JPWO2017006897A1 - 樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板 - Google Patents
樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板 Download PDFInfo
- Publication number
- JPWO2017006897A1 JPWO2017006897A1 JP2017527445A JP2017527445A JPWO2017006897A1 JP WO2017006897 A1 JPWO2017006897 A1 JP WO2017006897A1 JP 2017527445 A JP2017527445 A JP 2017527445A JP 2017527445 A JP2017527445 A JP 2017527445A JP WO2017006897 A1 JPWO2017006897 A1 JP WO2017006897A1
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin composition
- silane compound
- compound
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 prepreg Substances 0.000 title claims abstract description 176
- 239000011342 resin composition Substances 0.000 title claims abstract description 121
- 229920005989 resin Polymers 0.000 title claims description 68
- 239000011347 resin Substances 0.000 title claims description 68
- 229910052751 metal Inorganic materials 0.000 title claims description 42
- 239000002184 metal Substances 0.000 title claims description 42
- 229910000077 silane Inorganic materials 0.000 claims abstract description 114
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 56
- 239000011256 inorganic filler Substances 0.000 claims abstract description 46
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 46
- 239000004593 Epoxy Substances 0.000 claims abstract description 37
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims description 34
- 150000001875 compounds Chemical class 0.000 claims description 33
- 125000004432 carbon atom Chemical group C* 0.000 claims description 32
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 23
- 239000004643 cyanate ester Substances 0.000 claims description 20
- 125000002947 alkylene group Chemical group 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 239000004744 fabric Substances 0.000 claims description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 13
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 6
- 125000003342 alkenyl group Chemical group 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 claims description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- YNSSPVZNXLACMW-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)-3-ethyl-5-methylphenyl]methyl]-2-ethyl-6-methylphenyl]pyrrole-2,5-dione Chemical compound C=1C(C)=C(N2C(C=CC2=O)=O)C(CC)=CC=1CC(C=C1CC)=CC(C)=C1N1C(=O)C=CC1=O YNSSPVZNXLACMW-UHFFFAOYSA-N 0.000 claims description 3
- LKUOJDGRNKVVFF-UHFFFAOYSA-N 4-(2,5-dioxopyrrol-1-yl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1N1C(=O)C=CC1=O LKUOJDGRNKVVFF-UHFFFAOYSA-N 0.000 claims description 3
- 229910005965 SO 2 Inorganic materials 0.000 claims description 3
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 claims description 3
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 3
- 125000002993 cycloalkylene group Chemical group 0.000 claims description 3
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 claims description 3
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 125000004957 naphthylene group Chemical group 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 3
- 125000001424 substituent group Chemical group 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 14
