JPWO2016152165A1 - Polycarbonate resin composition and optical molded article - Google Patents
Polycarbonate resin composition and optical molded article Download PDFInfo
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- JPWO2016152165A1 JPWO2016152165A1 JP2016547118A JP2016547118A JPWO2016152165A1 JP WO2016152165 A1 JPWO2016152165 A1 JP WO2016152165A1 JP 2016547118 A JP2016547118 A JP 2016547118A JP 2016547118 A JP2016547118 A JP 2016547118A JP WO2016152165 A1 JPWO2016152165 A1 JP WO2016152165A1
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- Prior art keywords
- polycarbonate resin
- group
- carbon atoms
- general formula
- resin composition
- Prior art date
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- 229920005668 polycarbonate resin Polymers 0.000 title claims abstract description 110
- 239000004431 polycarbonate resin Substances 0.000 title claims abstract description 110
- 239000000203 mixture Substances 0.000 title claims abstract description 75
- 230000003287 optical effect Effects 0.000 title claims description 9
- -1 phosphite compound Chemical class 0.000 claims abstract description 53
- 239000000155 melt Substances 0.000 claims abstract description 34
- 239000004034 viscosity adjusting agent Substances 0.000 claims abstract description 21
- 238000005259 measurement Methods 0.000 claims abstract description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 62
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 39
- 229920000570 polyether Polymers 0.000 claims description 39
- 125000000217 alkyl group Chemical group 0.000 claims description 36
- 150000001875 compounds Chemical class 0.000 claims description 34
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 18
- 125000002947 alkylene group Chemical group 0.000 claims description 13
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 11
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 5
- 125000005119 alkyl cycloalkyl group Chemical group 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 claims description 5
- AESQDCMZHBUWPN-UHFFFAOYSA-N 4h-1,3,2-dioxaphosphinine Chemical compound C1OPOC=C1 AESQDCMZHBUWPN-UHFFFAOYSA-N 0.000 claims description 4
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 4
- 125000002102 aryl alkyloxo group Chemical group 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 125000004434 sulfur atom Chemical group 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 claims 2
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 claims 1
- 238000002834 transmittance Methods 0.000 description 32
- 239000008188 pellet Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 238000000465 moulding Methods 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 150000002334 glycols Chemical class 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 6
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical group CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 5
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical group OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 3
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 3
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 2
- LEVFXWNQQSSNAC-UHFFFAOYSA-N 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-hexoxyphenol Chemical compound OC1=CC(OCCCCCC)=CC=C1C1=NC(C=2C=CC=CC=2)=NC(C=2C=CC=CC=2)=N1 LEVFXWNQQSSNAC-UHFFFAOYSA-N 0.000 description 2
- MWCBGWLCXSUTHK-UHFFFAOYSA-N 2-methylbutane-1,4-diol Chemical group OCC(C)CCO MWCBGWLCXSUTHK-UHFFFAOYSA-N 0.000 description 2
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 2
- 0 COC(C(*)=CC1*)=C(*c2c(*)c(I)cc(*)c2OPONc2c(*)c(*)c(*)c(*)c2)C1=* Chemical compound COC(C(*)=CC1*)=C(*c2c(*)c(I)cc(*)c2OPONc2c(*)c(*)c(*)c(*)c2)C1=* 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 150000001565 benzotriazoles Chemical class 0.000 description 2
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical group CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 125000005027 hydroxyaryl group Chemical group 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- LYQLMTKQQIXGAB-UHFFFAOYSA-N 2,6-ditert-butyl-4-[3-[(1,9-ditert-butyl-3,7-dimethyl-5h-benzo[d][1,3,2]benzodioxaphosphocin-11-yl)oxy]propyl]phenol Chemical compound O1C=2C(C(C)(C)C)=CC(C)=CC=2CC2=CC(C)=CC(C(C)(C)C)=C2OP1OCCCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 LYQLMTKQQIXGAB-UHFFFAOYSA-N 0.000 description 1
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 1
- ITLDHFORLZTRJI-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-5-octoxyphenol Chemical compound OC1=CC(OCCCCCCCC)=CC=C1N1N=C2C=CC=CC2=N1 ITLDHFORLZTRJI-UHFFFAOYSA-N 0.000 description 1
- BGMDITYJRIBDIK-UHFFFAOYSA-N 2-[2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-hexoxyphenyl]phenol Chemical compound CCCCCCOc1ccc(-c2nc(nc(n2)-c2ccccc2)-c2ccccc2)c(c1)-c1ccccc1O BGMDITYJRIBDIK-UHFFFAOYSA-N 0.000 description 1
- PQJZHMCWDKOPQG-UHFFFAOYSA-N 2-anilino-2-oxoacetic acid Chemical compound OC(=O)C(=O)NC1=CC=CC=C1 PQJZHMCWDKOPQG-UHFFFAOYSA-N 0.000 description 1
- MSXXDBCLAKQJQT-UHFFFAOYSA-N 2-tert-butyl-6-methyl-4-[3-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxypropyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCCOP2OC3=C(C=C(C=C3C=3C=C(C=C(C=3O2)C(C)(C)C)C(C)(C)C)C(C)(C)C)C(C)(C)C)=C1 MSXXDBCLAKQJQT-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- CKNCVRMXCLUOJI-UHFFFAOYSA-N 3,3'-dibromobisphenol A Chemical compound C=1C=C(O)C(Br)=CC=1C(C)(C)C1=CC=C(O)C(Br)=C1 CKNCVRMXCLUOJI-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- RSSGMIIGVQRGDS-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-phenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=CC=C1 RSSGMIIGVQRGDS-UHFFFAOYSA-N 0.000 description 1
- BRPSWMCDEYMRPE-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxyphenyl)ethyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=C(O)C=C1 BRPSWMCDEYMRPE-UHFFFAOYSA-N 0.000 description 1
- OVVCSFQRAXVPGT-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclopentyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCC1 OVVCSFQRAXVPGT-UHFFFAOYSA-N 0.000 description 1
- QHJPJZROUNGTRJ-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)octan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCCCCC)C1=CC=C(O)C=C1 QHJPJZROUNGTRJ-UHFFFAOYSA-N 0.000 description 1
- GRCXOICCGCYITB-UHFFFAOYSA-N 4-[2-[2-[2-(4-hydroxyphenyl)-3-methylphenyl]propan-2-yl]-6-methylphenyl]phenol Chemical compound CC1=CC=CC(C(C)(C)C=2C(=C(C)C=CC=2)C=2C=CC(O)=CC=2)=C1C1=CC=C(O)C=C1 GRCXOICCGCYITB-UHFFFAOYSA-N 0.000 description 1
- RQTDWDATSAVLOR-UHFFFAOYSA-N 4-[3,5-bis(4-hydroxyphenyl)phenyl]phenol Chemical compound C1=CC(O)=CC=C1C1=CC(C=2C=CC(O)=CC=2)=CC(C=2C=CC(O)=CC=2)=C1 RQTDWDATSAVLOR-UHFFFAOYSA-N 0.000 description 1
- XHDKBYRAWKLXGE-UHFFFAOYSA-N 4-[4,6-bis(4-hydroxyphenyl)-4,6-dimethylhept-1-en-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)CC(C)(C=1C=CC(O)=CC=1)CC(=C)C1=CC=C(O)C=C1 XHDKBYRAWKLXGE-UHFFFAOYSA-N 0.000 description 1
- ISAVYTVYFVQUDY-UHFFFAOYSA-N 4-tert-Octylphenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C=C1 ISAVYTVYFVQUDY-UHFFFAOYSA-N 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- JJHHIJFTHRNPIK-UHFFFAOYSA-N Diphenyl sulfoxide Chemical compound C=1C=CC=CC=1S(=O)C1=CC=CC=C1 JJHHIJFTHRNPIK-UHFFFAOYSA-N 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- NSGDYZCDUPSTQT-UHFFFAOYSA-N N-[5-bromo-1-[(4-fluorophenyl)methyl]-4-methyl-2-oxopyridin-3-yl]cycloheptanecarboxamide Chemical compound Cc1c(Br)cn(Cc2ccc(F)cc2)c(=O)c1NC(=O)C1CCCCCC1 NSGDYZCDUPSTQT-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 125000000051 benzyloxy group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])O* 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 150000004790 diaryl sulfoxides Chemical class 0.000 description 1
- 150000001987 diarylethers Chemical class 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 150000002314 glycerols Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical class OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000004115 pentoxy group Chemical group [*]OC([H])([H])C([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0065—Manufacturing aspects; Material aspects
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Light Guides In General And Applications Therefor (AREA)
Abstract
ポリカーボネート樹脂(A)100重量部に対して、溶融粘度調整剤(B)0.005〜3.0重量部及び亜リン酸エステル系化合物(C)0.005〜1.0重量部を配合してなるポリカーボネート樹脂組成物であって、測定温度220℃、せん断速度10sec−1における溶融粘度をηとしたとき、ポリカーボネート樹脂組成物の溶融粘度η1とポリカーボネート樹脂(A)の溶融粘度η2の比η1/η2が、0.45≦η1/η2≦0.95を満たすことを特徴とする、ポリカーボネート樹脂組成物。For 100 parts by weight of the polycarbonate resin (A), 0.005 to 3.0 parts by weight of the melt viscosity modifier (B) and 0.005 to 1.0 parts by weight of the phosphite compound (C) are blended. A polycarbonate resin composition comprising a polycarbonate resin composition having a melt viscosity η1 and a polycarbonate resin (A) having a melt viscosity η2 of η1, where η is the melt viscosity at a measurement temperature of 220 ° C. and a shear rate of 10 sec−1. / Η2 satisfies 0.45 ≦ η1 / η2 ≦ 0.95, wherein the polycarbonate resin composition.
Description
本発明は、ポリカーボネート樹脂組成物および光学用成形品に関する。 The present invention relates to a polycarbonate resin composition and an optical molded article.
