JPWO2017033935A1 - 導電材料及び接続構造体 - Google Patents
導電材料及び接続構造体 Download PDFInfo
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- JPWO2017033935A1 JPWO2017033935A1 JP2016555375A JP2016555375A JPWO2017033935A1 JP WO2017033935 A1 JPWO2017033935 A1 JP WO2017033935A1 JP 2016555375 A JP2016555375 A JP 2016555375A JP 2016555375 A JP2016555375 A JP 2016555375A JP WO2017033935 A1 JPWO2017033935 A1 JP WO2017033935A1
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- Prior art keywords
- solder
- electrode
- conductive
- conductive material
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910001502 inorganic halide Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009916 joint effect Effects 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000010303 mechanochemical reaction Methods 0.000 description 1
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 125000005489 p-toluenesulfonic acid group Chemical group 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical group [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004814 polyurethane Chemical class 0.000 description 1
- 229920002635 polyurethane Chemical class 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- YLLIGHVCTUPGEH-UHFFFAOYSA-M potassium;ethanol;hydroxide Chemical compound [OH-].[K+].CCO YLLIGHVCTUPGEH-UHFFFAOYSA-M 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical class [H]N([H])* 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 1
- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
- 125000002088 tosyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C([H])([H])[H])S(*)(=O)=O 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- JRSJRHKJPOJTMS-UHFFFAOYSA-N trimethoxy(2-phenylethenyl)silane Chemical compound CO[Si](OC)(OC)C=CC1=CC=CC=C1 JRSJRHKJPOJTMS-UHFFFAOYSA-N 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 229920006305 unsaturated polyester Chemical class 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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- C—CHEMISTRY; METALLURGY
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Abstract
Description
本発明に係る導電材料は、複数の導電性粒子と、バインダーとを含む。上記導電性粒子は、導電部を有する。上記導電性粒子は、導電部の外表面部分に、はんだを有する。はんだは、導電部に含まれ、導電部の一部又は全部である。