- 239000002994 raw material Substances 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 42
- 238000000034 method Methods 0.000 description 39
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 27
- 239000002585 base Substances 0.000 description 16
- 239000011888 foil Substances 0.000 description 15
- 125000000524 functional group Chemical group 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 13
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 12
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 12
- 239000011889 copper foil Substances 0.000 description 10
- 239000002966 varnish Substances 0.000 description 10
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 9
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
- 239000006087 Silane Coupling Agent Substances 0.000 description 8
- 238000009413 insulation Methods 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000002759 woven fabric Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 150000004756 silanes Chemical class 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 4
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000002270 dispersing agent Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000000080 wetting agent Substances 0.000 description 4
- RNIPJYFZGXJSDD-UHFFFAOYSA-N 2,4,5-triphenyl-1h-imidazole Chemical compound C1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 RNIPJYFZGXJSDD-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 2
- GAYWTJPBIQKDRC-UHFFFAOYSA-N 8-trimethoxysilyloctyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C(C)=C GAYWTJPBIQKDRC-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- 229940126062 Compound A Drugs 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 125000005577 anthracene group Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 150000007514 bases Chemical class 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-N cyanic acid Chemical compound OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 125000005504 styryl group Chemical group 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- ZYMHKOVQDOFPHH-UHFFFAOYSA-N trimethoxy(oct-1-enyl)silane Chemical compound CCCCCCC=C[Si](OC)(OC)OC ZYMHKOVQDOFPHH-UHFFFAOYSA-N 0.000 description 2
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- UFKLQICEQCIWNE-UHFFFAOYSA-N (3,5-dicyanatophenyl) cyanate Chemical compound N#COC1=CC(OC#N)=CC(OC#N)=C1 UFKLQICEQCIWNE-UHFFFAOYSA-N 0.000 description 1
- YDCUTCGACVVRIQ-UHFFFAOYSA-N (3,6-dicyanatonaphthalen-1-yl) cyanate Chemical compound N#COC1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 YDCUTCGACVVRIQ-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- UMDBGQBQDICTJC-UHFFFAOYSA-N (3-cyanatonaphthalen-1-yl) cyanate Chemical compound C1=CC=CC2=CC(OC#N)=CC(OC#N)=C21 UMDBGQBQDICTJC-UHFFFAOYSA-N 0.000 description 1
- QQZZMAPJAKOSNG-UHFFFAOYSA-N (3-cyanatophenyl) cyanate Chemical compound N#COC1=CC=CC(OC#N)=C1 QQZZMAPJAKOSNG-UHFFFAOYSA-N 0.000 description 1
- KUYRCFRAGLLTPO-UHFFFAOYSA-N (4-cyanatonaphthalen-1-yl) cyanate Chemical compound C1=CC=C2C(OC#N)=CC=C(OC#N)C2=C1 KUYRCFRAGLLTPO-UHFFFAOYSA-N 0.000 description 1