ポリカーボネート樹脂は、耐衝撃性、耐熱性、透明性等に優れていることから、従来、導光板、各種レンズ、銘板等の成形品に利用されている。 Polycarbonate resins are excellent in impact resistance, heat resistance, transparency, and the like, and are conventionally used for molded products such as light guide plates, various lenses, and nameplates.
例えば、特許文献1には、重量平均分子量と数平均分子量との比が特定範囲に規定された芳香族ポリカーボネート樹脂に、安定剤及び離型剤が配合された導光板用芳香族ポリカーボネート樹脂組成物が開示されている。 For example, Patent Document 1 discloses an aromatic polycarbonate resin composition for a light guide plate, in which a stabilizer and a release agent are blended with an aromatic polycarbonate resin in which a ratio of a weight average molecular weight to a number average molecular weight is defined in a specific range. Is disclosed.
特許文献2には、ポリカーボネート樹脂に、ポリスチレン及び1種のリン系酸化防止剤が配合された光学用成形品用ポリカーボネート樹脂組成物が開示されている。 Patent Document 2 discloses a polycarbonate resin composition for optical molded articles in which a polycarbonate resin and polystyrene and one phosphorus-based antioxidant are blended.
その他、例えば、特許文献3〜6に開示されているように、優れた光線透過率を得て、光学部材の輝度を向上させるべくポリカーボネート樹脂と他の材料とを併用した樹脂組成物が各種提案されている。 In addition, for example, as disclosed in Patent Documents 3 to 6, various proposals have been made on resin compositions using polycarbonate resin and other materials in combination to obtain excellent light transmittance and improve the brightness of optical members. Has been.
しかしながら、特許文献3〜6に開示のポリカーボネート樹脂組成物は、近年の導光板の材料としての要求(特に、薄肉成形を行うため高温で成形加工した場合でも光線透過率の低下が無い等の要求)を充分に満足し得るものではない。 However, the polycarbonate resin composition disclosed in Patent Documents 3 to 6 is a recent requirement as a light guide plate material (particularly a requirement that there is no decrease in light transmittance even when molding is performed at a high temperature for thin-wall molding). ) Cannot be fully satisfied.
本発明は、ポリカーボネート樹脂が本来有する耐熱性、機械的強度等の特性が損なわれることがなく、熱安定性に優れ、光線透過率が高く、しかも高温で成形加工した場合でも光線透過率に優れるポリカーボネート樹脂組成物を提供する。 The present invention does not impair the heat resistance, mechanical strength, etc. inherent to the polycarbonate resin, has excellent thermal stability, high light transmittance, and excellent light transmittance even when molded at high temperatures. A polycarbonate resin composition is provided.
本発明者らは、かかる課題を解決するために鋭意検討を行った結果、ポリカーボネート樹脂(A)に溶融粘度調整剤(B)及び亜リン酸エステル系化合物(C)を配合してなるポリカーボネート樹脂組成物において、当該ポリカーボネート樹脂組成物の溶融粘度とそれに含まれるポリカーボネート樹脂(A)の溶融粘度の比が特定範囲の値を満たすようにすることにより、高温で成形した場合でも光線透過率の低下が無く色相ならびに輝度の良好なポリカーボネート樹脂組成物が得られることを見出し、本発明を完成した。 As a result of intensive studies to solve such problems, the present inventors have obtained a polycarbonate resin comprising a polycarbonate resin (A) and a melt viscosity modifier (B) and a phosphite compound (C). In the composition, the ratio of the melt viscosity of the polycarbonate resin composition to the melt viscosity of the polycarbonate resin (A) contained therein satisfies a value within a specific range, thereby reducing the light transmittance even when molded at a high temperature. The present inventors have found that a polycarbonate resin composition having no hue and good brightness and brightness can be obtained.
すなわち、本発明は、ポリカーボネート樹脂(A)100重量部に対して、溶融粘度調整剤(B)0.005〜3.0重量部及び亜リン酸エステル系化合物(C)0.005〜1.0重量部を配合してなるポリカーボネート樹脂組成物であって、測定温度220℃、せん断速度10sec−1における溶融粘度をηとしたとき、ポリカーボネート樹脂組成物の溶融粘度η1とポリカーボネート樹脂(A)の溶融粘度η2の比η1/η2が、0.45≦η1/η2≦0.95を満たすことを特徴とする、ポリカーボネート樹脂組成物およびそれを成形してなる光学用成形品を提供するものである。That is, the present invention relates to 0.005 to 3.0 parts by weight of the melt viscosity modifier (B) and 0.005 to 1. A polycarbonate resin composition containing 0 part by weight, where the melt viscosity at a measurement temperature of 220 ° C. and a shear rate of 10 sec −1 is η, the melt viscosity η1 of the polycarbonate resin composition and the polycarbonate resin (A) The ratio η1 / η2 of the melt viscosity η2 satisfies 0.45 ≦ η1 / η2 ≦ 0.95, and a polycarbonate resin composition and an optical molded article formed by molding the polycarbonate resin composition are provided. .
本発明のポリカーボネート樹脂組成物は、ポリカーボネート樹脂が本来有する耐熱性、機械的強度等の特性が損なわれることがなく、熱安定性及び耐候性に優れ、しかも高温で成形加工した場合でも光線透過率に優れたものである。よって、例えば厚さ0.3mm程度の薄型の導光板であっても、色相が変化して外観が低下することや、高温成形を経て樹脂そのものが劣化することが少なく、工業的利用価値が極めて高い。 The polycarbonate resin composition of the present invention does not impair the heat resistance, mechanical strength and other properties inherent to the polycarbonate resin, is excellent in thermal stability and weather resistance, and also has a light transmittance even when molded at a high temperature. It is an excellent one. Therefore, even if it is a thin light guide plate with a thickness of about 0.3 mm, for example, the hue changes and the appearance deteriorates, and the resin itself is less likely to deteriorate through high temperature molding. high.
以下に、実施の形態を詳細に説明する。ただし、必要以上に詳細な説明は省略する場合がある。例えば、既によく知られた事項の詳細説明や実質的に同一の構成に対する重複説明を省略する場合がある。これは、以下の説明が不必要に冗長になるのを避け、当業者の理解を容易にするためである。 Hereinafter, embodiments will be described in detail. However, more detailed explanation than necessary may be omitted. For example, detailed descriptions of already well-known matters and repeated descriptions for substantially the same configuration may be omitted. This is to avoid the following description from becoming unnecessarily redundant and to facilitate understanding by those skilled in the art.
なお、発明者らは当業者が本発明を充分に理解するために以下の説明を提供するのであって、これらによって請求の範囲に記載の主題を限定することを意図するものではない。 In addition, the inventors provide the following explanation for those skilled in the art to fully understand the present invention, and are not intended to limit the subject matter described in the claims.
本発明にて使用されるポリカーボネート樹脂組成物は、ポリカーボネート樹脂(A)と、溶融粘度調整剤(B)と、亜リン酸エステル系化合物(C)とを配合したものである。なお、本発明にて使用されるポリカーボネート樹脂組成物には、必要に応じてその他の成分を配合してもよい。 The polycarbonate resin composition used in the present invention comprises a polycarbonate resin (A), a melt viscosity modifier (B), and a phosphite compound (C). In addition, you may mix | blend another component with the polycarbonate resin composition used by this invention as needed.
本発明にて使用されるポリカーボネート樹脂(A)は、種々のジヒドロキシジアリール化合物とホスゲンとを反応させるホスゲン法、又はジヒドロキシジアリール化合物とジフェニルカーボネート等の炭酸エステルとを反応させるエステル交換法によって得られる重合体である。代表例としては、2,2−ビス(4−ヒドロキシフェニル)プロパン(ビスフェノールA)から製造されたポリカーボネート樹脂が挙げられる。 The polycarbonate resin (A) used in the present invention is obtained by a phosgene method in which various dihydroxydiaryl compounds and phosgene are reacted or a transesterification method obtained by reacting a dihydroxydiaryl compound and a carbonate such as diphenyl carbonate. It is a coalescence. A typical example is a polycarbonate resin produced from 2,2-bis (4-hydroxyphenyl) propane (bisphenol A).
前記ジヒドロキシジアリール化合物としては、ビスフェノールAの他に、例えば、ビス(4−ヒドロキシフェニル)メタン、1,1−ビス(4−ヒドロキシフェニル)エタン、2,2−ビス(4−ヒドロキシフェニル)ブタン、2,2−ビス(4−ヒドロキシフェニル)オクタン、ビス(4−ヒドロキシフェニル)フェニルメタン、2,2−ビス(4−ヒドロキシフェニル−3−メチルフェニル)プロパン、1,1−ビス(4−ヒドロキシ−3−第三ブチルフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3−ブロモフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3、5−ジブロモフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジクロロフェニル)プロパン等のビス(ヒドロキシアリール)アルカン類;1,1−ビス(4−ヒドロキシフェニル)シクロペンタン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン等のビス(ヒドロキシアリール)シクロアルカン類;4,4´−ジヒドロキシジフェニルエーテル、4,4´−ジヒドロキシ−3,3´−ジメチルジフェニルエーテル等のジヒドロキシジアリールエーテル類;4,4´−ジヒドロキシジフェニルスルフィド等のジヒドロキシジアリールスルフィド類;4,4´−ジヒドロキシジフェニルスルホキシド、4,4´−ジヒドロキシ−3,3´−ジメチルジフェニルスルホキシド等のジヒドロキシジアリールスルホキシド類;4,4´−ジヒドロキシジフェニルスルホン、4,4´−ジヒドロキシ−3,3´−ジメチルジフェニルスルホン等のジヒドロキシジアリールスルホン類が挙げられ、これらは単独で又は2種類以上を混合して使用される。これらの他にも、ピペラジン、ジピペリジルハイドロキノン、レゾルシン、4,4´−ジヒドロキシジフェニル等を混合して使用してもよい。 As the dihydroxydiaryl compound, in addition to bisphenol A, for example, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl) butane, 2,2-bis (4-hydroxyphenyl) octane, bis (4-hydroxyphenyl) phenylmethane, 2,2-bis (4-hydroxyphenyl-3-methylphenyl) propane, 1,1-bis (4-hydroxy) -3-tert-butylphenyl) propane, 2,2-bis (4-hydroxy-3-bromophenyl) propane, 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, 2,2- Bis (hydroxyaryl) alkanes such as bis (4-hydroxy-3,5-dichlorophenyl) propane; -Bis (hydroxyaryl) cycloalkanes such as bis (4-hydroxyphenyl) cyclopentane and 1,1-bis (4-hydroxyphenyl) cyclohexane; 4,4'-dihydroxydiphenyl ether, 4,4'-dihydroxy-3 Dihydroxy diaryl ethers such as 4,3'-dimethyldiphenyl ether; dihydroxy diaryl sulfides such as 4,4'-dihydroxydiphenyl sulfide; 4,4'-dihydroxydiphenyl sulfoxide, 4,4'-dihydroxy-3,3'-dimethyl Dihydroxy diaryl sulfoxides such as diphenyl sulfoxide; dihydroxy diaryl sulfones such as 4,4′-dihydroxydiphenyl sulfone and 4,4′-dihydroxy-3,3′-dimethyldiphenyl sulfone; These may be used alone or in admixture of two or more. In addition to these, piperazine, dipiperidyl hydroquinone, resorcin, 4,4′-dihydroxydiphenyl, and the like may be mixed and used.
