JPWO2018135137A1 - 物品中継装置及びストッカ - Google Patents
物品中継装置及びストッカ Download PDFInfo
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- JPWO2018135137A1 JPWO2018135137A1 JP2018562911A JP2018562911A JPWO2018135137A1 JP WO2018135137 A1 JPWO2018135137 A1 JP WO2018135137A1 JP 2018562911 A JP2018562911 A JP 2018562911A JP 2018562911 A JP2018562911 A JP 2018562911A JP WO2018135137 A1 JPWO2018135137 A1 JP WO2018135137A1
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- 230000032258 transport Effects 0.000 description 12
- 230000008602 contraction Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000005192 partition Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0485—Check-in, check-out devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Warehouses Or Storage Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Vehicle Step Arrangements And Article Storage (AREA)
Abstract
Description
K2・・・ストッカ内部(設備内部)
M・・・物品
P1・・・第1位置
P2・・・第2位置
R・・・通路
S・・・仮想平面
10・・・開口部
10a・・・上端
20・・・載置台
30・・・第1カバー
40・・・第2カバー
41・・・傾斜部
50・・・移動機構
60・・・シャッタ機構
61、62・・・シャッタ
63・・・制御装置
70・・・外気供給部
71・・・外気取込口
72・・・ダクト
100・・・物品中継装置
111・・・外壁
120・・・棚部
130・・・搬送装置
200・・・ストッカ(設備)
Claims (8)
- 設備内外を区画する外壁に設けられ、設備内部と作業者との間で物品を中継する物品中継装置であって、
前記外壁の外側における作業者の通路に面して開口する開口部と、
前記開口部よりも奥行方向の奥側に設けられて物品が載置される載置台と、
前記開口部に対して上方かつ前記開口部よりも奥行方向の手前側の位置に設けられて前記外壁の一部となる第1カバーと、
前記第1カバーと前記開口部との間に設けられて前記外壁の一部となりかつ下方に向かうにつれて奥行方向の奥側へ向かう形状の第2カバーと、を備える、物品中継装置。 - 前記載置台を、奥行方向の手前側の第1位置と、前記第1位置よりも奥行方向の奥側でありかつ設備内部に備えられた搬送装置に対する物品の受け渡し位置である第2位置との間で移動させる移動機構を備える、請求項1に記載の物品中継装置。
- 前記第1位置は、前記載置台に載置された物品の少なくとも一部が、前記開口部の上端を含みかつ前記第2カバーに接する仮想平面よりも前記奥行方向の手前側となる位置であり、
前記第2位置は、前記第1位置よりも奥行方向の奥側となる位置である、請求項2に記載の物品中継装置。 - 前記第1位置は、奥行方向において前記第1カバーよりも奥側の位置であり、前記移動機構の奥行方向の手前側限界位置である、請求項2または請求項3に記載の物品中継装置。
- 前記開口部に対して奥行方向の奥側に、前記外壁の外側の外気を供給する外気供給部を備える、請求項1から請求項4のいずれか1項に記載の物品中継装置。
- 前記第2カバーの一部に、前記外気供給部における外気取込口が設けられる、請求項1から請求項5のいずれか1項に記載の物品中継装置。
- 請求項1から請求項6のいずれか1項に記載の物品中継装置を備える、ストッカ。
- 物品が載置される複数の棚を内部に備え、
前記複数の棚の少なくとも1つは、前記第1カバーに対して奥行方向の奥側かつ前記載置台に対して上方に配置される、請求項7に記載のストッカ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017009445 | 2017-01-23 | ||
JP2017009445 | 2017-01-23 | ||
PCT/JP2017/042612 WO2018135137A1 (ja) | 2017-01-23 | 2017-11-28 | 物品中継装置及びストッカ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018135137A1 true JPWO2018135137A1 (ja) | 2019-11-07 |
JP6747522B2 JP6747522B2 (ja) | 2020-08-26 |
Family
ID=62909212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018562911A Expired - Fee Related JP6747522B2 (ja) | 2017-01-23 | 2017-11-28 | 物品中継装置及びストッカ |
Country Status (9)
Country | Link |
---|---|
US (1) | US20210403235A1 (ja) |
EP (1) | EP3573093A4 (ja) |
JP (1) | JP6747522B2 (ja) |
KR (1) | KR20190098223A (ja) |
CN (1) | CN110235234A (ja) |
IL (1) | IL268136B (ja) |
SG (1) | SG11201906775XA (ja) |
TW (1) | TW201833007A (ja) |
WO (1) | WO2018135137A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114715588B (zh) * | 2022-06-02 | 2023-07-25 | 弥费科技(上海)股份有限公司 | 存储库 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000003955A (ja) * | 1998-06-15 | 2000-01-07 | Mitsubishi Electric Corp | 半導体ウエハ収納装置 |