- GUGZCSAPOLLKNG-UHFFFAOYSA-N (4-cyanatophenyl) cyanate Chemical compound N#COC1=CC=C(OC#N)C=C1 GUGZCSAPOLLKNG-UHFFFAOYSA-N 0.000 description 1
- CQXJSKSVSXZXRU-UHFFFAOYSA-N (5-cyanatonaphthalen-2-yl) cyanate Chemical compound N#COC1=CC=CC2=CC(OC#N)=CC=C21 CQXJSKSVSXZXRU-UHFFFAOYSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- IRMQZYWARKKEQH-UHFFFAOYSA-N (6-cyanatonaphthalen-2-yl) cyanate Chemical compound C1=C(OC#N)C=CC2=CC(OC#N)=CC=C21 IRMQZYWARKKEQH-UHFFFAOYSA-N 0.000 description 1
- ZJKWUUSAPDIPQQ-UHFFFAOYSA-N (8-cyanatonaphthalen-1-yl) cyanate Chemical compound C1=CC(OC#N)=C2C(OC#N)=CC=CC2=C1 ZJKWUUSAPDIPQQ-UHFFFAOYSA-N 0.000 description 1
- QMTFKWDCWOTPGJ-KVVVOXFISA-N (z)-octadec-9-enoic acid;tin Chemical compound [Sn].CCCCCCCC\C=C/CCCCCCCC(O)=O QMTFKWDCWOTPGJ-KVVVOXFISA-N 0.000 description 1
- DAJPMKAQEUGECW-UHFFFAOYSA-N 1,4-bis(methoxymethyl)benzene Chemical group COCC1=CC=C(COC)C=C1 DAJPMKAQEUGECW-UHFFFAOYSA-N 0.000 description 1
- NHWYMYDMYCNUKI-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)-3,5-diethylphenyl]methyl]-2,6-diethylphenyl]pyrrole-2,5-dione Chemical compound C=1C(CC)=C(N2C(C=CC2=O)=O)C(CC)=CC=1CC(C=C1CC)=CC(CC)=C1N1C(=O)C=CC1=O NHWYMYDMYCNUKI-UHFFFAOYSA-N 0.000 description 1
- RUORVEVRVBXRIO-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)-3,5-dimethylphenyl]methyl]-2,6-dimethylphenyl]pyrrole-2,5-dione Chemical compound C=1C(C)=C(N2C(C=CC2=O)=O)C(C)=CC=1CC(C=C1C)=CC(C)=C1N1C(=O)C=CC1=O RUORVEVRVBXRIO-UHFFFAOYSA-N 0.000 description 1
- HHVCCCZZVQMAMT-UHFFFAOYSA-N 1-hydroxy-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(O)C(=O)C=C1C1=CC=CC=C1 HHVCCCZZVQMAMT-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- AXFVIWBTKYFOCY-UHFFFAOYSA-N 1-n,1-n,3-n,3-n-tetramethylbutane-1,3-diamine Chemical compound CN(C)C(C)CCN(C)C AXFVIWBTKYFOCY-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- GGSRTHRSSCWGGK-UHFFFAOYSA-L 2,2-dibutyl-5-hydroxy-1,3,2-dioxastannepane-4,7-dione Chemical compound CCCC[Sn]1(CCCC)OC(=O)CC(O)C(=O)O1 GGSRTHRSSCWGGK-UHFFFAOYSA-L 0.000 description 1
- HYVGFUIWHXLVNV-UHFFFAOYSA-N 2-(n-ethylanilino)ethanol Chemical compound OCCN(CC)C1=CC=CC=C1 HYVGFUIWHXLVNV-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- LVGKZTVMAHRVFR-UHFFFAOYSA-N 4-(phenoxazine-10-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1C2=CC=CC=C2OC2=CC=CC=C21 LVGKZTVMAHRVFR-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- JCJUKCIXTRWAQY-UHFFFAOYSA-N 6-hydroxynaphthalene-1-carboxylic acid Chemical compound OC1=CC=C2C(C(=O)O)=CC=CC2=C1 JCJUKCIXTRWAQY-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 0 CC*(*)C(C)NC Chemical compound CC*(*)C(C)NC 0.000 description 1
- UCZGKDHEIYFJHE-UHFFFAOYSA-N Cl.C(C)CO[Si](OC)(OC)CCCN Chemical compound Cl.C(C)CO[Si](OC)(OC)CCCN UCZGKDHEIYFJHE-UHFFFAOYSA-N 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical group O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 229920000508 Vectran Polymers 0.000 description 1
- 239000004979 Vectran Substances 0.000 description 1
- HEJGXMCFSSDPOA-UHFFFAOYSA-N [4-(4-cyanatophenyl)phenyl] cyanate Chemical group C1=CC(OC#N)=CC=C1C1=CC=C(OC#N)C=C1 HEJGXMCFSSDPOA-UHFFFAOYSA-N 0.000 description 1