上記導電性粒子は、接続対象部材の電極間を電気的に接続する。上記導電性粒子は、導電部の外表面部分にはんだを有する。上記導電性粒子は、はんだ粒子であってもよい。上記はんだ粒子ははんだにより形成されている。上記はんだ粒子は、はんだを導電部の外表面部分に有する。上記はんだ粒子は、上記はんだ粒子の中心部分及び導電部の外表面部分のいずれもがはんだである粒子である。上記はんだ粒子は、中心部分及び導電部の外表面部分のいずれもがはんだにより形成されている。上記導電性粒子は、基材粒子と、該基材粒子の表面上に配置された導電部とを有していてもよい。この場合に、上記導電性粒子は、導電部の外表面部分に、はんだを有する。
上記熱硬化性化合物は、加熱により硬化可能な化合物である。上記熱硬化性化合物としては、オキセタン化合物、エポキシ化合物、エピスルフィド化合物、(メタ)アクリル化合物、フェノール化合物、アミノ化合物、不飽和ポリエステル化合物、ポリウレタン化合物、シリコーン化合物及びポリイミド化合物等が挙げられる。導電材料の硬化性及び粘度をより一層良好にし、接続信頼性をより一層高める観点から、エポキシ化合物又はエピスルフィド化合物が好ましく、エポキシ化合物がより好ましい。上記導電材料は、エポキシ化合物を含むことが好ましい。上記熱硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記熱硬化剤は、上記熱硬化性化合物を熱硬化させる。上記熱硬化剤としては、イミダゾール硬化剤、フェノール硬化剤、チオール硬化剤、アミン硬化剤、酸無水物熱硬化剤、熱カチオン開始剤(熱カチオン硬化剤)及び熱ラジカル発生剤等がある。本発明では、上記熱硬化剤として酸無水物熱硬化剤を用いる。導電性粒子におけるはんだを電極上に効率的に配置する観点、並びにマイグレーションの発生を効果的に抑える観点からは、導電部の外表面部分にはんだを有する導電性粒子を用いる場合に、酸無水物熱硬化剤を用いることには大きな意味がある。上記酸無水物熱硬化剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。
接続信頼性を高める観点から、上記導電材料は、硬化促進剤を含むことが好ましい。上記硬化促進剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記導電材料は、フラックスを含むことが好ましい。フラックスの使用により、はんだを電極上により一層効果的に配置することができる。該フラックスは特に限定されない。フラックスとして、はんだ接合等に一般的に用いられているフラックスを使用できる。上記導電材料は、フラックスを含んでいなくてもよい。
上記導電材料は、必要に応じて、例えば、充填剤、増量剤、軟化剤、可塑剤、重合触媒、硬化触媒、着色剤、酸化防止剤、熱安定剤、光安定剤、紫外線吸収剤、滑剤、帯電防止剤及び難燃剤等の各種添加剤を含んでいてもよい。
本発明に係る接続構造体は、少なくとも1つの第1の電極を表面に有する第1の接続対象部材と、少なくとも1つの第2の電極を表面に有する第2の接続対象部材と、上記第1の接続対象部材と、上記第2の接続対象部材とを接続している接続部とを備える。本発明に係る接続構造体では、上記接続部の材料が、上述した導電材料であり、上記接続部が、上述した導電材料の硬化物である。本発明に係る接続構造体では、上記第1の電極と上記第2の電極とが、上記接続部中のはんだ部により電気的に接続されている。
熱硬化性化合物2:DIC社製「HP−7200HH」、ジシクロペンタジエン型エポキシ樹脂
熱硬化性化合物3:日産化学工業社製「TEPIC−HP」、トリアジン型エポキシ樹脂
熱硬化剤1:環状酸無水物熱硬化剤、25℃で液状、三菱化学社製「YH306」
熱硬化剤2:環状酸無水物熱硬化剤以外の酸無水物熱硬化剤、テトラプロペニル無水コハク酸、25℃で液状、新日本理化社製「DDSA」
熱硬化剤3:酸無水物熱硬化剤、25℃で固形、和光純薬社製「ピリメリット酸無水物」
熱硬化剤4:アミン硬化剤、三菱化学社製「DICY」
フラックス1:グルタル酸
硬化促進剤1::T&K TOKA社製「フジキュア7000」
硬化促進剤2:日本化学工業社製「PX−4MP」有機リン硬化促進剤
硬化促進剤3:日本化学工業社製「PX−4FB」有機リン硬化促進剤
硬化促進剤4:日本化学工業社製「PX−4B」有機リン硬化促進剤
はんだ粒子1の作製方法:
SnBiはんだ粒子(三井金属社製「ST−5」、平均粒子径(メディアン径)5μm)と、グルタル酸(2つのカルボキシル基を有する化合物、和光純薬工業社製「グルタル酸」)とを、触媒であるp−トルエンスルホン酸を用いて、トルエン溶媒中90℃で脱水しながら8時間攪拌することにより、はんだの表面にカルボキシル基を含む基が共有結合しているはんだ粒子1を得た。
(1)異方性導電ペーストの作製
下記の表1,2に示す成分を下記の表1,2に示す配合量で配合して、異方性導電ペーストを得た。
L/Sが50μm/50μm、電極長さ3mmの銅電極パターン(銅電極の厚み12μm)を上面に有するガラスエポキシ基板(FR−4基板、厚み0.6mm)(第1の接続対象部材)を用意した。また、L/Sが50μm/50μm、電極長さ3mmの銅電極パターン(銅電極の厚み12μm)を下面に有するフレキシブルプリント基板(ポリイミドにより形成されている、第2の接続対象部材、厚み0.1mm)を用意した。
(1)粘度
異方性導電ペーストの50℃での粘度(η50)、及び100℃での粘度(η100)を、STRESSTECH(EOLOGICA社製)を用いて、歪制御1rad、周波数1Hz、昇温速度20℃/分、測定温度範囲40〜200℃の条件で測定した。