さらに、前記ジヒドロキシジアリール化合物と、例えば以下に示す3価以上のフェノール化合物とを混合して使用してもよい。 Furthermore, you may mix and use the said dihydroxy diaryl compound and the trivalent or more phenol compound shown below, for example.
前記3価以上のフェノール化合物としては、例えば、フロログルシン、4,6−ジメチル−2,4,6−トリ−(4−ヒドロキシフェニル)−ヘプテン、2,4,6−ジメチル−2,4,6−トリ−(4−ヒドロキシフェニル)−ヘプタン、1,3,5−トリ−(4−ヒドロキシフェニル)−ベンゾール、1,1,1−トリ−(4−ヒドロキシフェニル)−エタン及び2,2−ビス−[4,4−(4,4´−ジヒドロキシジフェニル)−シクロヘキシル]−プロパン等が挙げられる。 Examples of the trivalent or higher phenol compound include phloroglucin, 4,6-dimethyl-2,4,6-tri- (4-hydroxyphenyl) -heptene, 2,4,6-dimethyl-2,4,6. -Tri- (4-hydroxyphenyl) -heptane, 1,3,5-tri- (4-hydroxyphenyl) -benzol, 1,1,1-tri- (4-hydroxyphenyl) -ethane and 2,2- Bis- [4,4- (4,4′-dihydroxydiphenyl) -cyclohexyl] -propane and the like.
ポリカーボネート樹脂(A)の粘度平均分子量は、10000〜100000であることが好ましく、12000〜30000であることがより好ましい。なお、このようなポリカーボネート樹脂(A)を製造する際には分子量調節剤、触媒等を必要に応じて使用することができる。 The viscosity average molecular weight of the polycarbonate resin (A) is preferably 10,000 to 100,000, and more preferably 12,000 to 30,000. In addition, when manufacturing such a polycarbonate resin (A), a molecular weight regulator, a catalyst, etc. can be used as needed.
本発明にて使用される溶融粘度調整剤(B)は、ポリカーボネート樹脂組成物を成形加工する際に、ある種滑剤のように振る舞ってポリカーボネート樹脂の剪断粘度(せん断粘度)を低下させることにより、剪断発熱が必要以上に発生するのを抑制し、ひいてはポリカーボネート樹脂中の発熱を低減乃至抑制することができる作用を備えるものを意味する。 The melt viscosity modifier (B) used in the present invention behaves like a certain type of lubricant when molding a polycarbonate resin composition to reduce the shear viscosity (shear viscosity) of the polycarbonate resin. It means that it is possible to suppress occurrence of shearing heat generation more than necessary, and thus to have an action capable of reducing or suppressing heat generation in the polycarbonate resin.
溶融粘度調整剤(B)としては、測定温度220℃、せん断速度10sec−1における溶融粘度をηとしたとき、ポリカーボネート樹脂組成物の溶融粘度η1とポリカーボネート樹脂(A)の溶融粘度η2の比η1/η2が、0.45≦η1/η2≦0.95を満たすように調整することができるものであれば、特に限定されるものではないが、代表的には、下記一般式(1)で表されるポリエーテル誘導体等が挙げられる。その他、シリコーン系化合物、グリセリン系化合物、ペンタエリスリトール系化合物等も挙げられる。The melt viscosity modifier (B), measured temperature 220 ° C., when the melt viscosity at a shear rate of 10 sec -1 was eta, the ratio of the melt viscosity of the melt viscosity of the polycarbonate resin composition .eta.1 and polycarbonate resin (A) η2 η1 / Η2 is not particularly limited as long as it can be adjusted to satisfy 0.45 ≦ η1 / η2 ≦ 0.95, but typically, the following general formula (1) And polyether derivatives represented. Other examples include silicone compounds, glycerin compounds, pentaerythritol compounds, and the like.
一般式(1):
RO−(X−O)m(Y−O)n−R’ (1)
(式中、RおよびR’は、それぞれ独立して水素原子または炭素数1〜30のアルキル基を示し、Xは、炭素数2〜4のアルキレン基を、Yは、炭素数3〜5の分岐アルキレン基を、m及びnは、それぞれ独立して、3〜60の整数を示し、m+nは、8〜90の整数を示す。)General formula (1):
RO- (X-O) m (YO) n-R '(1)
(In the formula, R and R ′ each independently represent a hydrogen atom or an alkyl group having 1 to 30 carbon atoms, X represents an alkylene group having 2 to 4 carbon atoms, and Y represents an alkyl group having 3 to 5 carbon atoms. In the branched alkylene group, m and n each independently represents an integer of 3 to 60, and m + n represents an integer of 8 to 90.)
一般式(1)で表されるポリエーテル誘導体としては、テトラメチレングリコールユニットと1−エチルエチレングリコールユニットからなる変性グリコール(例えば、HO−(CH2CH2CH2CH2O)24(CH2CH(C2H5)O)13−H等)、例えば、日油(株)製のDCD−2000(重量平均分子量2000)等として商業的に入手可能である。一般式(1)で表されるポリエーテル誘導体の重量平均分子量は、1000〜4000であるのが好ましい。Examples of the polyether derivative represented by the general formula (1) include a modified glycol consisting of a tetramethylene glycol unit and a 1-ethylethylene glycol unit (for example, HO— (CH 2 CH 2 CH 2 CH 2 O) 24 (CH 2 CH (C 2 H 5) O ) 13 -H , etc.), for example, manufactured by NOF CORPORATION of DCD-2000 (weight average molecular weight 2000) is commercially available as such. The weight average molecular weight of the polyether derivative represented by the general formula (1) is preferably 1000 to 4000.
また、ポリエーテル誘導体としては、一般式(1)で表されるポリエーテル誘導体のうち、下記一般式(2)、一般式(3)又は一般式(4)で表されるポリエーテル誘導体が好適である。
一般式(2):
HO−(CH2CH2CH2CH2O)m(CH2CH2CH(CH3)CH2O)n−H (2)
(式中、m及びnは、それぞれ独立して、3〜60の整数を示し、m+nは、8〜90の整数を示す。)As the polyether derivative, among the polyether derivatives represented by the general formula (1), a polyether derivative represented by the following general formula (2), general formula (3) or general formula (4) is preferable. It is.
General formula (2):
HO- (CH 2 CH 2 CH 2 CH 2 O) m (CH 2 CH 2 CH (CH 3) CH 2 O) n-H (2)
(In the formula, m and n each independently represent an integer of 3 to 60, and m + n represents an integer of 8 to 90.)
一般式(2)で表されるポリエーテル誘導体としては、テトラメチレングリコールユニットと2−メチルテトラメチレングリコールユニットからなる変性グリコール(例えば、HO−(CH2CH2CH2CH2O)22(CH2CH2CH(CH3)CH2O)5−H等)が挙げられ、例えば、保土谷化学工業(株)製のPTG−L1000(重量平均分子量1000)、PTG−L2000(重量平均分子量2000)、又はPTG−L3000(重量平均分子量3000)等として商業的に入手可能である。一般式(2)で表されるポリエーテル誘導体の重量平均分子量は、1000〜4000であるのが好ましい。Examples of the polyether derivative represented by the general formula (2) include a modified glycol composed of a tetramethylene glycol unit and a 2-methyltetramethylene glycol unit (for example, HO— (CH 2 CH 2 CH 2 CH 2 O) 22 (CH 2 CH 2 CH (CH 3) CH 2 O) 5 -H , etc.) can be mentioned, for example, Hodogaya Chemical Co., Ltd. PTG-L1000 (weight average molecular weight 1000), PTG-L2000 (weight average molecular weight 2000 ) Or PTG-L3000 (weight average molecular weight 3000) or the like. The weight average molecular weight of the polyether derivative represented by the general formula (2) is preferably 1000 to 4000.
一般式(3):
C4H9O−(CH2CH2)m(CH2CH(CH3)O)n−H (3)
(式中、m及びnは、それぞれ独立して、3〜60の整数を示し、m+nは、8〜90の整数を示す。)General formula (3):
C 4 H 9 O- (CH 2 CH 2) m (CH 2 CH (CH 3) O) n-H (3)
(In the formula, m and n each independently represent an integer of 3 to 60, and m + n represents an integer of 8 to 90.)