- CNUHQZDDTLOZRY-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfanylphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1SC1=CC=C(OC#N)C=C1 CNUHQZDDTLOZRY-UHFFFAOYSA-N 0.000 description 1
- BUPOATPDNYBPMR-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfonylphenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1S(=O)(=O)C1=CC=C(OC#N)C=C1 BUPOATPDNYBPMR-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- BWVAOONFBYYRHY-UHFFFAOYSA-N [4-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=C(CO)C=C1 BWVAOONFBYYRHY-UHFFFAOYSA-N 0.000 description 1
- VKUAGWJIYUEPHC-UHFFFAOYSA-N [4-[(4-cyanato-5,5-dimethylcyclohexa-1,3-dien-1-yl)methyl]-6,6-dimethylcyclohexa-1,3-dien-1-yl] cyanate Chemical compound CC1(CC(=CC=C1OC#N)CC=1CC(C(=CC=1)OC#N)(C)C)C VKUAGWJIYUEPHC-UHFFFAOYSA-N 0.000 description 1
- AUYQDAWLRQFANO-UHFFFAOYSA-N [4-[(4-cyanatophenyl)methyl]phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1CC1=CC=C(OC#N)C=C1 AUYQDAWLRQFANO-UHFFFAOYSA-N 0.000 description 1
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001336 alkenes Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- LQRUPWUPINJLMU-UHFFFAOYSA-N dioctyl(oxo)tin Chemical compound CCCCCCCC[Sn](=O)CCCCCCCC LQRUPWUPINJLMU-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000013003 hot bending Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- DLAPQHBZCAAVPQ-UHFFFAOYSA-N iron;pentane-2,4-dione Chemical compound [Fe].CC(=O)CC(C)=O DLAPQHBZCAAVPQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- JDEJGVSZUIJWBM-UHFFFAOYSA-N n,n,2-trimethylaniline Chemical compound CN(C)C1=CC=CC=C1C JDEJGVSZUIJWBM-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- QYJYJTDXBIYRHH-UHFFFAOYSA-N trimethoxy-[8-(oxiran-2-ylmethoxy)octyl]silane Chemical compound C(C1CO1)OCCCCCCCC[Si](OC)(OC)OC QYJYJTDXBIYRHH-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
- C08G61/10—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aromatic carbon atoms, e.g. polyphenylenes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
- C08L43/04—Homopolymers or copolymers of monomers containing silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2465/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
- C08J2465/02—Polyphenylenes
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
[1]マレイミド化合物と、炭素間不飽和結合と加水分解性基又は水酸基とを有するシラン化合物と、エポキシ骨格と加水分解性基又は水酸基とを有するシラン化合物と、無機充填材と、を含む樹脂組成物。
[2]前記炭素間不飽和結合と加水分解性基又は水酸基とを有するシラン化合物として、スチレン骨格と加水分解性基又は水酸基とを有するシラン化合物、及び/又は、(メタ)アクリル骨格と加水分解性基又は水酸基とを有するシラン化合物を含む、[1]に記載の樹脂組成物。
[3]前記炭素間不飽和結合と加水分解性基又は水酸基とを有するシラン化合物として、スチレン骨格と加水分解性基又は水酸基とを有するシラン化合物を含む、[2]に記載の樹脂組成物。
[4]前記スチレン骨格と加水分解性基又は水酸基とを有するシラン化合物として、下記式(A)で表される化合物を含む、[2]又は[3]に記載の樹脂組成物。
[5]前記(メタ)アクリル骨格と加水分解性基又は水酸基とを有するシラン化合物として、下記式(C)で表される化合物を含む、[2]に記載の樹脂組成物。
[6]前記エポキシ骨格と加水分解性基又は水酸基とを有するシラン化合物として、下記式(D)で表される化合物を含む、[1]〜[5]のいずれか1つに記載の樹脂組成物。
[7]アルケニル置換ナジイミドを更に含む、[1]〜[6]のいずれか1つに記載の樹脂組成物。
[8]前記アルケニル置換ナジイミドとして、下記式(1)で表される化合物を含む、[7]に記載の樹脂組成物。
[9]前記アルケニル置換ナジイミドとして、下記式(4)及び/又は(5)で表される化合物を含む、[7]又は[8]に記載の樹脂組成物。
[11]シアン酸エステル化合物を更に含む、[1]〜[10]のいずれか1つに記載の樹脂組成物。
[12]前記シアン酸エステル化合物として、下記式(7)及び/又は(8)で表される化合物を含む、[11]に記載の樹脂組成物。
[13]前記無機充填材が、シリカ、アルミナ及び窒化アルミニウムからなる群より選ばれる少なくとも1種を含む、[1]〜[12]のいずれか1つに記載の樹脂組成物。
[14]前記無機充填材の樹脂組成物における含有量が、樹脂組成物中の樹脂を構成する成分の合計100質量部に対して、100〜1100質量部である、[1]〜[13]のいずれか1つに記載の樹脂組成物。