JP2003309158A (ja) * | 2002-04-12 | 2003-10-31 | Tokyo Electron Ltd | 処理装置 |
JP2008198796A (ja) * | 2007-02-13 | 2008-08-28 | Tokyo Electron Ltd | 基板処理装置の設定操作支援装置,設定操作支援方法,プログラムを記憶する記憶媒体 |
JP2010192855A (ja) * | 2009-02-20 | 2010-09-02 | Tokyo Electron Ltd | 基板処理装置 |
WO2014115643A1 (ja) * | 2013-01-25 | 2014-07-31 | 株式会社日立国際電気 | 基板処理装置の異常判定方法、異常判定装置、及び基板処理システム並びに記録媒体 |
Family Cites Families (11)
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JPS5332930B2 (ja) | 1973-09-08 | 1978-09-11 | ||
US4986715A (en) * | 1988-07-13 | 1991-01-22 | Tokyo Electron Limited | Stock unit for storing carriers |
US5332930A (en) | 1993-06-24 | 1994-07-26 | Intel Corporation | Phase locked loop circuitry with variable gain and bandwidth |
JP4309935B2 (ja) * | 2007-07-31 | 2009-08-05 | Tdk株式会社 | 密閉容器の蓋開閉システム及び当該システムを用いた基板処理方法 |
JP5131558B2 (ja) * | 2008-12-02 | 2013-01-30 | 株式会社ダイフク | 物品搬送装置 |
JP5429559B2 (ja) * | 2010-02-01 | 2014-02-26 | 株式会社ダイフク | 倉庫設備 |
JP2014029891A (ja) * | 2010-11-29 | 2014-02-13 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
JP5729148B2 (ja) * | 2011-06-07 | 2015-06-03 | 東京エレクトロン株式会社 | 基板搬送容器の開閉装置、蓋体の開閉装置及び半導体製造装置 |
JP2014060338A (ja) * | 2012-09-19 | 2014-04-03 | Hitachi Kokusai Electric Inc | 基板処理装置 |
US20160293454A1 (en) * | 2013-03-27 | 2016-10-06 | Tokyo Electron Limited | Substrate processing device |
JP6556518B2 (ja) | 2015-06-23 | 2019-08-07 | 日本放送協会 | アンテナ特性測定方法 |
-
2017
- 2017-11-28 WO PCT/JP2017/042612 patent/WO2018135137A1/ja active Application Filing
- 2017-11-28 CN CN201780084239.3A patent/CN110235234A/zh not_active Withdrawn
- 2017-11-28 JP JP2018562911A patent/JP6747522B2/ja not_active Expired - Fee Related
- 2017-11-28 SG SG11201906775XA patent/SG11201906775XA/en unknown
- 2017-11-28 EP EP17892532.7A patent/EP3573093A4/en not_active Withdrawn
- 2017-11-28 US US16/479,617 patent/US20210403235A1/en not_active Abandoned
- 2017-11-28 KR KR1020197021465A patent/KR20190098223A/ko not_active Application Discontinuation
-
2018
- 2018-01-15 TW TW107101435A patent/TW201833007A/zh unknown
-
2019
- 2019-07-17 IL IL268136A patent/IL268136B/en active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000003955A (ja) * | 1998-06-15 | 2000-01-07 | Mitsubishi Electric Corp | 半導体ウエハ収納装置 |
JP2003309158A (ja) * | 2002-04-12 | 2003-10-31 | Tokyo Electron Ltd | 処理装置 |
JP2008198796A (ja) * | 2007-02-13 | 2008-08-28 | Tokyo Electron Ltd | 基板処理装置の設定操作支援装置,設定操作支援方法,プログラムを記憶する記憶媒体 |
JP2010192855A (ja) * | 2009-02-20 | 2010-09-02 | Tokyo Electron Ltd | 基板処理装置 |
WO2014115643A1 (ja) * | 2013-01-25 | 2014-07-31 | 株式会社日立国際電気 | 基板処理装置の異常判定方法、異常判定装置、及び基板処理システム並びに記録媒体 |
Also Published As
Publication number | Publication date |
---|---|
CN110235234A (zh) | 2019-09-13 |
EP3573093A4 (en) | 2020-11-04 |
WO2018135137A1 (ja) | 2018-07-26 |
EP3573093A1 (en) | 2019-11-27 |
US20210403235A1 (en) | 2021-12-30 |
SG11201906775XA (en) | 2019-08-27 |
KR20190098223A (ko) | 2019-08-21 |
IL268136A (en) | 2019-10-31 |
TW201833007A (zh) | 2018-09-16 |
IL268136B (en) | 2020-11-30 |
JP6747522B2 (ja) | 2020-08-26 |
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