一般式(3)で表されるポリエーテル誘導体としては、エチレングリコールユニットとプロピレングリコールユニットからなる変性グリコール(例えば、C4H9O−(CH2CH2O)21(CH2CH(CH3)O)14−HやC4H9O−(CH2CH2O)30(CH2CH(CH3)O)30−H等)が好適であり、例えば、ユニルーブ60MB−26I(重量平均分子量1700)やユニルーブ50MB−72(重量平均分子量3000)等が商業的に入手可能である。一般式(3)で表されるポリエーテル誘導体の重量平均分子量は、1000〜4000であるのが好ましい。Examples of the polyether derivative represented by the general formula (3) include a modified glycol consisting of an ethylene glycol unit and a propylene glycol unit (for example, C 4 H 9 O— (CH 2 CH 2 O) 21 (CH 2 CH (CH 3 ) O) 14 -H and C 4 H 9 O- (CH 2 CH 2 O) 30 (CH 2 CH (CH 3) O) 30 -H , etc.) are preferable, for example, Unilube 60MB-26I (weight average Molecular weight 1700) and Unilube 50MB-72 (weight average molecular weight 3000) are commercially available. The weight average molecular weight of the polyether derivative represented by the general formula (3) is preferably 1000 to 4000.
一般式(4):
HO−(CH2CH2O)m(CH2CH(CH3)O)n−H (4)
(式中、m及びnは、それぞれ独立して、3〜60の整数を示し、m+nは、8〜90の整数を示す。)General formula (4):
HO- (CH 2 CH 2 O) m (CH 2 CH (CH 3) O) n-H (4)
(In the formula, m and n each independently represent an integer of 3 to 60, and m + n represents an integer of 8 to 90.)
一般式(4)で表されるポリエーテル誘導体としては、エチレングリコールユニットとプロピレングリコールユニットからなる変性グリコール(例えば、HO−(CH2CH2O)17(CH2CH(CH3)O)17−Hが好適であり、例えば、ユニルーブ50DE−25(重量平均分子量1750)等が商業的に入手可能である。一般式(4)で表されるポリエーテル誘導体の重量平均分子量は、1000〜4000であるのが好ましい。Examples of the polyether derivative represented by the general formula (4) include a modified glycol consisting of an ethylene glycol unit and a propylene glycol unit (for example, HO— (CH 2 CH 2 O) 17 (CH 2 CH (CH 3 ) O) 17. -H is suitable, for example, Unilube 50DE-25 (weight average molecular weight 1750) is commercially available, etc. The weight average molecular weight of the polyether derivative represented by the general formula (4) is 1000 to 4000. Is preferred.
これまで、直鎖のポリオキシアルキレングリコールを添加してポリカーボネート樹脂の光線透過率を向上させることが試みられてきたが、該ポリオキシアルキレングリコールは、耐熱性が不充分であるので、該ポリオキシアルキレングリコールを配合したポリカーボネート樹脂組成物を高温で成形すると、成形品の輝度や光線透過率が低下する。これに対して、前記一般式(1)で表されるポリエーテル誘導体のような溶融粘度調整剤は、2官能性のランダム共重合体であり、耐熱性が高く、該一般式(1)で表される特定のポリエーテル誘導体を配合したポリカーボネート樹脂組成物を高温で成形した成形品は、輝度や光線透過率が高い。 Up to now, attempts have been made to improve the light transmittance of polycarbonate resin by adding linear polyoxyalkylene glycol. However, since the polyoxyalkylene glycol has insufficient heat resistance, When a polycarbonate resin composition containing an alkylene glycol is molded at a high temperature, the brightness and light transmittance of the molded product are lowered. On the other hand, the melt viscosity modifier such as the polyether derivative represented by the general formula (1) is a bifunctional random copolymer and has high heat resistance, and the general formula (1) A molded product obtained by molding a polycarbonate resin composition containing a specific polyether derivative represented at a high temperature has high luminance and light transmittance.
また、本発明にて使用される溶融粘度調整剤(B)は、適度な親油性を有することから、ポリカーボネート樹脂(A)との相溶性にも優れるので、該溶融粘度調整剤(B)を配合したポリカーボネート樹脂組成物から得られる成形品の透明性も向上する。このような溶融粘度調整剤(B)に用いられるポリエーテル誘導体の重量平均分子量は、1000〜4000、さらには2000〜3000であることが好ましい。ポリエーテル誘導体の重量平均分子量が1000〜4000の場合は、光線透過率の充分な向上効果が望め、かつ曇化率が上昇することなく光線透過率が低下する恐れもない。 Moreover, since the melt viscosity modifier (B) used in the present invention has an appropriate lipophilicity, it is also excellent in compatibility with the polycarbonate resin (A). Therefore, the melt viscosity modifier (B) is used. The transparency of the molded product obtained from the blended polycarbonate resin composition is also improved. The weight average molecular weight of the polyether derivative used for such a melt viscosity modifier (B) is preferably 1000 to 4000, more preferably 2000 to 3000. When the weight average molecular weight of the polyether derivative is 1000 to 4000, a sufficient effect of improving the light transmittance can be expected, and the light transmittance does not decrease without increasing the fogging rate.
ポリエーテル誘導体の量は、ポリカーボネート樹脂(A)100重量部に対して、0.005〜3.0重量部であり、0.1〜1.5重量部が好ましく、さらに0.3〜1.2重量部であることが好ましい。ポリエーテル誘導体の量が0.005重量部未満の場合は、光線透過率及び色相の向上効果が不充分である。逆にポリエーテル誘導体の量が3.0重量部を超える場合は、曇化率が上昇して光線透過率が低下してしまう。 The amount of the polyether derivative is 0.005 to 3.0 parts by weight with respect to 100 parts by weight of the polycarbonate resin (A), preferably 0.1 to 1.5 parts by weight, and further 0.3 to 1. 2 parts by weight is preferred. When the amount of the polyether derivative is less than 0.005 parts by weight, the effect of improving light transmittance and hue is insufficient. On the other hand, when the amount of the polyether derivative exceeds 3.0 parts by weight, the clouding rate increases and the light transmittance decreases.
本発明におけるポリカーボネート樹脂組成物には、特定のポリエーテル誘導体等の溶融粘度調整剤(B)と共に、亜リン酸エステル系化合物(C)が配合されている。このように、溶融粘度調整剤(B)と亜リン酸エステル系化合物(C)とを同時に配合することにより、ポリカーボネート樹脂組成物の剪断熱を極力発生させることを防止でき、ポリカーボネート樹脂(A)が本来有する耐熱性、機械的強度等の特性が損なわれることがなく、高温成形した場合であっても光線透過率が向上したポリカーボネート樹脂組成物が得られる。 The polycarbonate resin composition in the present invention contains a phosphite compound (C) together with a melt viscosity modifier (B) such as a specific polyether derivative. Thus, by simultaneously blending the melt viscosity modifier (B) and the phosphite compound (C), it is possible to prevent the polycarbonate resin composition from generating shear heat as much as possible, and the polycarbonate resin (A) Thus, a polycarbonate resin composition having improved light transmittance even when molded at a high temperature can be obtained without impairing the inherent properties such as heat resistance and mechanical strength.
本発明にて使用される亜リン酸エステル系化合物(C)としては、例えば、下記一般式(5)で表される化合物が特に好適である。 As the phosphite compound (C) used in the present invention, for example, a compound represented by the following general formula (5) is particularly suitable.
前記一般式(5)において、R1は、炭素数1〜20のアルキル基であるが、さらには、炭素数1〜10のアルキル基であることが好ましい。In the general formula (5), R 1 is an alkyl group having 1 to 20 carbon atoms, and more preferably an alkyl group having 1 to 10 carbon atoms.
一般式(5)で表される化合物としては、例えば、トリフェニルホスファイト、トリクレジルホスファイト、トリス(2,4−ジ−t−ブチルフェニル)フォスファイト、トリスノニルフェニルホスファイト等が挙げられる。これらの中でも、特にトリス(2,4−ジ−t−ブチルフェニル)フォスファイトが好適であり、例えば、BASF社製のイルガフォス168(「イルガフォス」はビーエーエスエフ ソシエタス・ヨーロピアの登録商標)として商業的に入手可能である。 Examples of the compound represented by the general formula (5) include triphenyl phosphite, tricresyl phosphite, tris (2,4-di-t-butylphenyl) phosphite, and trisnonylphenyl phosphite. It is done. Among these, tris (2,4-di-t-butylphenyl) phosphite is particularly suitable. For example, Irgafos 168 manufactured by BASF ("Irgafos" is a registered trademark of BASF Societas Europea) is commercially available. Is available.
前記亜リン酸エステル系化合物としては、前記一般式(5)で表される化合物の他にも、例えば、下記一般式(6)で表される化合物が挙げられる。 Examples of the phosphite compound include compounds represented by the following general formula (6), in addition to the compounds represented by the general formula (5).
一般式(6)において、R2、R3、R5及びR6は、それぞれ独立して、水素原子、炭素数1〜8のアルキル基、炭素数5〜8のシクロアルキル基、炭素数6〜12のアルキルシクロアルキル基、炭素数7〜12のアラルキル基又はフェニル基を示す。In General Formula (6), R 2 , R 3 , R 5 and R 6 are each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 5 to 8 carbon atoms, or 6 carbon atoms. -12 alkylcycloalkyl group, a C7-12 aralkyl group, or a phenyl group is shown.