[15]前記無機充填材が、前記炭素間不飽和結合と加水分解性基又は水酸基とを有するシラン化合物と、前記エポキシ骨格と加水分解性基又は水酸基とを有するシラン化合物と、により予め表面処理されている、[1]〜[14]のいずれか1つに記載の樹脂組成物。
[16]基材と、該基材に含浸又は塗布された[1]〜[15]のいずれか1つに記載の樹脂組成物と、を備えるプリプレグ。
[17]前記基材が、Eガラスクロス、Tガラスクロス、Sガラスクロス、Qガラスクロス及び有機繊維クロスからなる群より選ばれる少なくとも1種である、[16]に記載のプリプレグ。
[18]支持体と、該支持体に塗布された[1]〜[15]のいずれか1つに記載の樹脂組成物と、を備えるレジンシート。
[19][16]及び[17]に記載のプリプレグ、並びに[18]に記載のレジンシートからなる群より選ばれる少なくとも1種を1枚以上重ねてなる積層板であって、前記プリプレグ及び前記レジンシートからなる群より選ばれる少なくとも1種に含まれる樹脂組成物の硬化物を含む、積層板。
[20][16]及び[17]に記載のプリプレグ、並びに[18]に記載のレジンシートからなる群より選ばれる少なくとも1種と、前記プリプレグ及び前記レジンシートからなる群より選ばれる少なくとも1種の片面又は両面に配された金属箔と、を有する金属箔張積層板であって、前記プリプレグ及び前記レジンシートからなる群より選ばれる少なくとも1種に含まれる樹脂組成物の硬化物を含む金属箔張積層板。
[21]絶縁層と、前記絶縁層の表面に形成された導体層とを含むプリント配線板であって、前記絶縁層が、[1]〜[15]のいずれか1つに記載の樹脂組成物を含むプリント配線板。
また、本実施形態の樹脂組成物が優れた成形性を示し、かつ、優れた吸湿耐熱性を示す金属箔張積層板及びプリント配線板の原材料となる結果、それらの金属箔張積層板及びプリント配線板は、絶縁信頼性にも優れたものとなる。
0.9≦β/α≦4.3 (E)
1.5≦β/α≦4.0 (E1)
ここで、式中、αは樹脂組成物中のアルケニル置換ナジイミドが有するアルケニル基の総数を示し、βは樹脂組成物中のマレイミド化合物が有するマレイミド基の総数を示す。当該官能基の比(β/α)をこのような範囲とすることで、一層、硬化時の熱時弾性率及び易硬化性に優れる樹脂組成物等を得ることができ、かつ、低熱膨張、耐熱性、吸湿耐熱性、耐デスミア性及び耐薬品性に優れるプリント配線板等を得ることができる。
弾性率維持率=(b)/(a)×100
温度計、攪拌器、滴下漏斗及び還流冷却器を取りつけた反応器を予めブラインにより0〜5℃に冷却しておき、そこへ塩化シアン7.47g(0.122mol)、35%塩酸9.75g(0.0935mol)、水76mL、及び塩化メチレン44mLを仕込んだ。この反応器内の温度を−5〜+5℃、pHを1以下に保ちながら、撹拌下、上記式(9)におけるR8がすべて水素原子であるα−ナフトールアラルキル型フェノール樹脂(SN485、OH基当量:214g/eq.軟化点:86℃、新日鐵化学(株)製)20g(0.0935mol)、及びトリエチルアミン14.16g(0.14mol)を塩化メチレン92mLに溶解した溶液を滴下漏斗により1時間かけて滴下し、滴下終了後、更にトリエチルアミン4.72g(0.047mol)を15分間かけて滴下した。滴下終了後、同温度で15分間撹拌後、反応液を分液し、有機層を分取した。得られた有機層を水100mLで2回洗浄した後、エバポレーターにより減圧下で塩化メチレンを留去し、最終的に80℃で1時間濃縮乾固させて、α−ナフトールアラルキル型フェノール樹脂のシアン酸エステル化物(α−ナフトールアラルキル型シアン酸エステル樹脂、官能基当量:261g/eq.)、23.5gを得た。
合成例1により得られたα−ナフトールアラルキル型シアン酸エステル樹脂10質量部、ノボラック型マレイミド化合物(BMI−2300、大和化成工業(株)製、官能基当量:186g/eq.)45質量部、及びビスアリルナジイミド(BANI−M、丸善石油化学(株)製、官能基当量:286g/eq.)45質量部に、球状シリカ(SC−5050MOB、粒径1.6μm、アドマテックス(株)社製)200質量部、エポキシ系シラン化合物である3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業(株)製)2.5質量部、スチリル系シラン化合物であるp−スチリルトリメトキシシラン(KBM−1403、信越化学工業(株)製)2.5質量部、及び湿潤分散剤(DISPERBYK−161、ビックケミージャパン(株)製)1質量部を混合し、メチルエチルケトンで希釈することでワニスを得た。このワニスをEガラス織布に含浸塗工し、160℃で3分間加熱乾燥して、樹脂組成物含有量49質量%のプリプレグを得た。この時、〔β/α〕は、1.54となった。ここで、〔β/α〕は、下記計算式で表される(以下同様。)。
〔β/α〕=(マレイミド化合物の質量部数/マレイミド化合物の官能基当量)/(アルケニル置換ナジイミドの質量部数/アルケニル置換ナジイミドの官能基当量)
エポキシ系シラン化合物である3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業(株)製)2.5質量部、及びスチリル系シラン化合物であるp−スチリルトリメトキシシラン(KBM−1403、信越化学工業(株)製)2.5質量部に代えて、エポキシ系シラン化合物である3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業(株)製)2.5質量部、及びアクリル系シラン化合物である3−アクリロキシプロピルトリメトキシシラン(KBM−5103、信越化学工業(株)製)2.5質量部を用いた以外は、実施例1と同様にしてワニスを得、実施例1と同様にしてプリプレグを得た。
エポキシ系シラン化合物である3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業(株)製)2.5質量部、及びスチリル系シラン化合物であるp−スチリルトリメトキシシラン(KBM−1403、信越化学工業(株)製)2.5質量部に代えて、エポキシ系シラン化合物である3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業(株)製)2.5質量部、及びオレフィン系シラン化合物であるビニルトリメトキシシラン(KBM−1003、信越化学工業(株)製)2.5質量部を用いた以外は、実施例1と同様にしてワニスを得、実施例1と同様にしてプリプレグを得た。
エポキシ系シラン化合物である3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業(株)製)2.5質量部、及びスチリル系シラン化合物であるp−スチリルトリメトキシシラン(KBM−1403、信越化学工業(株)製)2.5質量部に代えて、エポキシ系シラン化合物である3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業(株)製)2.5質量部、及びオレフィン系シラン化合物であるオクテニルトリメトキシシラン(KBM−1083、信越化学工業(株)製)2.5質量部を用いた以外は、実施例1と同様にしてワニスを得、実施例1と同様にしてプリプレグを得た。
