JPWO2019186315A5 - - Google Patents

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Publication number
JPWO2019186315A5
JPWO2019186315A5 JP2020510161A JP2020510161A JPWO2019186315A5 JP WO2019186315 A5 JPWO2019186315 A5 JP WO2019186315A5 JP 2020510161 A JP2020510161 A JP 2020510161A JP 2020510161 A JP2020510161 A JP 2020510161A JP WO2019186315 A5 JPWO2019186315 A5 JP WO2019186315A5
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Japan
Prior art keywords
layer
metal oxide
region
insulating layer
semiconductor
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JP2020510161A
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English (en)
Japanese (ja)
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JPWO2019186315A1 (ja
JP7245230B2 (ja
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Priority claimed from PCT/IB2019/052105 external-priority patent/WO2019186315A1/ja
Publication of JPWO2019186315A1 publication Critical patent/JPWO2019186315A1/ja
Publication of JPWO2019186315A5 publication Critical patent/JPWO2019186315A5/ja
Priority to JP2023037708A priority Critical patent/JP7462087B2/ja
Application granted granted Critical
Publication of JP7245230B2 publication Critical patent/JP7245230B2/ja
Priority to JP2024047811A priority patent/JP7686827B2/ja
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JP2020510161A 2018-03-29 2019-03-15 半導体装置、および半導体装置の作製方法 Active JP7245230B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023037708A JP7462087B2 (ja) 2018-03-29 2023-03-10 半導体装置
JP2024047811A JP7686827B2 (ja) 2018-03-29 2024-03-25 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018064931 2018-03-29
JP2018064931 2018-03-29
PCT/IB2019/052105 WO2019186315A1 (ja) 2018-03-29 2019-03-15 半導体装置、および半導体装置の作製方法

Related Child Applications (1)

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JP2023037708A Division JP7462087B2 (ja) 2018-03-29 2023-03-10 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2019186315A1 JPWO2019186315A1 (ja) 2021-04-15
JPWO2019186315A5 true JPWO2019186315A5 (https=) 2022-03-08
JP7245230B2 JP7245230B2 (ja) 2023-03-23

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ID=68059349

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2020510161A Active JP7245230B2 (ja) 2018-03-29 2019-03-15 半導体装置、および半導体装置の作製方法
JP2023037708A Active JP7462087B2 (ja) 2018-03-29 2023-03-10 半導体装置
JP2024047811A Active JP7686827B2 (ja) 2018-03-29 2024-03-25 半導体装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023037708A Active JP7462087B2 (ja) 2018-03-29 2023-03-10 半導体装置
JP2024047811A Active JP7686827B2 (ja) 2018-03-29 2024-03-25 半導体装置

Country Status (3)

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US (2) US11482626B2 (https=)
JP (3) JP7245230B2 (https=)
WO (1) WO2019186315A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11211501B2 (en) * 2019-07-19 2021-12-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN111584426B (zh) * 2020-05-14 2023-03-28 深圳市华星光电半导体显示技术有限公司 一种显示面板的制备方法、显示面板及显示装置
CN114514573B (zh) * 2021-07-30 2022-08-09 京东方科技集团股份有限公司 像素电路、驱动方法和显示装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080254613A1 (en) * 2007-04-10 2008-10-16 Applied Materials, Inc. Methods for forming metal interconnect structure for thin film transistor applications
JP5708910B2 (ja) 2010-03-30 2015-04-30 ソニー株式会社 薄膜トランジスタおよびその製造方法、並びに表示装置
US8936965B2 (en) 2010-11-26 2015-01-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20130087784A1 (en) * 2011-10-05 2013-04-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9219164B2 (en) * 2012-04-20 2015-12-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with oxide semiconductor channel
CN107591316B (zh) 2012-05-31 2021-06-08 株式会社半导体能源研究所 半导体装置
JP6400336B2 (ja) * 2013-06-05 2018-10-03 株式会社半導体エネルギー研究所 半導体装置
US20150008428A1 (en) 2013-07-08 2015-01-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US9366953B2 (en) * 2014-01-17 2016-06-14 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography mask
TWI702187B (zh) 2014-02-21 2020-08-21 日商半導體能源研究所股份有限公司 半導體膜、電晶體、半導體裝置、顯示裝置以及電子裝置
CN111048509B (zh) 2014-03-28 2023-12-01 株式会社半导体能源研究所 半导体装置
KR102380829B1 (ko) 2014-04-23 2022-03-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 촬상 장치
US9954112B2 (en) * 2015-01-26 2018-04-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR102865410B1 (ko) 2015-02-06 2025-09-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
WO2017064590A1 (en) 2015-10-12 2017-04-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JPWO2017085591A1 (ja) 2015-11-20 2018-09-06 株式会社半導体エネルギー研究所 半導体装置、該半導体装置を有する表示装置、及び該半導体装置を有する電子機器
JP2017112374A (ja) * 2015-12-16 2017-06-22 株式会社半導体エネルギー研究所 トランジスタ、半導体装置、および電子機器
WO2017153882A1 (en) 2016-03-11 2017-09-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and display device including the semiconductor device

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