JPWO2019230607A1 - 電子機器及び電磁波シールド性放熱シート - Google Patents

電子機器及び電磁波シールド性放熱シート Download PDF

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Publication number
JPWO2019230607A1
JPWO2019230607A1 JP2020511834A JP2020511834A JPWO2019230607A1 JP WO2019230607 A1 JPWO2019230607 A1 JP WO2019230607A1 JP 2020511834 A JP2020511834 A JP 2020511834A JP 2020511834 A JP2020511834 A JP 2020511834A JP WO2019230607 A1 JPWO2019230607 A1 JP WO2019230607A1
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JP
Japan
Prior art keywords
resin layer
conductive resin
heat dissipation
electromagnetic wave
dissipation sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020511834A
Other languages
English (en)
Japanese (ja)
Inventor
和幸 五十嵐
和幸 五十嵐
剛介 中島
剛介 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2019230607A1 publication Critical patent/JPWO2019230607A1/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2020511834A 2018-05-29 2019-05-24 電子機器及び電磁波シールド性放熱シート Pending JPWO2019230607A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018102144 2018-05-29
JP2018102144 2018-05-29
PCT/JP2019/020743 WO2019230607A1 (ja) 2018-05-29 2019-05-24 電子機器及び電磁波シールド性放熱シート

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020145961A Division JP2021005715A (ja) 2018-05-29 2020-08-31 電子機器及び電磁波シールド性放熱シート

Publications (1)

Publication Number Publication Date
JPWO2019230607A1 true JPWO2019230607A1 (ja) 2020-07-02

Family

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Family Applications (3)

Application Number Title Priority Date Filing Date
JP2020511834A Pending JPWO2019230607A1 (ja) 2018-05-29 2019-05-24 電子機器及び電磁波シールド性放熱シート
JP2020145961A Pending JP2021005715A (ja) 2018-05-29 2020-08-31 電子機器及び電磁波シールド性放熱シート
JP2021111563A Active JP7351874B2 (ja) 2018-05-29 2021-07-05 電子機器及び電磁波シールド性放熱シート

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2020145961A Pending JP2021005715A (ja) 2018-05-29 2020-08-31 電子機器及び電磁波シールド性放熱シート
JP2021111563A Active JP7351874B2 (ja) 2018-05-29 2021-07-05 電子機器及び電磁波シールド性放熱シート

Country Status (3)

Country Link
JP (3) JPWO2019230607A1 (https=)
TW (1) TW202003236A (https=)
WO (1) WO2019230607A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111136851B (zh) * 2019-12-31 2021-10-26 九牧厨卫股份有限公司 一种高强度耐腐蚀制品及其制备方法
JP6805382B1 (ja) * 2020-03-30 2020-12-23 Ｊｘ金属株式会社 電磁波シールド材
CN111315197A (zh) * 2020-04-02 2020-06-19 深圳市龙航科技有限公司 一种带有散热结构的车载导航仪
WO2023008538A1 (ja) * 2021-07-29 2023-02-02 積水ポリマテック株式会社 熱伝導性組成物及び硬化物
JP7771709B2 (ja) * 2021-12-14 2025-11-18 オムロン株式会社 実装基板、及び実装基板を搭載した電気機器
JP2023115732A (ja) * 2022-02-08 2023-08-21 株式会社レゾナック 放熱構造形成用部材、電子装置の製造方法、及び、電子装置
CN114628368B (zh) * 2022-03-10 2022-11-11 深圳市赛元微电子股份有限公司 一种芯片电路模块的电磁屏蔽装置
WO2023190440A1 (ja) * 2022-03-29 2023-10-05 デンカ株式会社 二液硬化型組成物セット、硬化物及び電子機器
TW202419283A (zh) 2022-07-22 2024-05-16 日商拓自達電線股份有限公司 散熱片

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001189582A (ja) * 1999-12-28 2001-07-10 Kitagawa Ind Co Ltd 電子部品用放熱体
JP2003224386A (ja) * 2002-01-31 2003-08-08 Toyota Motor Corp 自動車用電子装置及び自動車用電子装置用ハウジング
JP2015153743A (ja) * 2014-02-19 2015-08-24 日立建機株式会社 蓄電装置及びこれを搭載した作業機械
JP2016186972A (ja) * 2015-03-27 2016-10-27 東レ株式会社 電磁波シールドシート、それを硬化させてなる硬化膜、金属箔積層電磁波シールドシートの製造方法、積層体および半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02102452U (https=) * 1989-02-02 1990-08-15
JP3498823B2 (ja) * 1996-04-30 2004-02-23 電気化学工業株式会社 放熱スペーサーおよびその用途
JP3372462B2 (ja) * 1997-11-27 2003-02-04 電気化学工業株式会社 ゴムシートの製造方法
JPH11317591A (ja) * 1998-05-07 1999-11-16 Porimatec Kk 熱伝導性電磁波シールドシート
JP2002194306A (ja) * 2000-12-26 2002-07-10 Sekisui Chem Co Ltd 熱伝導性シート
JP2005228955A (ja) * 2004-02-13 2005-08-25 Denki Kagaku Kogyo Kk 放熱部材、その製造方法及び用途
JP4798629B2 (ja) * 2006-11-13 2011-10-19 北川工業株式会社 熱伝導性電磁波シールドシート及び電磁波シールド構造
JP2012059811A (ja) * 2010-09-07 2012-03-22 Mochida Shoko Kk 放熱シート
JP5749536B2 (ja) * 2011-03-28 2015-07-15 電気化学工業株式会社 熱伝導性成形体とその用途
JP2017112144A (ja) * 2015-12-14 2017-06-22 富士通株式会社 電子装置、熱伝導部材、及び電子装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001189582A (ja) * 1999-12-28 2001-07-10 Kitagawa Ind Co Ltd 電子部品用放熱体
JP2003224386A (ja) * 2002-01-31 2003-08-08 Toyota Motor Corp 自動車用電子装置及び自動車用電子装置用ハウジング
JP2015153743A (ja) * 2014-02-19 2015-08-24 日立建機株式会社 蓄電装置及びこれを搭載した作業機械
JP2016186972A (ja) * 2015-03-27 2016-10-27 東レ株式会社 電磁波シールドシート、それを硬化させてなる硬化膜、金属箔積層電磁波シールドシートの製造方法、積層体および半導体装置

Also Published As

Publication number Publication date
JP2021177561A (ja) 2021-11-11
TW202003236A (zh) 2020-01-16
JP2021005715A (ja) 2021-01-14
WO2019230607A1 (ja) 2019-12-05
JP7351874B2 (ja) 2023-09-27

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