JPWO2019106762A1 - ループヒートパイプ及び電子機器 - Google Patents
ループヒートパイプ及び電子機器 Download PDFInfo
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- JPWO2019106762A1 JPWO2019106762A1 JP2019556464A JP2019556464A JPWO2019106762A1 JP WO2019106762 A1 JPWO2019106762 A1 JP WO2019106762A1 JP 2019556464 A JP2019556464 A JP 2019556464A JP 2019556464 A JP2019556464 A JP 2019556464A JP WO2019106762 A1 JPWO2019106762 A1 JP WO2019106762A1
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- 239000012530 fluid Substances 0.000 claims abstract description 71
- 239000007788 liquid Substances 0.000 claims abstract description 31
- 239000007791 liquid phase Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims description 86
- 239000002184 metal Substances 0.000 claims description 86
- 238000010030 laminating Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 abstract 1
- 230000032258 transport Effects 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000012466 permeate Substances 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Sustainable Development (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
図5は、本実施形態に係る電子機器の分解斜視図である。
本実施形態では、第1実施形態で説明した溝47の形状のバリエーションについて説明する。
Claims (9)
- 相対する第1の内側表面と第2の内側表面とを内部に備え、かつ、液相の作動流体を蒸発させる蒸発器と、
前記蒸発器の内部に設けられ、平面視で複数の歯を備えた櫛歯状の多孔質体と、
前記第1の内側表面と前記第2の内側表面のうちの少なくとも一方に設けられ、平面視で前記歯のそれぞれに重なる複数の溝と、
前記作動流体を液化する凝縮器と、
前記蒸発器と前記凝縮器とを接続すると共に、液相の前記作動流体が流れる液管と、
前記蒸発器と前記凝縮器とを接続すると共に、前記作動流体の蒸気が流れ、かつ前記液管と共にループ状の管路を形成する蒸気管と、
を有するループヒートパイプ。 - 前記蒸発器は、液相の前記作動流体が供給される供給口と、前記作動流体の蒸気を排出する排出口とを有し、
前記歯は、前記供給口から前記排出口に向かう方向に延びることを特徴とする請求項1に記載のループヒートパイプ。 - 前記供給口寄りの前記第1の内側表面と前記第2の内側表面の少なくとも一方に設けられ、複数の前記溝の各々を連結する連結溝を更に有することを特徴とする請求項2に記載のループヒートパイプ。
- 前記溝は、前記歯の先端まで延びることを特徴とする請求項1乃至請求項3のいずれかに記載のループヒートパイプ。
- 平面視において、前記液管と前記溝との間に前記多孔質体が介在することを特徴とする請求項1乃至請求項4のいずれかに記載のループヒートパイプ。
- 前記溝の幅は、前記歯の先端に向かって広くなることを特徴とする請求項1乃至請求項5のいずれかに記載のループヒートパイプ。
- 前記蒸発器、前記多孔質体、前記液管、及び前記蒸気管の各々は、第1の表面金属層、中間金属層、及び第2の表面金属層を順に積層してなり、
前記多孔質体に対応する部分の前記中間金属層に複数の孔が形成されたことを特徴とする請求項1乃至請求項6のいずれかに記載のループヒートパイプ。 - 前記孔の直径は、前記溝の幅よりも小さいことを特徴とする請求項7に記載のループヒートパイプ。
- 発熱部品と、
前記発熱部品を冷却するループヒートパイプとを備え、
前記ループヒートパイプが、
相対する第1の内側表面と第2の内側表面とを内部に備え、かつ、液相の作動流体を蒸発させる蒸発器と、
前記蒸発器の内部に設けられ、平面視で複数の歯を備えた櫛歯状の多孔質体と、
前記第1の内側表面と前記第2の内側表面のうちの少なくとも一方に設けられ、平面視で前記歯のそれぞれに重なる複数の溝と、
前記作動流体を液化する凝縮器と、
前記蒸発器と前記凝縮器とを接続すると共に、液相の前記作動流体が流れる液管と、
前記蒸発器と前記凝縮器とを接続すると共に、前記作動流体の蒸気が流れ、かつ前記液管と共にループ状の管路を形成する蒸気管とを有することを特徴とする電子機器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/042853 WO2019106762A1 (ja) | 2017-11-29 | 2017-11-29 | ループヒートパイプ及び電子機器 |
Publications (2)
Publication Number | Publication Date |
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JPWO2019106762A1 true JPWO2019106762A1 (ja) | 2020-11-19 |
JP6860086B2 JP6860086B2 (ja) | 2021-04-14 |
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Country | Link |
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US (1) | US11044830B2 (ja) |
JP (1) | JP6860086B2 (ja) |
WO (1) | WO2019106762A1 (ja) |
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JP7015197B2 (ja) * | 2018-03-26 | 2022-02-02 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
JP7204374B2 (ja) * | 2018-08-13 | 2023-01-16 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
JP6949127B2 (ja) * | 2019-04-28 | 2021-10-13 | エスゼット ディージェイアイ テクノロジー カンパニー リミテッドSz Dji Technology Co.,Ltd | 放熱アセンブリおよびアクションカメラ |
CN114305270B (zh) * | 2020-09-30 | 2023-10-27 | 广东美的厨房电器制造有限公司 | 蒸汽发生装置和具有其的蒸汽拖把 |
CN113008059B (zh) * | 2021-03-15 | 2022-06-10 | 青岛青科新钰材料科技有限公司 | 可用于电子产品的网络式铝基板多热沉板式散热器 |
CN115151119A (zh) * | 2021-03-29 | 2022-10-04 | 北京小米移动软件有限公司 | 电子设备 |
EP4123702A1 (en) * | 2021-07-20 | 2023-01-25 | Nokia Technologies Oy | Apparatus for cooling electronic circuitry components and photonic components |
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- 2017-11-29 WO PCT/JP2017/042853 patent/WO2019106762A1/ja active Application Filing
- 2017-11-29 JP JP2019556464A patent/JP6860086B2/ja active Active
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Patent Citations (8)
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JP2011204851A (ja) * | 2010-03-25 | 2011-10-13 | Fujitsu Ltd | ループ型ヒートパイプおよび電子機器 |
JP2012043954A (ja) * | 2010-08-18 | 2012-03-01 | Fujitsu Ltd | 半導体装置 |
JP2013072627A (ja) * | 2011-09-29 | 2013-04-22 | Fujitsu Ltd | ループ型ヒートパイプ及び電子機器 |
WO2015087451A1 (ja) * | 2013-12-13 | 2015-06-18 | 富士通株式会社 | ループ型ヒートパイプとその製造方法、及び電子機器 |
JP2015200465A (ja) * | 2014-04-09 | 2015-11-12 | 富士通株式会社 | ヒートパイプ内蔵フレーム板及び電子機器 |
JP2016142416A (ja) * | 2015-01-29 | 2016-08-08 | 富士通株式会社 | ループヒートパイプ及びループヒートパイプの製造方法 |
WO2017037921A1 (ja) * | 2015-09-03 | 2017-03-09 | 富士通株式会社 | ループヒートパイプ及びその製造方法並びに電子機器 |
JP2017110869A (ja) * | 2015-12-17 | 2017-06-22 | 富士通株式会社 | ループヒートパイプ構造、製造方法及び電子機器 |
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US20200281096A1 (en) | 2020-09-03 |
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