エポキシ系シラン化合物である3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業(株)製)2.5質量部、及びスチリル系シラン化合物であるp−スチリルトリメトキシシラン(KBM−1403、信越化学工業(株)製)2.5質量部に代えて、アクリル系シラン化合物である3−アクリロキシプロピルトリメトキシシラン(KBM−5103、信越化学工業(株)製)5質量部を用いた以外は、実施例1と同様にしてワニスを得、実施例1と同様にしてプリプレグを得た。
エポキシ系シラン化合物である3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業(株)製)2.5質量部、及びスチリル系シラン化合物であるp−スチリルトリメトキシシラン(KBM−1403、信越化学工業(株)製)2.5質量部に代えて、スチリル系シラン化合物であるp−スチリルトリメトキシシラン(KBM−1403、信越化学工業(株)製)5質量部を用いた以外は、実施例1と同様にしてワニスを得、実施例1と同様にしてプリプレグを得た。
エポキシ系シラン化合物である3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業(株)製)2.5質量部、及びスチリル系シラン化合物であるp−スチリルトリメトキシシラン(KBM−1403、信越化学工業(株)製)2.5質量部に代えて、オレフィン系シラン化合物であるオクテニルトリメトキシシラン(KBM−1083、信越化学工業(株)製)5質量部を用いた以外は、実施例1と同様にしてワニスを得、実施例1と同様にしてプリプレグを得た。
エポキシ系シラン化合物である3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業(株)製)2.5質量部、及びスチリル系シラン化合物であるp−スチリルトリメトキシシラン(KBM−1403、信越化学工業(株)製)2.5質量部に代えて、アクリル系シラン化合物であるメタクリロキシオクチルトリメトキシシラン(KBM−5803、信越化学工業(株)製)5質量部を用いた以外は、実施例1と同様にしてワニスを得、実施例1と同様にしてプリプレグを得た。
エポキシ系シラン化合物である3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業(株)製)2.5質量部、及びスチリル系シラン化合物であるp−スチリルトリメトキシシラン(KBM−1403、信越化学工業(株)製)2.5質量部に代えて、オレフィン系シラン化合物であるビニルトリメトキシシラン(KBM−1003、信越化学工業(株)製)5質量部を用いた以外は、実施例1と同様にしてワニスを得、実施例1と同様にしてプリプレグを得た。
上記で得られたプリプレグを、それぞれ1枚、2枚、8枚重ねて12μm厚の電解銅箔(3EC−III、三井金属鉱業(株)製)を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、金属箔張積層板として、絶縁層厚さ0.1mm、0.2mm、0.8mmの銅張積層板を得た。
絶縁信頼性はHAST(高度加速寿命試験)による線間絶縁信頼性試験により評価した。まず、上記で得られた銅張積層板(絶縁層厚さ0.2mm)からサブトラクティブ法によりプリント配線板(L/S=100/100μm)を形成した。次に、配線に電源を接続し、温度130℃、湿度85%、印加電圧5VDCの条件で連続湿中絶縁抵抗を評価した。なお、抵抗値1.0×108Ω以下を故障とした。評価基準は下記のとおりとした。
○:500時間以上で故障なし
×:500時間未満で故障あり
結果を表1に示す。
銅張積層板(絶縁層厚さ0.1mm)の銅箔をエッチングにより除去した後に、表面を観察しボイドの有無を評価した。ボイドの発生が認められず良好な外観であった場合を「◎」、ボイドの発生が端部にのみ認められた場合を「○」、ボイドの発生が全面に認められた場合を「×」と評価した。結果を表1に示す。
銅張積層板(50mm×50mm×絶縁層厚さ0.8mm)の片面の半分以外の全銅箔をエッチング除去して試験片を得た。得られた試験片を、プレッシャークッカー試験機(平山製作所社製、PC−3型)で121℃、2気圧で5時間処理し、その後288℃のはんだの中に30秒浸漬した。3つのサンプルに対し、上記試験をそれぞれ行い、浸漬後の膨れの有無を目視で観察し、下記評価基準により、吸湿耐熱性を評価した。
○:異常なし
×:膨れ発生
結果を表1に示す。
Claims (21)
- マレイミド化合物と、炭素間不飽和結合と加水分解性基又は水酸基とを有するシラン化合物と、エポキシ骨格と加水分解性基又は水酸基とを有するシラン化合物と、無機充填材と、を含む樹脂組成物。
- 前記炭素間不飽和結合と加水分解性基又は水酸基とを有するシラン化合物として、スチレン骨格と加水分解性基又は水酸基とを有するシラン化合物、及び/又は、(メタ)アクリル骨格と加水分解性基又は水酸基とを有するシラン化合物を含む、請求項1に記載の樹脂組成物。
- 前記炭素間不飽和結合と加水分解性基又は水酸基とを有するシラン化合物として、スチレン骨格と加水分解性基又は水酸基とを有するシラン化合物を含む、請求項2に記載の樹脂組成物。
- アルケニル置換ナジイミドを更に含む、請求項1〜6のいずれか1項に記載の樹脂組成物。
- シアン酸エステル化合物を更に含む、請求項1〜10のいずれか1項に記載の樹脂組成物。
- 前記無機充填材が、シリカ、アルミナ及び窒化アルミニウムからなる群より選ばれる少なくとも1種を含む、1〜12のいずれか1項に記載の樹脂組成物。
- 前記無機充填材の樹脂組成物における含有量が、樹脂組成物中の樹脂を構成する成分の合計100質量部に対して、100〜1100質量部である、請求項1〜13のいずれか1項に記載の樹脂組成物。
- 前記無機充填材が、前記炭素間不飽和結合と加水分解性基又は水酸基とを有するシラン化合物と、前記エポキシ骨格と加水分解性基又は水酸基とを有するシラン化合物と、により予め表面処理されている、請求項1〜14のいずれか1項に記載の樹脂組成物。
- 基材と、該基材に含浸又は塗布された請求項1〜15のいずれか1項に記載の樹脂組成物と、を備えるプリプレグ。
- 前記基材が、Eガラスクロス、Tガラスクロス、Sガラスクロス、Qガラスクロス及び有機繊維クロスからなる群より選ばれる少なくとも1種である、請求項16に記載のプリプレグ。
- 支持体と、該支持体に塗布された請求項1〜15のいずれか1項に記載の樹脂組成物と、を備えるレジンシート。
- 請求項16及び17に記載のプリプレグ、並びに請求項18に記載のレジンシートからなる群より選ばれる少なくとも1種を1枚以上重ねてなる積層板であって、前記プリプレグ及び前記レジンシートからなる群より選ばれる少なくとも1種に含まれる樹脂組成物の硬化物を含む、積層板。
- 請求項16及び17に記載のプリプレグ、並びに請求項18に記載のレジンシートからなる群より選ばれる少なくとも1種と、前記プリプレグ及び前記レジンシートからなる群より選ばれる少なくとも1種の片面又は両面に配された金属箔と、を有する金属箔張積層板であって、前記プリプレグ及び前記レジンシートからなる群より選ばれる少なくとも1種に含まれる樹脂組成物の硬化物を含む金属箔張積層板。