ここで、炭素数1〜8のアルキル基としては、例えば、メチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、i−ブチル基、sec−ブチル基、t−ブチル基、t−ペンチル基、i−オクチル基、t−オクチル基、2−エチルヘキシル基等が挙げられる。炭素数5〜8のシクロアルキル基としては、例えば、シクロペンチル基、シクロヘキシル基、シクロヘプチル基、シクロオクチル基等が挙げられる。炭素数6〜12のアルキルシクロアルキル基としては、例えば、1−メチルシクロペンチル基、1−メチルシクロヘキシル基、1−メチル−4−i−プロピルシクロヘキシル基等が挙げられる。炭素数7〜12のアラルキル基としては、例えば、ベンジル基、α−メチルベンジル基、α,α−ジメチルベンジル基等が挙げられる。 Here, examples of the alkyl group having 1 to 8 carbon atoms include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, sec-butyl group, and t-butyl. Group, t-pentyl group, i-octyl group, t-octyl group, 2-ethylhexyl group and the like. Examples of the cycloalkyl group having 5 to 8 carbon atoms include a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, and a cyclooctyl group. Examples of the alkylcycloalkyl group having 6 to 12 carbon atoms include 1-methylcyclopentyl group, 1-methylcyclohexyl group, 1-methyl-4-i-propylcyclohexyl group and the like. Examples of the aralkyl group having 7 to 12 carbon atoms include benzyl group, α-methylbenzyl group, α, α-dimethylbenzyl group and the like.
前記R2、R3及びR5は、それぞれ独立して、炭素数1〜8のアルキル基、炭素数5〜8のシクロアルキル基又は炭素数6〜12のアルキルシクロアルキル基であることが好ましい。特に、R2及びR5は、それぞれ独立して、t−ブチル基、t−ペンチル基、t−オクチル基等のt−アルキル基、シクロヘキシル基又は1−メチルシクロヘキシル基であることが好ましい。特に、R3は、メチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、i−ブチル基、sec−ブチル基、t−ブチル基、t−ペンチル基等の炭素数1〜5のアルキル基であることが好ましく、メチル基、t−ブチル基又はt−ペンチル基であることがさらに好ましい。R 2 , R 3 and R 5 are each independently preferably an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 5 to 8 carbon atoms or an alkylcycloalkyl group having 6 to 12 carbon atoms. . In particular, R 2 and R 5 are preferably each independently a t-alkyl group such as a t-butyl group, a t-pentyl group, or a t-octyl group, a cyclohexyl group, or a 1-methylcyclohexyl group. In particular, R 3 is a carbon number such as a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, an i-butyl group, a sec-butyl group, a t-butyl group, or a t-pentyl group. It is preferably an alkyl group of 1 to 5, more preferably a methyl group, a t-butyl group or a t-pentyl group.
前記R6は、水素原子、炭素数1〜8のアルキル基又は炭素数5〜8のシクロアルキル基であることが好ましく、水素原子、メチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、i−ブチル基、sec−ブチル基、t−ブチル基、t−ペンチル基等の炭素数1〜5のアルキル基であることがさらに好ましい。R 6 is preferably a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a cycloalkyl group having 5 to 8 carbon atoms, a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, or an i-propyl group. , An n-butyl group, an i-butyl group, a sec-butyl group, a t-butyl group, a t-pentyl group, or the like, more preferably an alkyl group having 1 to 5 carbon atoms.
一般式(6)において、R4は、水素原子又は炭素数1〜8のアルキル基を示す。炭素数1〜8のアルキル基としては、例えば、前記R2、R3、R5及びR6の説明にて例示したアルキル基が挙げられる。特に、R4は、水素原子又は炭素数1〜5のアルキル基であることが好ましく、水素原子又はメチル基であることがさらに好ましい。In the general formula (6), R 4 represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms. As a C1-C8 alkyl group, the alkyl group illustrated by description of the said R < 2 >, R < 3 >, R < 5 > and R < 6 > is mentioned, for example. In particular, R 4 is preferably a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and more preferably a hydrogen atom or a methyl group.
一般式(6)において、Xは、単結合、硫黄原子又は式:−CHR7−で表される基を示す。ここで、式:−CHR7−中のR7は、水素原子、炭素数1〜8のアルキル基又は炭素数5〜8のシクロアルキル基を示す。炭素数1〜8のアルキル基及び炭素数5〜8のシクロアルキル基としては、例えば、それぞれ前記R2、R3、R5及びR6の説明にて例示したアルキル基及びシクロアルキル基が挙げられる。特に、Xは、単結合、メチレン基、又はメチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、i−ブチル基、t−ブチル基等で置換されたメチレン基であることが好ましく、単結合であることがさらに好ましい。In General Formula (6), X represents a single bond, a sulfur atom, or a group represented by the formula: —CHR 7 —. Here, R 7 in the formula: —CHR 7 — represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a cycloalkyl group having 5 to 8 carbon atoms. Examples of the alkyl group having 1 to 8 carbon atoms and the cycloalkyl group having 5 to 8 carbon atoms include the alkyl groups and cycloalkyl groups exemplified in the description of R 2 , R 3 , R 5 and R 6 , respectively. It is done. In particular, X is a single bond, a methylene group, or a methylene group substituted with a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, an i-butyl group, a t-butyl group, or the like. It is preferably a single bond, and more preferably a single bond.
一般式(6)において、Aは、炭素数1〜8のアルキレン基又は式:*−COR8−で表される基を示す。炭素数1〜8のアルキレン基としては、例えば、メチレン基、エチレン基、プロピレン基、ブチレン基、ペンタメチレン基、ヘキサメチレン基、オクタメチレン基、2,2−ジメチル−1,3−プロピレン基等が挙げられ、好ましくはプロピレン基である。また、式:*−COR8−におけるR8は、単結合又は炭素数1〜8のアルキレン基を示す。R8を示す炭素数1〜8のアルキレン基としては、例えば、前記Aの説明にて例示したアルキレン基が挙げられる。R8は、単結合又はエチレン基であることが好ましい。また、式:*−COR8−における*は、酸素側の結合手であり、カルボニル基がフォスファイト基の酸素原子と結合していることを示す。In General Formula (6), A represents an alkylene group having 1 to 8 carbon atoms or a group represented by the formula: * —COR 8 —. Examples of the alkylene group having 1 to 8 carbon atoms include a methylene group, an ethylene group, a propylene group, a butylene group, a pentamethylene group, a hexamethylene group, an octamethylene group, and a 2,2-dimethyl-1,3-propylene group. And is preferably a propylene group. R 8 in the formula: * —COR 8 — represents a single bond or an alkylene group having 1 to 8 carbon atoms. Examples of the alkylene group having 1 to 8 carbon atoms which indicates the R 8, for example, alkylene groups exemplified in the description of the A. R 8 is preferably a single bond or an ethylene group. Further, * in the formula: * —COR 8 — is a bond on the oxygen side and indicates that the carbonyl group is bonded to the oxygen atom of the phosphite group.
一般式(6)において、Y及びZは、いずれか一方がヒドロキシル基、炭素数1〜8のアルコキシ基又は炭素数7〜12のアラルキルオキシ基を示し、もう一方が水素原子又は炭素数1〜8のアルキル基を示す。炭素数1〜8のアルコキシ基としては、例えば、メトキシ基、エトキシ基、プロポキシ基、t−ブトキシ基、ペンチルオキシ基等が挙げられる。炭素数7〜12のアラルキルオキシ基としては、例えば、ベンジルオキシ基、α−メチルベンジルオキシ基、α,α−ジメチルベンジルオキシ基等が挙げられる。炭素数1〜8のアルキル基としては、例えば、前記R2、R3、R5及びR6の説明にて例示したアルキル基が挙げられる。In General Formula (6), any one of Y and Z represents a hydroxyl group, an alkoxy group having 1 to 8 carbon atoms, or an aralkyloxy group having 7 to 12 carbon atoms, and the other represents a hydrogen atom or 1 to 1 carbon atoms. 8 represents an alkyl group. As a C1-C8 alkoxy group, a methoxy group, an ethoxy group, a propoxy group, t-butoxy group, a pentyloxy group etc. are mentioned, for example. Examples of the aralkyloxy group having 7 to 12 carbon atoms include benzyloxy group, α-methylbenzyloxy group, α, α-dimethylbenzyloxy group and the like. As a C1-C8 alkyl group, the alkyl group illustrated by description of the said R < 2 >, R < 3 >, R < 5 > and R < 6 > is mentioned, for example.
一般式(6)で表される化合物としては、例えば、2,4,8,10−テトラ−t−ブチル−6−〔3−(3−メチル−4−ヒドロキシ−5−t−ブチルフェニル)プロポキシ〕ジベンゾ〔d,f〕〔1,3,2〕ジオキサホスフェピン、6−[3−(3,5−ジ−t−ブチル−4−ヒドロキシフェニル)プロポキシ]−2,4,8,10−テトラ−t−ブチルジベンゾ[d,f][1,3,2]ジオキサホスフェピン、6−[3−(3,5−ジ−t−ブチル−4−ヒドロキシフェニル)プロポキシ]−4,8−ジ−t−ブチル−2,10−ジメチル−12H−ジベンゾ[d,g][1,3,2]ジオキサホスホシン、6−[3−(3,5−ジ−t−ブチル−4−ヒドロキシフェニル)プロピオニルオキシ]−4,8−ジ−t−ブチル−2,10−ジメチル−12H−ジベンゾ[d,g][1,3,2]ジオキサホスホシン等が挙げられる。これらの中でも、特に光学特性が求められる分野に、得られるポリカーボネート樹脂組成物を用いる場合には、2,4,8,10−テトラ−t−ブチル−6−〔3−(3−メチル−4−ヒドロキシ−5−t−ブチルフェニル)プロポキシ〕ジベンゾ〔d,f〕〔1,3,2〕ジオキサホスフェピンが好適であり、例えば、住友化学(株)製のスミライザーGP(「スミライザー」は登録商標)として商業的に入手可能である。 Examples of the compound represented by the general formula (6) include 2,4,8,10-tetra-t-butyl-6- [3- (3-methyl-4-hydroxy-5-t-butylphenyl). Propoxy] dibenzo [d, f] [1,3,2] dioxaphosphine, 6- [3- (3,5-di-t-butyl-4-hydroxyphenyl) propoxy] -2,4,8 , 10-Tetra-t-butyldibenzo [d, f] [1,3,2] dioxaphosphine, 6- [3- (3,5-di-t-butyl-4-hydroxyphenyl) propoxy] -4,8-di-t-butyl-2,10-dimethyl-12H-dibenzo [d, g] [1,3,2] dioxaphosphocin, 6- [3- (3,5-di-t -Butyl-4-hydroxyphenyl) propionyloxy] -4,8-di-t-butyl-2, 0-dimethyl -12H- dibenzo [d, g] [1,3,2] dioxaphosphocin, and the like. Among these, 2,4,8,10-tetra-t-butyl-6- [3- (3-methyl-4) is particularly used when the obtained polycarbonate resin composition is used in a field where optical properties are required. -Hydroxy-5-t-butylphenyl) propoxy] dibenzo [d, f] [1,3,2] dioxaphosphine is suitable, for example, Sumitizer GP ("Smilizer") manufactured by Sumitomo Chemical Co., Ltd. Is commercially available as a registered trademark.
