JPWO2017179736A1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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Abstract
Description
つまり、図3Aにおいては、第1流路部材11から第2流路部材21への方向で定義される並びにおいて、ヒートシンク層13、半導体素子14、配線層16a〜16dの順を第1回路ユニット10とし、配線層26a〜26d、半導体素子24、ヒートシンク層23の順が第2回路ユニット20としている。そして、半導体装置200において2つの回路ユニット10,20が上記のように隣接して位置していることで、配線層16a〜16dおよび配線層26a〜26dが、第1流路部材11または第2流路部材21に面しているため、効率的に冷却させることができる。さらに、隣り合う回路ユニット10,20を上下逆に積層して配置することで、熱および熱応力の点でバランスをとることができる。
11,31 第1流路部材
21,41 第2流路部材
12,22,32,42 冷媒流路
13,23 ヒートシンク層
14,24 半導体素子
15a,15b,15c,15d ろう材または半田
15e 接着層
16a,16b,16c,16d,16e 配線層
19,39 冷却ユニット
25a,25b,25c,25d ろう材または半田
26a,26b,26c,26d 配線層
51,61,71,81 連結管
52,62,72,82 冷媒流路
92,102 冷媒流路
91,101,111 パイプ
100,200,201,300,400 半導体装置
112 切欠き
Claims (7)
- ヒートシンク層と、配線層と、前記ヒートシンク層および前記配線層の間に半導体素子とを有する回路ユニットと、
絶縁材からなる第1流路部材と、
絶縁材からなる第2流路部材とを備え、
前記回路ユニットが、前記第1流路部材および前記第2流路部材の間に位置し、前記配線層が、前記第1流路部材または前記第2流路部材に面している半導体装置。 - 前記回路ユニット内における前記第1流路部材から前記第2流路部材への並びにおいて、
前記ヒートシンク層、前記半導体素子、前記配線層の順を第1回路ユニットと、前記配線層、前記半導体素子、前記ヒートシンク層の順を第2回路ユニットとしたとき、前記第1回路ユニットと前記第2回路ユニットとが隣接して位置している請求項1に記載の半導体装置。 - 前記第1流路部材、前記回路ユニット、前記第2流路部材を1組の冷却ユニットとしたとき、
2組の冷却ユニットにおいて、前記第1流路部材または前記第2流路部材を兼用している請求項1または請求項2に記載の半導体装置。 - 前記第1流路部材と前記第2流路部材とが連結管で接続されている請求項1乃至請求項3のいずれかに記載の半導体装置。
- 前記第1流路部材および前記第2流路部材が、窒化珪素質セラミックスからなる請求項1乃至請求項4のいずれかに記載の半導体装置。
- 前記連結管と、前記第1流路部材または前記第2流路部材との対向面間に接着層を有しているとともに、
前記連結管における外周面から前記第1流路部材または前記第2流路部材にわたって前記接着層の一部が位置している請求項4または請求項5に記載の半導体装置。 - 請求項4乃至請求項6のいずれかに記載の半導体装置の製造方法であって、
前記半導体素子と前記配線層との間にろう材または半田を配置し、
前記第1流路部材と前記連結管との間および前記第2流路部材と前記連結管との間に接着剤を配置した後、熱処理することで、前記半導体素子および前記配線層と、前記第1流路部材および前記連結管と、前記第2流路部材および前記連結管とを接合する半導体装置の製造方法。
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