異方性導電ペーストを170℃で0.5時間熱硬化させて第1の硬化物を得た。得られた第1の硬化物を130℃及び湿度85%で100時間放置して第2の硬化物を得た。粘弾性装置を用いて、上記第1の硬化物のガラス転移温度(Tg1)と、上記第2の硬化物のガラス転移温度(Tg2)とを評価した。Tg1とTg2との差の絶対値を求めた。
得られた接続構造体において、第1の電極と接続部と第2の電極との積層方向に第1の電極と第2の電極との対向し合う部分をみたときに、第1の電極と第2の電極との対向し合う部分の面積100%中の、接続部中のはんだ部が配置されている面積の割合Xを評価した。電極上のはんだの配置精度1を下記の基準で判定した。
○○○:割合Xが80%以上
○○:割合Xが70%以上、80%未満
○:割合Xが60%以上、70%未満
△:割合Xが50%以上、60%未満
×:割合Xが50%未満
得られた接続構造体において、第1の電極と接続部と第2の電極との積層方向と直交する方向に第1の電極と第2の電極との対向し合う部分をみたときに、接続部中のはんだ部100%中、第1の電極と第2の電極との対向し合う部分に配置されている接続部中のはんだ部の割合Yを評価した。電極上のはんだの配置精度2を下記の基準で判定した。
○○:割合Yが99%以上
○:割合Yが90%以上、99%未満
△:割合Yが70%以上、90%未満
×:割合Yが70%未満
得られた接続構造体を110℃、湿度85%で100時間放置した後、上下の電極間の絶縁抵抗をそれぞれ、4端子法により測定した。絶縁抵抗の平均値を算出した。なお、電圧=電流×抵抗の関係から、一定の電流を流した時の電圧を測定することにより絶縁抵抗を求めることができる。マイグレーションを下記の基準で判定した。
○○:放置後に、絶縁抵抗の平均値が10×1014Ω以上
○:放置後に、絶縁抵抗の平均値が10×1012Ω以上、10×1014Ω未満
△:放置後に、絶縁抵抗の平均値が10×1010Ω以上、10×1012Ω未満
×:放置後に、絶縁抵抗の平均値が10×1010未満であり、導通とみなされる
2…第1の接続対象部材
2a…第1の電極
3…第2の接続対象部材
3a…第2の電極
4,4X…接続部
4A,4XA…はんだ部
4B,4XB…硬化物部
11…導電材料
11A…はんだ粒子(導電性粒子)
11B…熱硬化性成分
21…導電性粒子(はんだ粒子)
31…導電性粒子
32…基材粒子
33…導電部(はんだを有する導電部)
33A…第2の導電部
33B…はんだ部
41…導電性粒子
42…はんだ部
Claims (15)
- 導電部の外表面部分に、はんだを有する複数の導電性粒子と、
熱硬化性化合物と、
酸無水物熱硬化剤とを含み、
50℃での粘度が10Pa・s以上、200Pa・s以下である、導電材料。 - 導電材料100重量%中、前記導電性粒子の含有量が1重量%以上、80重量%以下であり、
異方性導電材料である、請求項1に記載の導電材料。 - 50℃での粘度の100℃での粘度に対する比が10以上、400以下である、請求項1又は2に記載の導電材料。
- 前記導電性粒子は、はんだ粒子である、請求項1〜3のいずれか1項に記載の導電材料。
- 有機リン化合物を含む、請求項1〜4のいずれか1項に記載の導電材料。
- 前記酸無水物熱硬化剤が、25℃で液状である、請求項1〜5のいずれか1項に記載の導電材料。
- 前記酸無水物熱硬化剤は、環状酸無水物熱硬化剤である、請求項1〜6のいずれか1項に記載の導電材料。
- 170℃で0.5時間熱硬化させて第1の硬化物を得たときに、かつ、得られた第1の硬化物を130℃及び湿度85%で100時間放置して第2の硬化物を得たときに、
前記第1の硬化物のガラス転移温度と、前記第2の硬化物のガラス転移温度との差の絶対値が20℃以下である、請求項1〜7のいずれか1項に記載の導電材料。 - 前記熱硬化性化合物が、窒素原子を有する熱硬化性化合物を含む、請求項1〜8のいずれか1項に記載の導電材料。
- 前記熱硬化性化合物が、トリアジン骨格を有する熱硬化性化合物を含む、請求項9に記載の導電材料。
- 前記熱硬化性化合物の全体100重量部に対して、前記酸無水物熱硬化剤の含有量が30重量部以上、80重量部以下である、請求項1〜10のいずれか1項に記載の導電材料。
- 前記導電性粒子の外表面に、カルボキシル基が存在する、請求項1〜11のいずれか1項に記載の導電材料。
- 25℃で液状であり、導電ペーストである、請求項1〜12のいずれか1項に記載の導電材料。
- 少なくとも1つの第1の電極を表面に有する第1の接続対象部材と、
少なくとも1つの第2の電極を表面に有する第2の接続対象部材と、
前記第1の接続対象部材と前記第2の接続対象部材とを接続している接続部とを備え、
前記接続部が、請求項1〜13のいずれか1項に記載の導電材料の硬化物であり、
前記第1の電極と前記第2の電極とが前記接続部中のはんだ部により電気的に接続されている、接続構造体。 - 前記第1の電極と前記接続部と前記第2の電極との積層方向に前記第1の電極と前記第2の電極との対向し合う部分をみたときに、前記第1の電極と前記第2の電極との対向し合う部分の面積100%中の50%以上に、前記接続部中のはんだ部が配置されている、請求項14に記載の接続構造体。
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