前記亜リン酸エステル系化合物(C)としては、前記一般式(5)で表される化合物及び前記一般式(6)で表される化合物の他にも、例えば、一般式(7)で表される化合物が好適に使用され得る。 Examples of the phosphite compound (C) include, in addition to the compound represented by the general formula (5) and the compound represented by the general formula (6), for example, represented by the general formula (7). The compound to be used can be preferably used.
一般式(7)で表される化合物としては、例えば、(株)ADEKA製のアデカスタブPEP−36(「アデカスタブ」は登録商標)が商業的に入手可能である。 As the compound represented by the general formula (7), for example, ADEKA STAB PEP-36 (“ADEKA STAB” is a registered trademark) manufactured by ADEKA Corporation is commercially available.
亜リン酸エステル系化合物(C)の量は、ポリカーボネート樹脂(A)100重量部に対して、0.005〜1.0重量部であり、0.01〜0.5重量部が好ましく、さらに0.02〜0.1重量部であることが好ましい。亜リン酸エステル系化合物(C)の量が0.005重量部未満の場合は、光線透過率及び色相の向上効果が不充分である。逆に亜リン酸エステル系化合物(C)の量が1.0重量部を超える場合も、光線透過率及び色相の向上効果が不充分である。 The amount of the phosphite compound (C) is 0.005 to 1.0 part by weight, preferably 0.01 to 0.5 part by weight, based on 100 parts by weight of the polycarbonate resin (A). It is preferable that it is 0.02-0.1 weight part. When the amount of the phosphite compound (C) is less than 0.005 parts by weight, the light transmittance and hue are not sufficiently improved. Conversely, when the amount of the phosphite compound (C) exceeds 1.0 part by weight, the effect of improving light transmittance and hue is insufficient.
以上の成分に加えて、実施の形態に係るポリカーボネート樹脂組成物へは、例えば、得られるポリカーボネート樹脂組成物の耐候性をより向上させる成分である紫外線吸収剤をポリカーボネート樹脂組成物を成形して得られる成形品の用途に応じて適宜用いることができる。 In addition to the above components, for example, the polycarbonate resin composition according to the embodiment is obtained by molding a polycarbonate resin composition with an ultraviolet absorber that is a component that further improves the weather resistance of the obtained polycarbonate resin composition. It can use suitably according to the use of the molded article.
紫外線吸収剤としては、例えば、ベンゾトリアゾール系化合物、トリアジン系化合物、ベンゾフェノン系化合物、シュウ酸アニリド系化合物等の、ポリカーボネート樹脂に通常配合される紫外線吸収剤を、単独で又は2種以上を組み合わせて用いることができる。 As the ultraviolet absorber, for example, an ultraviolet absorber usually blended in a polycarbonate resin, such as a benzotriazole-based compound, a triazine-based compound, a benzophenone-based compound, or an oxalic acid anilide-based compound, may be used alone or in combination of two or more. Can be used.
ベンゾトリアゾール系化合物としては、例えば、ベンゾトリアゾール系化合物としては、2−(2−ヒドロキシ−5−t−オクチルフェニル)ベンゾトリアゾール、2−(3−tert−butyl−2−hydroxy−5−methylphenyl)−5−chloro−2H−benzotriazole、2−(3,5−di−tert−pentyl−2−hydroxyphenyl)−2H−benzotriazole、2−(2H−benzotriazole−2−yl)−4−methyl−6−(3,4,5,6−tetrahydrophthalimidylmethyl)phenol、2−(2−hydroxy−4−octyloxyphenyl)−2H−benzotriazole、2−(2−hydroxy−5−tert−octylphenyl)−2H−benzotriazole、2−[2’−hydroxy−3,5−di(1,1−dimethylbenzyl)phenyl]−2H−benzotriazole、2,2’−Methylenbis[6−(2H−benzotriazol−2−yl)4−(1,1,3,3−tetramethylbutyl)phenol]などが挙げられる。なかでも、特に、2−(2−ヒドロキシ−5−t−オクチルフェニル)ベンゾトリアゾール等が好適であり、例えば、BASF社製のTINUVIN 329(TINUVINは登録商標)、シプロ化成(株)製のシーソーブ709、ケミプロ化成(株)製のケミソーブ79等が商業的に入手可能である。 Examples of benzotriazole compounds include 2- (2-hydroxy-5-tert-octylphenyl) benzotriazole and 2- (3-tert-butyl-2-hydroxy-5-methylphenyl) as benzotriazole compounds. -5-chloro-2H-benzotriazole, 2- (3,5-di-tert-pentyl-2-hydroxyphenyl) -2H-benzotriazole, 2- (2H-benzotriazole-2-yl) -4-methyl-6- ( 3,4,5,6-tetrahydrophthalmylmethyl) phenol, 2- (2-hydroxy-4-octyloxyphenyl) -2H-benzotriazole, 2- (2- hydroxy-5-tert-octylphenyl) -2H-benzotriazole, 2- [2′-hydroxy-3,5-di (1,1-dimethylbenzyl) phenyl] -2H-benzotriazole, 2,2′-methylen [6] 2H-benzotriazol-2-yl) 4- (1,1,3,3-tetramethylbutyl) phenol] and the like. Of these, 2- (2-hydroxy-5-t-octylphenyl) benzotriazole and the like are particularly suitable. For example, TINUVIN 329 (TINUVIN is a registered trademark) manufactured by BASF, and Seasorb manufactured by Cypro Kasei Co., Ltd. 709, Chemisorb 79 manufactured by Chemipro Kasei Co., Ltd. and the like are commercially available.
トリアジン系化合物としては、例えば、2,4−ジフェニル−6−(2−ヒドロキシフェニル−4−ヘキシルオキシフェニル)1,3,5−トリアジン、2−[4,6−ビス(2,4−ジメチルフェニル)−1,3,5−トリアジン−2−イル]−5−(オクチルオキシ)フェノール、2−(4,6−ジフェニル−1,3,5−トリアジン−2−イル)−5−[(ヘキシル)オキシ]フェノール等が挙げられ、例えば、BASF社製のTINUVIN 1577等が商業的に入手可能である。 Examples of the triazine compound include 2,4-diphenyl-6- (2-hydroxyphenyl-4-hexyloxyphenyl) 1,3,5-triazine, 2- [4,6-bis (2,4-dimethyl). Phenyl) -1,3,5-triazin-2-yl] -5- (octyloxy) phenol, 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-[( Hexyl) oxy] phenol, and the like, for example, TINUVIN 1577 manufactured by BASF Corporation is commercially available.
シュウ酸アニリド系化合物としては、例えば、クラリアントジャパン(株)製のSanduvor VSU等が商業的に入手可能である。 As the oxalic acid anilide compound, for example, Sanduvor VSU manufactured by Clariant Japan Co., Ltd. is commercially available.
ベンゾフェノン系化合物としては、例えば、2、4−dihydroxybenzophenone、2−hydroxy−4−n−octoxybenzophenoneなどが挙げられる。 Examples of the benzophenone-based compounds include 2,4-dihydroxybenzobenzone and 2-hydroxy-4-n-octoxybenzone.
紫外線吸収剤の量は、ポリカーボネート樹脂(A)100重量部に対して0〜1.0重量部であり、0〜0.5重量部であることが好ましい。紫外線吸収剤(D)の量が1.0重量部を超える場合は、得られるポリカーボネート樹脂組成物の初期の色相が低下するおそれがある。また、紫外線吸収剤(D)の量が0.1重量部以上の場合は特に、ポリカーボネート樹脂組成物の耐候性をより向上させる効果が大きく奏される。 The quantity of a ultraviolet absorber is 0-1.0 weight part with respect to 100 weight part of polycarbonate resin (A), and it is preferable that it is 0-0.5 weight part. When the amount of the ultraviolet absorber (D) exceeds 1.0 part by weight, the initial hue of the obtained polycarbonate resin composition may be lowered. Moreover, especially when the quantity of a ultraviolet absorber (D) is 0.1 weight part or more, the effect which improves the weather resistance of a polycarbonate resin composition more is show | played greatly.
さらに、実施の形態に係るポリカーボネート樹脂組成物には、本発明における効果を損なわない範囲で、例えば、他の酸化防止剤、着色剤、離型剤、軟化剤、帯電防止剤、衝撃性改良剤等の各種添加剤、ポリカーボネート樹脂(A)以外のポリマー等が適宜配合されていてもよい。 Furthermore, the polycarbonate resin composition according to the embodiment includes, for example, other antioxidants, colorants, mold release agents, softeners, antistatic agents, impact modifiers, as long as the effects of the present invention are not impaired. Etc., polymers other than the polycarbonate resin (A), and the like may be appropriately blended.