- 絶縁層と、前記絶縁層の表面に形成された導体層とを含むプリント配線板であって、前記絶縁層が、請求項1〜15のいずれか1項に記載の樹脂組成物を含むプリント配線板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015135206 | 2015-07-06 | ||
JP2015135206 | 2015-07-06 | ||
PCT/JP2016/069754 WO2017006897A1 (ja) | 2015-07-06 | 2016-07-04 | 樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017006897A1 true JPWO2017006897A1 (ja) | 2018-04-26 |
JP6760281B2 JP6760281B2 (ja) | 2020-09-23 |
Family
ID=57686161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017527445A Active JP6760281B2 (ja) | 2015-07-06 | 2016-07-04 | 樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10676579B2 (ja) |
EP (1) | EP3321320B1 (ja) |
JP (1) | JP6760281B2 (ja) |
KR (1) | KR102502314B1 (ja) |
CN (1) | CN107735450B (ja) |
TW (1) | TWI698483B (ja) |
WO (1) | WO2017006897A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107849361B (zh) * | 2015-07-06 | 2020-10-16 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、树脂片、覆金属箔层叠板和印刷电路板 |
WO2019127387A1 (zh) * | 2017-12-29 | 2019-07-04 | 广东生益科技股份有限公司 | 树脂组合物、预浸料、层压板以及覆金属箔层压板 |
JP2020169291A (ja) * | 2019-04-05 | 2020-10-15 | 信越化学工業株式会社 | スラリー組成物、該スラリー組成物の硬化物、該硬化物を用いた基板、フィルム、及びプリプレグ |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10292033A (ja) * | 1997-01-30 | 1998-11-04 | Toyo Electric Mfg Co Ltd | 含浸用樹脂組成物 |
JP2006124425A (ja) * | 2004-10-26 | 2006-05-18 | Chukyo Yushi Kk | 水系樹脂エマルション |
JP2011530618A (ja) * | 2008-08-08 | 2011-12-22 | ヘンケル コーポレイション | 低温硬化組成物 |
JP2014185222A (ja) * | 2013-03-22 | 2014-10-02 | Mitsubishi Gas Chemical Co Inc | 樹脂組成物、プリプレグ、積層板及びプリント配線板 |
WO2015060266A1 (ja) * | 2013-10-25 | 2015-04-30 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層シート及び金属箔張り積層板 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03173332A (ja) | 1989-11-30 | 1991-07-26 | Fuji Electric Co Ltd | ギヤードモータ |
IL111497A (en) * | 1993-12-08 | 2001-01-28 | Rohco Inc Mcgean | Seelan preparations are useful as adhesives |
JP3173332B2 (ja) | 1995-03-13 | 2001-06-04 | 新神戸電機株式会社 | 金属箔張り積層板の製造法 |
WO2004045846A1 (ja) * | 2002-11-20 | 2004-06-03 | Tomoegawa Paper Co., Ltd. | フレキシブル金属積層体及び耐熱性接着剤組成物 |
US20050182203A1 (en) * | 2004-02-18 | 2005-08-18 | Yuuichi Sugano | Novel cyanate ester compound, flame-retardant resin composition, and cured product thereof |
US20060136620A1 (en) * | 2004-12-16 | 2006-06-22 | Yu-Pin Chou | Data transfer interface apparatus and method thereof |
JP4952585B2 (ja) * | 2006-01-23 | 2012-06-13 | 日立化成工業株式会社 | 接着剤組成物、フィルム状接着剤、接着シート、並びにそれを用いた半導体装置 |
JP5303854B2 (ja) | 2006-10-24 | 2013-10-02 | 日立化成株式会社 | 新規なセミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
JP5024205B2 (ja) | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | プリプレグ及び積層板 |
TW201204548A (en) | 2010-02-05 | 2012-02-01 | Sumitomo Bakelite Co | Prepreg, laminate, printed wiring board, and semiconductor device |
JP2013001807A (ja) | 2011-06-16 | 2013-01-07 | Panasonic Corp | 電子回路基板材料用樹脂組成物、プリプレグ及び積層板 |
JP2013027022A (ja) * | 2011-07-26 | 2013-02-04 | Ricoh Co Ltd | 撮像装置およびタイミング信号制御方法 |
JP5895156B2 (ja) | 2011-12-19 | 2016-03-30 | パナソニックIpマネジメント株式会社 | 熱硬化性樹脂組成物、封止材およびそれらを用いた電子部品 |
JP5842664B2 (ja) * | 2012-02-23 | 2016-01-13 | 日立金属株式会社 | 熱硬化性接着剤組成物並びにそれを用いた耐熱接着フィルム、積層フィルム、配線フィルム及び多層配線フィルム |
JP2013216884A (ja) | 2012-03-14 | 2013-10-24 | Hitachi Chemical Co Ltd | 熱硬化性樹脂組成物、プリプレグ及び積層板 |
