JPWO2018159018A1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JPWO2018159018A1 JPWO2018159018A1 JP2019502456A JP2019502456A JPWO2018159018A1 JP WO2018159018 A1 JPWO2018159018 A1 JP WO2018159018A1 JP 2019502456 A JP2019502456 A JP 2019502456A JP 2019502456 A JP2019502456 A JP 2019502456A JP WO2018159018 A1 JPWO2018159018 A1 JP WO2018159018A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 116
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 230000005484 gravity Effects 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 210000000746 body region Anatomy 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
Description
最初に本開示の実施態様を列記して説明する。
以下、本開示の一実施形態(以下「本実施形態」と記す)について詳細に説明するが、本実施形態はこれらに限定されるものではない。
11 ダイパッド
12 ドレイン端子
20 ゲート端子
21 ゲートワイヤ接続部
30 ソース端子
31 ソースワイヤ接続部
40 半導体チップ
41a、41b 短辺
42a、42b 長辺
43 重心
50 ゲートパッド
60 ソースパッド
70 ゲートワイヤ
80 ソースワイヤ
90 半田
100 パッケージ
401 n型半導体基板
402 ドリフト層
403 ボディ層
404 ソース領域
405 ゲート電極
406 ゲート絶縁膜
407、408 金属層
Claims (4)
- パッケージングされた半導体装置であって、
ダイパッドと、前記ダイパッドから上面視にて一方向に延びるドレイン端子を有する基板と、
前記ドレイン端子の両側に、前記一方向に延びて設けられたゲート端子及びソース端子と、
長方形状を有し、短辺が前記ドレイン端子と平行になり、重心が前記ゲート端子より前記ソース端子に近くなるように前記ダイパッド上に配置された半導体チップと、
前記半導体チップの上面の前記ゲート端子側に配置されたゲートパッドと、
前記半導体チップの上面の前記ソース端子側から、前記ゲート端子側に向かって配列された複数のソースパッドと、
前記ゲートパッドと前記ゲート端子とを接続するゲートワイヤと、
前記複数のソースパッドと前記ソース端子とを接続する複数のソースワイヤと、を有する半導体装置。 - 前記複数のソースワイヤの少なくとも1本が前記ゲートワイヤよりも短い請求項1に記載の半導体装置。
- 前記複数のソースワイヤの2本以上が前記ゲートワイヤよりも短い請求項2に記載の半導体装置。
- 前記半導体チップはワイドギャップ半導体チップである請求項1〜3のいずれか一項に記載の半導体装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2017038443 | 2017-03-01 | ||
JP2017038443 | 2017-03-01 | ||
PCT/JP2017/039806 WO2018159018A1 (ja) | 2017-03-01 | 2017-11-02 | 半導体装置 |
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JPWO2018159018A1 true JPWO2018159018A1 (ja) | 2019-12-26 |
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JP2019502456A Pending JPWO2018159018A1 (ja) | 2017-03-01 | 2017-11-02 | 半導体装置 |
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US (1) | US20200111727A1 (ja) |
JP (1) | JPWO2018159018A1 (ja) |
WO (1) | WO2018159018A1 (ja) |
Families Citing this family (2)
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WO2019198800A1 (ja) * | 2018-04-11 | 2019-10-17 | ローム株式会社 | 半導体装置 |
JP7313197B2 (ja) * | 2019-06-11 | 2023-07-24 | ローム株式会社 | 半導体装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005026294A (ja) * | 2003-06-30 | 2005-01-27 | Renesas Technology Corp | 半導体装置およびその製造方法 |
US20050073012A1 (en) * | 2003-03-17 | 2005-04-07 | Analog Power Intellectual Properties Limited | Transistor having multiple gate pads |
US20060255362A1 (en) * | 2005-04-22 | 2006-11-16 | Ralf Otremba | Semiconductor Component in a Standard Housing and Method for the Production Thereof |
US20110169144A1 (en) * | 2010-01-13 | 2011-07-14 | Tomas Moreno | Die package including multiple dies and lead orientation |
JP2015097237A (ja) * | 2013-11-15 | 2015-05-21 | 住友電気工業株式会社 | 半導体装置 |
JP2016072376A (ja) * | 2014-09-29 | 2016-05-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2017135336A (ja) * | 2016-01-29 | 2017-08-03 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
-
2017
- 2017-11-02 US US16/488,665 patent/US20200111727A1/en not_active Abandoned
- 2017-11-02 WO PCT/JP2017/039806 patent/WO2018159018A1/ja active Application Filing
- 2017-11-02 JP JP2019502456A patent/JPWO2018159018A1/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050073012A1 (en) * | 2003-03-17 | 2005-04-07 | Analog Power Intellectual Properties Limited | Transistor having multiple gate pads |
JP2005026294A (ja) * | 2003-06-30 | 2005-01-27 | Renesas Technology Corp | 半導体装置およびその製造方法 |
US20060255362A1 (en) * | 2005-04-22 | 2006-11-16 | Ralf Otremba | Semiconductor Component in a Standard Housing and Method for the Production Thereof |
US20110169144A1 (en) * | 2010-01-13 | 2011-07-14 | Tomas Moreno | Die package including multiple dies and lead orientation |
JP2015097237A (ja) * | 2013-11-15 | 2015-05-21 | 住友電気工業株式会社 | 半導体装置 |
JP2016072376A (ja) * | 2014-09-29 | 2016-05-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2017135336A (ja) * | 2016-01-29 | 2017-08-03 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
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WO2018159018A1 (ja) | 2018-09-07 |
US20200111727A1 (en) | 2020-04-09 |
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