ポリカーボネート樹脂組成物の製造方法には特に限定がなく、ポリカーボネート樹脂(A)、溶融粘度調整剤(B)、および亜リン酸エステル系化合物(C)、必要に応じて前記各種添加剤やポリカーボネート樹脂(A)以外のポリマー等について、各成分の種類及び量を適宜調整し、これらを、例えばタンブラー、リボンブレンダー等の公知の混合機にて混合する方法や、押出機にて溶融混練する方法が挙げられる。これらの方法により、ポリカーボネート樹脂組成物のペレットを容易に得ることができる。 The production method of the polycarbonate resin composition is not particularly limited, and the polycarbonate resin (A), the melt viscosity modifier (B), and the phosphite compound (C), and if necessary, the various additives and the polycarbonate resin. For polymers other than (A), the type and amount of each component are appropriately adjusted, and these are mixed in a known mixer such as a tumbler or ribbon blender, or melt kneaded in an extruder. Can be mentioned. By these methods, pellets of the polycarbonate resin composition can be easily obtained.
前記のごとく得られるポリカーボネート樹脂組成物のペレットの形状及び大きさには特に限定がなく、一般的な樹脂ペレットが有する形状及び大きさであればよい。例えば、ペレットの形状としては、楕円柱状、円柱状等が挙げられる。ペレットの大きさとしては、長さが2〜8mm程度であることが好適であり、楕円柱状の場合、断面楕円の長径が2〜8mm程度、短径が1〜4mm程度であることが好適であり、円柱状の場合、断面円の直径が1〜6mm程度であることが好適である。なお、得られたペレット1つずつがこのような大きさであってもよく、ペレット集合体を形成する全てのペレットがこのような大きさであってもよく、ペレット集合体の平均値がこのような大きさであってもよく、特に限定はない。 The shape and size of the pellets of the polycarbonate resin composition obtained as described above are not particularly limited, and may be any shape and size that general resin pellets have. For example, examples of the shape of the pellet include an elliptical columnar shape and a cylindrical shape. The size of the pellet is preferably about 2 to 8 mm in length, and in the case of an elliptical column, the major axis of the cross-sectional ellipse is about 2 to 8 mm and the minor axis is preferably about 1 to 4 mm. In the case of a columnar shape, the diameter of the cross-sectional circle is preferably about 1 to 6 mm. Each of the obtained pellets may be such a size, all the pellets forming the pellet aggregate may be such a size, and the average value of the pellet aggregate is this Such a size may be sufficient, and there is no limitation in particular.
本発明のポリカーボネート樹脂組成物は、前記のごとく得られるポリカーボネート樹脂組成物を成形してなるものである。 The polycarbonate resin composition of the present invention is formed by molding the polycarbonate resin composition obtained as described above.
本発明のポリカーボネート樹脂組成物の製造方法には特に限定がなく、例えば公知の射出成形法、圧縮成形法等によりポリカーボネート樹脂組成物を成形する方法が挙げられる。 There is no limitation in the manufacturing method of the polycarbonate resin composition of this invention, For example, the method of shape | molding a polycarbonate resin composition by the well-known injection molding method, the compression molding method, etc. is mentioned.
以上のように、本発明の例示として、実施の形態を説明した。しかしながら、本発明における技術は、これに限定されず、適宜、変更、置き換え、付加、省略などを行った実施の形態にも適用可能である。 As described above, the embodiment has been described as an example of the present invention. However, the technology in the present invention is not limited to this, and can also be applied to embodiments in which changes, replacements, additions, omissions, etc. are made as appropriate.
以下に、本発明を実施例により具体的に説明するが、本発明はこれらの実施例に制限されるものではない。なお、特にことわりがない限り、「部」及び「%」はそれぞれ重量基準である。 EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. Unless otherwise specified, “parts” and “%” are based on weight.
原料として以下のものを使用した。
1.ポリカーボネート樹脂(A):
ビスフェノールAと塩化カルボニルとから合成されたポリカーボネート樹脂
カリバー200−80
(商品名、住化スタイロンポリカーボネート(株)製、「カリバー」はスタイロン ユーロップ ゲーエムベーハーの登録商標、粘度平均分子量:15000、以下「PC」という)The following were used as raw materials.
1. Polycarbonate resin (A):
Polycarbonate resin synthesized from bisphenol A and carbonyl chloride Caliber 200-80
(Trade name, manufactured by Sumika Stylon Polycarbonate Co., Ltd., “Caliver” is a registered trademark of Stylon Europ GmbH, viscosity average molecular weight: 15000, hereinafter referred to as “PC”)
2.溶融粘度調整剤(B)(下式のポリエーテル誘導体):
2−1.テトラメチレングリコールユニットと2−メチルテトラメチレングリコールユニットからなる変性グリコール(ポリエーテル誘導体):
HO−(CH2CH2CH2CH2O)22(CH2CH2CH(CH3)CH2O)5−H
PTG−L2000
(商品名、保土谷化学工業(株)製、重量平均分子量:2000、以下「化合物B1」という)2. Melt viscosity modifier (B) (polyether derivative of the following formula):
2-1. Modified glycol (polyether derivative) consisting of a tetramethylene glycol unit and a 2-methyltetramethylene glycol unit:
HO- (CH 2 CH 2 CH 2 CH 2 O) 22 (CH 2 CH 2 CH (CH 3) CH 2 O) 5 -H
PTG-L2000
(Trade name, manufactured by Hodogaya Chemical Co., Ltd., weight average molecular weight: 2000, hereinafter referred to as “compound B1”)
2−2.テトラメチレングリコールユニットと1−エチルエチレングリコールユニットからなる変性グリコール(ポリエーテル誘導体):
HO−(CH2CH2CH2CH2O)24(CH2CH(C2H5)O)13−H
DCD−2000
(商品名、日油(株)製、重量平均分子量:2000、以下「化合物B2」という)2-2. Modified glycol (polyether derivative) comprising a tetramethylene glycol unit and a 1-ethylethylene glycol unit:
HO- (CH 2 CH 2 CH 2 CH 2 O) 24 (CH 2 CH (C 2 H 5) O) 13 -H
DCD-2000
(Trade name, manufactured by NOF Corporation, weight average molecular weight: 2000, hereinafter referred to as “compound B2”)
2−3.エチレングリコールユニットとプロピレングリコールユニットからなる変性グリコール(ポリエーテル誘導体):
C4H9O−(CH2CH2O)30(CH2CH(CH3)O)30−H
ユニルーブ50MB−72
(商品名、日油(株)製、重量平均分子量:3000、以下「化合物B3」という)2-3. Modified glycol (polyether derivative) consisting of ethylene glycol unit and propylene glycol unit:
C 4 H 9 O- (CH 2 CH 2 O) 30 (CH 2 CH (CH 3) O) 30 -H
Unilube 50MB-72
(Trade name, manufactured by NOF Corporation, weight average molecular weight: 3000, hereinafter referred to as “compound B3”)
2−4.エチレングリコールユニットとプロピレングリコールユニットからなる変性グリコール(ポリエーテル誘導体):
C4H9O−(CH2CH2O)21(CH2CH(CH3)O)14−H
ユニルーブ60MB−26I
(商品名、日油(株)製、重量平均分子量:1700、以下「化合物B4」という) 2-4. Modified glycol (polyether derivative) consisting of ethylene glycol unit and propylene glycol unit:
C 4 H 9 O- (CH 2 CH 2 O) 21 (CH 2 CH (CH 3) O) 14 -H
Unilube 60MB-26I
(Trade name, manufactured by NOF Corporation, weight average molecular weight: 1700, hereinafter referred to as “compound B4”)
2−5.エチレングリコールユニットとプロピレングリコールユニットからなる変性グリコール(ポリエーテル誘導体):
HO−(CH2CH2O)17(CH2CH(CH3)O)17−H
ユニルーブ50DE−25
(商品名、日油((株)製、重量平均分子量:1750、以下「化合物B5」という)2-5. Modified glycol (polyether derivative) consisting of ethylene glycol unit and propylene glycol unit:
HO— (CH 2 CH 2 O) 17 (CH 2 CH (CH 3 ) O) 17 —H
UNILOVE 50DE-25
(Trade name, NOF (made by Co., Ltd., weight average molecular weight: 1750, hereinafter referred to as “compound B5”)
3.亜リン酸エステル系化合物(C):
3−1.以下の式で表される、トリス(2,4−ジ−t−ブチルフェニル)フォスファイト3. Phosphite compound (C):
3-1. Tris (2,4-di-t-butylphenyl) phosphite represented by the following formula
(商品名、BASF社製、以下「化合物C1」という)
3−2.以下の式で表される、2,4,8,10−テトラ−t−ブチル−6−〔3−(3−メチル−4−ヒドロキシ−5−t−ブチルフェニル)プロポキシ〕ジベンゾ〔d,f〕〔1,3,2〕ジオキサホスフェピン
(Trade name, manufactured by BASF, hereinafter referred to as “Compound C1”)
3-2. 2,4,8,10-tetra-tert-butyl-6- [3- (3-methyl-4-hydroxy-5-tert-butylphenyl) propoxy] dibenzo [d, f ] [1, 3, 2] Dioxaphosphepine
(商品名、住友化学(株)製、以下「化合物C2」という)
(Trade name, manufactured by Sumitomo Chemical Co., Ltd., hereinafter referred to as “Compound C2”)
3−3.以下の式で表される、3,9−ビス(2,6−ジ−tert−ブチル−4−メチルフェノキシ)−2,4,8,10−テトラオキサ−3,9−ジホスファスピロ[5,5]ウンデカ 3-3. 3,9-bis (2,6-di-tert-butyl-4-methylphenoxy) -2,4,8,10-tetraoxa-3,9-diphosphaspiro represented by the following formula [5,5] Undeka
(商品名、(株)ADEKA製、以下「化合物C3」という)
(Trade name, manufactured by ADEKA Corporation, hereinafter referred to as “Compound C3”)
(実施例1〜17及び比較例1〜6)
前記各原料を、表1および表2に示す割合にて一括してタンブラーに投入し、10分間乾式混合した後、二軸押出機((株)日本製鋼所製、TEX30α)を用いて、溶融温度220℃にて溶融混練し、ポリカーボネート樹脂組成物のペレットを得た。なお、実施例及び比較例で得られたペレットは、ほぼ楕円柱状であり、ペレット100個からなる集合体は、各々、長さの平均値が約5.1mm〜約5.4mm、断面楕円の長径の平均値が約4.1mm〜約4.3mm、短径の平均値が約2.2mm〜約2.3mmであった。(Examples 1-17 and Comparative Examples 1-6)
The raw materials are collectively put into a tumbler at the ratios shown in Tables 1 and 2 and dry mixed for 10 minutes, and then melted using a twin-screw extruder (manufactured by Nippon Steel Works, TEX30α). Melt kneading was performed at a temperature of 220 ° C. to obtain pellets of a polycarbonate resin composition. In addition, the pellets obtained in the examples and comparative examples are substantially elliptical cylinders, and the aggregates composed of 100 pellets each have an average length of about 5.1 mm to about 5.4 mm and an elliptical cross section. The average value of the major axis was about 4.1 mm to about 4.3 mm, and the average value of the minor axis was about 2.2 mm to about 2.3 mm.