EP3401357A1 (en) * | 2012-07-25 | 2018-11-14 | Toray Industries, Inc. | Prepreg and carbon fiber reinforced composite material |
JP6314830B2 (ja) | 2012-10-19 | 2018-04-25 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層板、及びプリント配線板 |
US10138393B2 (en) | 2013-01-15 | 2018-11-27 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board |
WO2016032795A1 (en) * | 2014-08-29 | 2016-03-03 | 3M Innovative Properties Company | Inductively curable composition |
-
2016
- 2016-07-04 WO PCT/JP2016/069754 patent/WO2017006897A1/ja active Application Filing
- 2016-07-04 JP JP2017527445A patent/JP6760281B2/ja active Active
- 2016-07-04 KR KR1020177033676A patent/KR102502314B1/ko active IP Right Grant
- 2016-07-04 CN CN201680040032.1A patent/CN107735450B/zh active Active
- 2016-07-04 EP EP16821366.8A patent/EP3321320B1/en active Active
- 2016-07-04 US US15/737,504 patent/US10676579B2/en active Active
- 2016-07-06 TW TW105121336A patent/TWI698483B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10292033A (ja) * | 1997-01-30 | 1998-11-04 | Toyo Electric Mfg Co Ltd | 含浸用樹脂組成物 |
JP2006124425A (ja) * | 2004-10-26 | 2006-05-18 | Chukyo Yushi Kk | 水系樹脂エマルション |
JP2011530618A (ja) * | 2008-08-08 | 2011-12-22 | ヘンケル コーポレイション | 低温硬化組成物 |
JP2014185222A (ja) * | 2013-03-22 | 2014-10-02 | Mitsubishi Gas Chemical Co Inc | 樹脂組成物、プリプレグ、積層板及びプリント配線板 |
WO2015060266A1 (ja) * | 2013-10-25 | 2015-04-30 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層シート及び金属箔張り積層板 |
Also Published As
Publication number | Publication date |
---|---|
KR102502314B1 (ko) | 2023-02-21 |
EP3321320B1 (en) | 2019-10-02 |
CN107735450B (zh) | 2020-08-11 |
EP3321320A1 (en) | 2018-05-16 |
US20180155514A1 (en) | 2018-06-07 |
KR20180026375A (ko) | 2018-03-12 |
EP3321320A4 (en) | 2018-06-27 |
TW201706356A (zh) | 2017-02-16 |
TWI698483B (zh) | 2020-07-11 |
CN107735450A (zh) | 2018-02-23 |
WO2017006897A1 (ja) | 2017-01-12 |
US10676579B2 (en) | 2020-06-09 |
JP6760281B2 (ja) | 2020-09-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7121354B2 (ja) | 樹脂組成物、プリプレグ、樹脂シート、積層樹脂シート、積層板、金属箔張積層板、及びプリント配線板 | |
TWI642718B (zh) | 樹脂組成物、印刷電路板用絕緣層及印刷電路板 | |
JP7116370B2 (ja) | 樹脂組成物、プリプレグ、レジンシート、積層板、及びプリント配線板 | |
US11195638B2 (en) | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | |
WO2017006898A1 (ja) | 樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板 | |
JP6774032B2 (ja) | 樹脂組成物、該樹脂組成物を用いたプリプレグ又はレジンシート並びにそれらを用いた積層板及びプリント配線板 | |
JP6760281B2 (ja) | 樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板 | |
JPWO2017006887A1 (ja) | 樹脂組成物、該樹脂組成物を用いたプリプレグ又はレジンシート並びにそれらを用いた積層板及びプリント配線板 | |
JP6914194B2 (ja) | プリント配線板の製造方法、及び樹脂組成物 | |
JP2017195334A (ja) | プリント配線板用樹脂組成物、プリプレグ、レジンシート、積層板、金属箔張積層板、及びプリント配線板 | |
JPWO2017006895A1 (ja) | 樹脂組成物、それを用いたプリプレグ、レジンシート、積層板、及びプリント配線板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190529 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200129 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200326 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200804 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200817 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6760281 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |