JPWO2016208609A1 - 導電性基板 - Google Patents
導電性基板 Download PDFInfo
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- JPWO2016208609A1 JPWO2016208609A1 JP2017524936A JP2017524936A JPWO2016208609A1 JP WO2016208609 A1 JPWO2016208609 A1 JP WO2016208609A1 JP 2017524936 A JP2017524936 A JP 2017524936A JP 2017524936 A JP2017524936 A JP 2017524936A JP WO2016208609 A1 JPWO2016208609 A1 JP WO2016208609A1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
- B32B27/205—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents the fillers creating voids or cavities, e.g. by stretching
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/28—Multiple coating on one surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/962—Capacitive touch switches
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- Electroplating And Plating Baths Therefor (AREA)
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Abstract
Description
透明基材と、
前記透明基材の少なくとも一方の面上に形成された銅層とを有し、
前記銅層は、前記銅層の膜厚が0.5μmの場合の表面抵抗値が0.07Ω/□以下である導電性基板を提供する。
(導電性基板の製造方法)
次に本実施形態の導電性基板の製造方法の一構成例について説明する。
透明基材の少なくとも一方の面上に銅層を形成する銅層形成工程。
そして、銅層形成工程において形成する銅層としては、膜厚が0.5μmの場合の表面抵抗値が0.07Ω/□以下である銅層を用いることができる。
(銅層形成工程)
そして、銅層は既述のように、銅薄膜層を有することが好ましい。また、銅層は銅薄膜層と銅めっき層とを有することもできる。このため、銅層形成工程は、例えば乾式めっき法により銅薄膜層を形成する工程を有することができる。また、銅層形成工程は、乾式めっき法により銅薄膜層を形成する工程と、該銅薄膜層上に銅めっき層を形成する工程と、を有していてもよい。
(黒化層形成工程)
黒化層形成工程について説明する。
(密着層形成工程)
次に、密着層形成工程について説明する。
(パターニング工程)
本実施形態の導電性基板の製造方法で得られる導電性基板は例えばタッチパネル等の各種用途に用いることができる。そして、各種用途に用いる場合には、本実施形態の導電性基板に含まれる銅層がパターニングされていることが好ましい。なお、黒化層や密着層を設ける場合は、黒化層や密着層についてもパターニングされていることが好ましい。銅層、場合によってはさらに黒化層、密着層は、例えば所望の配線パターンにあわせてパターニングすることができ、銅層、場合によってはさらに黒化層、密着層は同じ形状にパターニングされていることが好ましい。
[実施例1]
(予備試験)
まず、予備試験として、透明基材上に、銅薄膜層及び銅めっき層を含む銅層を成膜した導電性基板であって、銅層の厚さが0.1μm〜0.5μmの評価試料を作製し、評価試料の表面抵抗値の評価を行った。以下に評価試料の作製手順を説明する。
(導電性基板の作製)
そこで、銅層の厚さを0.5μmとし、銅層上にさらに黒化層を形成した点以外は予備試験の場合と同様の条件で導電性基板を作製した。
[実施例2]
(予備試験)
銅めっき層形成工程において5槽のめっき槽を用い、銅層の厚さが表1に示したように0.2μm〜0.5μmになるようにして銅めっき層を成膜した点以外は実施例1の予備試験と同様に評価試料を作製した。
(導電性基板の作製)
そこで、銅層の厚さを0.5μmとし、銅層上にさらに黒化層を形成した点以外は予備試験の場合と同様の条件で導電性基板を作製した。
[実施例3]
(予備試験)
銅めっき層形成工程において銅めっき液への添加剤としてDDAC−SO2共重合体にかえてヤヌスグリーンBを用い、銅層の厚さが表1に示したように0.2μm〜0.5μmになるようにして銅めっき層を成膜した点以外は実施例1の予備試験と同様に評価試料を作製した。
(導電性基板の作製)
そこで、銅層の厚さを0.5μmとし、銅層上にさらに黒化層を形成した点以外は予備試験の場合と同様の条件で導電性基板を作製した。
[比較例1]
(予備試験)
銅めっき層形成工程において銅めっき液への添加剤としてヤヌスグリーンBを用い、5槽のめっき槽を用い、銅層の厚さが表1に示したように0.2μm〜0.5μmになるようにして銅めっき層を成膜した点以外は実施例1と同様に評価試料を作製した。
(導電性基板の作製)
そこで、銅層の厚さを0.5μmとし、銅層上にさらに黒化層を形成した点以外は予備試験の場合と同様の条件で導電性基板を作製した。
11 透明基材
13、13A、13B、23、231、232、43A、43B 銅層
Claims (4)
- 透明基材と、
前記透明基材の少なくとも一方の面上に形成された銅層とを有し、
前記銅層は、前記銅層の膜厚が0.5μmの場合の表面抵抗値が0.07Ω/□以下である導電性基板。 - 前記銅層は、湿式法で成膜された銅めっき層を含んでおり、
前記銅めっき層は単一のめっき槽を用いて成膜される請求項1に記載の導電性基板。 - 前記銅層は、電気めっき法により成膜された銅めっき層を含んでおり、
前記銅めっき層を成膜する際、添加剤としてジアリルジメチルアンモニウムクロライド重合体を用いる請求項1または2に記載の導電性基板。 - 前記ジアリルジメチルアンモニウムクロライド重合体としてジアリルジメチルアンモニウムクロライド−SO2共重合体を用いる請求項3に記載の導電性基板。
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Application Number | Priority Date | Filing Date | Title |
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JP2015129285 | 2015-06-26 | ||
JP2015129285 | 2015-06-26 | ||
PCT/JP2016/068463 WO2016208609A1 (ja) | 2015-06-26 | 2016-06-22 | 導電性基板 |
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JPWO2016208609A1 true JPWO2016208609A1 (ja) | 2018-04-26 |
JP6949409B2 JP6949409B2 (ja) | 2021-10-13 |
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US (1) | US20180142369A1 (ja) |
JP (1) | JP6949409B2 (ja) |
CN (1) | CN107636209B (ja) |
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CN108089771A (zh) * | 2018-02-13 | 2018-05-29 | 京东方科技集团股份有限公司 | 触控基板、显示面板、显示装置 |
JP7230564B2 (ja) * | 2019-02-15 | 2023-03-01 | 住友金属鉱山株式会社 | 銅張積層板の製造方法 |
JP7343280B2 (ja) * | 2019-02-15 | 2023-09-12 | 住友金属鉱山株式会社 | 銅張積層板の製造方法 |
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TWI754729B (zh) * | 2017-04-20 | 2022-02-11 | 日商上村工業股份有限公司 | 電鍍銅浴及電鍍銅皮膜 |
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JP6949409B2 (ja) | 2021-10-13 |
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WO2016208609A1 (ja) | 2016-12-29 |
TW201709224A (zh) | 2017-03-01 |
TWI751111B (zh) | 2022-01-01 |
CN107636209A (zh) | 2018-01-26 |
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