JPWO2019186315A5 - - Google Patents
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- Publication number
- JPWO2019186315A5 JPWO2019186315A5 JP2020510161A JP2020510161A JPWO2019186315A5 JP WO2019186315 A5 JPWO2019186315 A5 JP WO2019186315A5 JP 2020510161 A JP2020510161 A JP 2020510161A JP 2020510161 A JP2020510161 A JP 2020510161A JP WO2019186315 A5 JPWO2019186315 A5 JP WO2019186315A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal oxide
- region
- insulating layer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 30
- 229910044991 metal oxide Inorganic materials 0.000 claims 20
- 150000004706 metal oxides Chemical class 0.000 claims 20
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 2
- 229910052733 gallium Inorganic materials 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- 229910052707 ruthenium Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023037708A JP7462087B2 (ja) | 2018-03-29 | 2023-03-10 | 半導体装置 |
| JP2024047811A JP7686827B2 (ja) | 2018-03-29 | 2024-03-25 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018064931 | 2018-03-29 | ||
| JP2018064931 | 2018-03-29 | ||
| PCT/IB2019/052105 WO2019186315A1 (ja) | 2018-03-29 | 2019-03-15 | 半導体装置、および半導体装置の作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023037708A Division JP7462087B2 (ja) | 2018-03-29 | 2023-03-10 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2019186315A1 JPWO2019186315A1 (ja) | 2021-04-15 |
| JPWO2019186315A5 true JPWO2019186315A5 (https=) | 2022-03-08 |
| JP7245230B2 JP7245230B2 (ja) | 2023-03-23 |
Family
ID=68059349
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020510161A Active JP7245230B2 (ja) | 2018-03-29 | 2019-03-15 | 半導体装置、および半導体装置の作製方法 |
| JP2023037708A Active JP7462087B2 (ja) | 2018-03-29 | 2023-03-10 | 半導体装置 |
| JP2024047811A Active JP7686827B2 (ja) | 2018-03-29 | 2024-03-25 | 半導体装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023037708A Active JP7462087B2 (ja) | 2018-03-29 | 2023-03-10 | 半導体装置 |
| JP2024047811A Active JP7686827B2 (ja) | 2018-03-29 | 2024-03-25 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US11482626B2 (https=) |
| JP (3) | JP7245230B2 (https=) |
| WO (1) | WO2019186315A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11211501B2 (en) * | 2019-07-19 | 2021-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN111584426B (zh) * | 2020-05-14 | 2023-03-28 | 深圳市华星光电半导体显示技术有限公司 | 一种显示面板的制备方法、显示面板及显示装置 |
| CN114514573B (zh) * | 2021-07-30 | 2022-08-09 | 京东方科技集团股份有限公司 | 像素电路、驱动方法和显示装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080254613A1 (en) * | 2007-04-10 | 2008-10-16 | Applied Materials, Inc. | Methods for forming metal interconnect structure for thin film transistor applications |
| JP5708910B2 (ja) | 2010-03-30 | 2015-04-30 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法、並びに表示装置 |
| US8936965B2 (en) | 2010-11-26 | 2015-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US20130087784A1 (en) * | 2011-10-05 | 2013-04-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9219164B2 (en) * | 2012-04-20 | 2015-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with oxide semiconductor channel |
| CN107591316B (zh) | 2012-05-31 | 2021-06-08 | 株式会社半导体能源研究所 | 半导体装置 |
| JP6400336B2 (ja) * | 2013-06-05 | 2018-10-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US20150008428A1 (en) | 2013-07-08 | 2015-01-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| US9366953B2 (en) * | 2014-01-17 | 2016-06-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lithography mask |
| TWI702187B (zh) | 2014-02-21 | 2020-08-21 | 日商半導體能源研究所股份有限公司 | 半導體膜、電晶體、半導體裝置、顯示裝置以及電子裝置 |
| CN111048509B (zh) | 2014-03-28 | 2023-12-01 | 株式会社半导体能源研究所 | 半导体装置 |
| KR102380829B1 (ko) | 2014-04-23 | 2022-03-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치 |
| US9954112B2 (en) * | 2015-01-26 | 2018-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR102865410B1 (ko) | 2015-02-06 | 2025-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| WO2017064590A1 (en) | 2015-10-12 | 2017-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JPWO2017085591A1 (ja) | 2015-11-20 | 2018-09-06 | 株式会社半導体エネルギー研究所 | 半導体装置、該半導体装置を有する表示装置、及び該半導体装置を有する電子機器 |
| JP2017112374A (ja) * | 2015-12-16 | 2017-06-22 | 株式会社半導体エネルギー研究所 | トランジスタ、半導体装置、および電子機器 |
| WO2017153882A1 (en) | 2016-03-11 | 2017-09-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and display device including the semiconductor device |
-
2019
- 2019-03-15 US US16/982,182 patent/US11482626B2/en active Active
- 2019-03-15 JP JP2020510161A patent/JP7245230B2/ja active Active
- 2019-03-15 WO PCT/IB2019/052105 patent/WO2019186315A1/ja not_active Ceased
-
2022
- 2022-09-21 US US17/949,632 patent/US12278292B2/en active Active
-
2023
- 2023-03-10 JP JP2023037708A patent/JP7462087B2/ja active Active
-
2024
- 2024-03-25 JP JP2024047811A patent/JP7686827B2/ja active Active
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