波振動接合装置であって、
前記超音波接合用ヘッド部は複数の超音波接合用ヘッド部(61〜63)を含み、
前記加圧機構は、前記複数の超音波接合用ヘッド部に対応して設けられる、複数の加圧機構(41〜43)を含み、
前記下降機構(2X)が実行する前記下降動作は、前記複数の超音波接合用ヘッド部及び前記複数の加圧機構を一括して下降させる複数一括下降動作を含む、
超音波振動接合装置。 - 請求項1から請求項5のうち、いずれか1項に記載の超音波振動接合装置であって、
前記接合対象物は、
ガラス基板(31)と、
前記ガラス基板上に配置される電極(33)とを含む、
超音波振動接合装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2018/034713 WO2020059061A1 (ja) | 2018-09-20 | 2018-09-20 | 超音波振動接合装置 |
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JP6763090B1 JP6763090B1 (ja) | 2020-09-30 |
JPWO2020059061A1 true JPWO2020059061A1 (ja) | 2020-12-17 |
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US (1) | US11214017B2 (ja) |
EP (1) | EP3654368A4 (ja) |
JP (1) | JP6763090B1 (ja) |
KR (1) | KR102397667B1 (ja) |
CN (1) | CN111201591B (ja) |
AU (1) | AU2018422116B2 (ja) |
TW (1) | TWI741293B (ja) |
WO (1) | WO2020059061A1 (ja) |
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CN114178671A (zh) * | 2021-12-21 | 2022-03-15 | 上海骄成超声波技术股份有限公司 | 一种晶体管超声波焊接方法及焊接装置 |
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AU512199B2 (en) * | 1976-10-08 | 1980-09-25 | Ex-Cell-O Corporation | Vibration sealing of plastic carton |
DE29713448U1 (de) * | 1997-07-29 | 1997-10-23 | Spaichingen Gmbh Maschf | Vorrichtung zur Ultraschallbearbeitung von Werkstücken |
JP3447982B2 (ja) * | 1999-06-16 | 2003-09-16 | 株式会社アルテクス | 超音波振動接合装置 |
DE20019000U1 (de) * | 2000-11-08 | 2001-01-18 | Spaichingen Gmbh Maschf | Vorrichtung zur Ultraschallbearbeitung von Werkstücken |
JP4548059B2 (ja) * | 2004-09-16 | 2010-09-22 | 株式会社村田製作所 | 超音波接合方法および超音波接合装置 |
JP4950478B2 (ja) * | 2005-11-15 | 2012-06-13 | ボンドテック株式会社 | 加圧方法およびこの方法を用いた接合方法並びにこの接合方法により作成されるデバイス並びに加圧装置およびこの装置を用いた接合装置 |
JP2009246185A (ja) * | 2008-03-31 | 2009-10-22 | Toray Eng Co Ltd | 超音波接合装置および超音波接合方法 |
JP5275917B2 (ja) * | 2009-06-23 | 2013-08-28 | 東芝三菱電機産業システム株式会社 | 加圧式超音波振動接合方法および加圧式超音波振動接合装置 |
JP5476891B2 (ja) * | 2009-09-29 | 2014-04-23 | 日本テキサス・インスツルメンツ株式会社 | 超音波フリップチップ実装方法および超音波実装装置 |
DE102014112675B4 (de) * | 2013-09-06 | 2021-06-10 | GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) | Ultraschall-Schweißsystem, Ultraschall-Schweißverfahren und computerlesbare Speichervorrichtung zur adaptiven Prozesssteuerung mithilfe eines Soll-Kinematikprofils beim Zusammenschweissen von mehreren polymeren Werkstücken |
CN105172128B (zh) * | 2015-08-28 | 2018-02-09 | 武汉泰宇汽车零部件有限公司 | 多焊头超声波焊接机 |
KR102100067B1 (ko) * | 2015-09-29 | 2020-04-10 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 초음파 진동 접합 장치 |
CN108000909B (zh) * | 2017-12-13 | 2024-02-09 | 广州明森科技股份有限公司 | 一种非接触智能卡制造生产线 |
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- 2018-09-20 EP EP18925053.3A patent/EP3654368A4/en active Pending
- 2018-09-20 AU AU2018422116A patent/AU2018422116B2/en active Active
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- 2018-09-20 US US16/610,139 patent/US11214017B2/en active Active
- 2018-09-20 CN CN201880063096.2A patent/CN111201591B/zh active Active
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Publication number | Publication date |
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TWI741293B (zh) | 2021-10-01 |
US11214017B2 (en) | 2022-01-04 |
EP3654368A1 (en) | 2020-05-20 |
EP3654368A4 (en) | 2021-03-17 |
CN111201591B (zh) | 2023-02-21 |
AU2018422116B2 (en) | 2021-05-27 |
CN111201591A (zh) | 2020-05-26 |
KR102397667B1 (ko) | 2022-05-16 |
TW202012087A (zh) | 2020-04-01 |
JP6763090B1 (ja) | 2020-09-30 |
AU2018422116A9 (en) | 2021-05-13 |
US20200156328A1 (en) | 2020-05-21 |
KR20200044954A (ko) | 2020-04-29 |
AU2018422116A1 (en) | 2020-04-09 |
WO2020059061A1 (ja) | 2020-03-26 |
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