得られたペレットを用い、以下の方法にしたがって、各評価用試験片を作製して評価に供した。その結果を表1および表2に示す。 Using the obtained pellet, according to the following method, each test specimen for evaluation was produced and used for evaluation. The results are shown in Tables 1 and 2.
(溶融粘度の測定方法)
得られたペレット及びポリカーボネート樹脂(A)のペレットを120℃で4時間以上乾燥した後、キャピラリレオメータ((株)島津製作所製、フローテスタCFT−500)を用い、測定温度220℃、せん断速度1sec−1〜100sec−1の範囲で溶融粘度を測定した。せん断速度10sec−1におけるポリカーボネート樹脂組成物の溶融粘度をη1、ポリカーボネート樹脂(A)の溶融粘度をη2とした。(Measuring method of melt viscosity)
The pellets obtained and the pellets of the polycarbonate resin (A) were dried at 120 ° C. for 4 hours or longer, and then measured using a capillary rheometer (manufactured by Shimadzu Corporation, Flow Tester CFT-500) at a measurement temperature of 220 ° C. and a shear rate of 1 sec. The melt viscosity was measured in the range of -1 to 100 sec- 1 . The melt viscosity of the polycarbonate resin composition at a shear rate of 10 sec −1 was η1, and the melt viscosity of the polycarbonate resin (A) was η2.
(試験片の作製方法)
得られたペレットを120℃で4時間以上乾燥した後、射出成形機(ファナック(株)製、ROBOSHOT S2000i100A)を用い、成形温度360℃、金型温度80℃にて、JIS K 7139「プラスチック−試験片」にて規定の多目的試験片A型(全長168mm×厚さ4mm)を作製した。この試験片の端面を切削し、切削端面について、樹脂板端面鏡面機(メガロテクニカ(株)製、プラビューティーPB−500)を用いて鏡面加工した。(Test piece preparation method)
The obtained pellets were dried at 120 ° C. for 4 hours or more, and then, using an injection molding machine (manufactured by FANUC, ROBOSHOT S2000i100A) at a molding temperature of 360 ° C. and a mold temperature of 80 ° C., JIS K 7139 “Plastics— The multipurpose test piece A type (full length 168 mm × thickness 4 mm) defined in “Test piece” was produced. The end face of the test piece was cut, and the cut end face was mirror-finished using a resin plate end face mirror machine (Megaro Technica Co., Ltd., Plasticity PB-500).
(積算透過率の評価方法)
分光光度計((株)日立製作所製、UH4150)に長光路測定付属装置を設置し、光源として50Wハロゲンランプを用いて、光源前マスク5.6mm×2.8mm、試料前マスク6.0mm×2.8mmを使用した状態で、波長380〜780nmの領域で1nm毎の試験片各々の分光透過率を、試験片の全長方向について測定した。測定した分光透過率を積算し、十の位を四捨五入することにより、各々の積算透過率を求めた。なお、積算透過率が30000以上を良好(表中、○で示す)、30000未満を不良(表中、×で示す)とした。(Evaluation method of integrated transmittance)
A spectrophotometer (manufactured by Hitachi, Ltd., UH4150) is equipped with a long optical path measurement accessory device, using a 50 W halogen lamp as a light source, a mask before light source 5.6 mm × 2.8 mm, a mask before sample 6.0 mm × In a state where 2.8 mm was used, the spectral transmittance of each test piece for each 1 nm in the wavelength range of 380 to 780 nm was measured in the full length direction of the test piece. The measured spectral transmittance was integrated and rounded off to the nearest tenth to obtain the total transmittance. The integrated transmittance was 30000 or more as good (indicated by ◯ in the table) and less than 30000 was defective (indicated by x in the table).
(黄色度の評価方法)
前記積算透過率の評価方法において測定した分光透過率に基づき、標準光源D65を用い、10度視野にて各々の黄色度を求めた。なお、黄色度が20以下を良好(表中、○で示す)、20を超えると不良(表中、×で示す)とした。(Yellowness evaluation method)
Based on the spectral transmittance measured in the evaluation method of the accumulated transmittance, each yellow degree was obtained in a 10 degree visual field using a standard light source D65. In addition, the yellowness was 20 or less as good (indicated by ◯ in the table), and when it exceeded 20, it was determined as defective (indicated by x in the table).
実施例1〜18のポリカーボネート樹脂組成物は、ポリカーボネート樹脂(A)に、特定のポリエーテル誘導体等の溶融粘度調整剤(B)と、亜リン酸エステル系化合物(C)とが、各々特定の割合で配合されたものである。したがって、該ポリカーボネート樹脂組成物から成形された試験片は、積算透過率が高く、かつ、黄色度が小さい。 In the polycarbonate resin compositions of Examples 1 to 18, the polycarbonate resin (A) contains a melt viscosity modifier (B) such as a specific polyether derivative and a phosphite compound (C), respectively. It is blended in proportions. Therefore, the test piece molded from the polycarbonate resin composition has a high integrated transmittance and a low yellowness.
このように、実施例1〜18のポリカーボネート樹脂組成物は、ポリカーボネート樹脂(A)が本来有する耐熱性が損なわれることがなく、可視領域での光線透過率が高く、しかも高温で成形加工した場合でも光線透過率に優れている。そして、このようなポリカーボネート樹脂組成物を成形した成形品は、黄色度が小さく色相に優れ、しかも高温で成形加工した場合でも色相に優れている。 As described above, the polycarbonate resin compositions of Examples 1 to 18 are not damaged in the heat resistance inherent in the polycarbonate resin (A), have a high light transmittance in the visible region, and are molded at a high temperature. But it has excellent light transmittance. And the molded article which shape | molded such a polycarbonate resin composition is small in yellowness, is excellent in a hue, and is excellent in a hue even when it shape-processes at high temperature.
これに対して、比較例1のポリカーボネート樹脂組成物は、特定のポリエーテル誘導体等の溶融粘度調整剤(化合物B1)の量が少ないので、積算透過率が低く、かつ黄色度が大きい。このように、比較例1のポリカーボネート樹脂組成物を成形した成形品は、輝度および色相に劣る。 On the other hand, the polycarbonate resin composition of Comparative Example 1 has a low integrated transmittance and a high yellowness because the amount of the melt viscosity modifier (compound B1) such as a specific polyether derivative is small. Thus, the molded product which shape | molded the polycarbonate resin composition of the comparative example 1 is inferior to a brightness | luminance and a hue.
比較例2のポリカーボネート樹脂組成物は、特定の溶融粘度調整剤(化合物B1)の量が多いので、積算透過率が低く、かつ黄色度が大きい。このように、比較例2のポリカーボネート樹脂組成物を成形した成形品は、輝度および色相に劣る。 Since the polycarbonate resin composition of Comparative Example 2 has a large amount of the specific melt viscosity modifier (Compound B1), the integrated transmittance is low and the yellowness is large. Thus, the molded product which shape | molded the polycarbonate resin composition of the comparative example 2 is inferior to a brightness | luminance and a hue.
比較例3のポリカーボネート樹脂組成物は、亜リン酸エステル系化合物(C)の量が少ないので、試験片は黄色度が大きい。このように、比較例3のポリカーボネート樹脂組成物を成形した成形品は、色相に劣る。 Since the polycarbonate resin composition of Comparative Example 3 has a small amount of the phosphite compound (C), the test piece has a large yellowness. Thus, the molded article which shape | molded the polycarbonate resin composition of the comparative example 3 is inferior to a hue.
比較例4のポリカーボネート樹脂組成物は、亜リン酸エステル系化合物(C)の量が多ので、積算透過率が低く、かつ黄色度が大きい。このように、比較例4のポリカーボネート樹脂組成物を成形した成形品は、輝度および色相に劣る。 Since the polycarbonate resin composition of Comparative Example 4 has a large amount of the phosphite compound (C), the integrated transmittance is low and the yellowness is large. Thus, the molded product which shape | molded the polycarbonate resin composition of the comparative example 4 is inferior to a brightness | luminance and a hue.
比較例5のポリカーボネート樹脂組成物は、特定の溶融粘度調整剤(化合物B5)の量が少ないので、積算透過率が低く、かつ黄色度が大きい。このように、比較例5のポリカーボネート樹脂組成物を成形した成形品は、輝度および色相に劣る。 Since the polycarbonate resin composition of Comparative Example 5 has a small amount of the specific melt viscosity modifier (compound B5), the integrated transmittance is low and the yellowness is large. Thus, the molded product which shape | molded the polycarbonate resin composition of the comparative example 5 is inferior to a brightness | luminance and a hue.
比較例6のポリカーボネート樹脂組成物は、特定の溶融粘度調整剤(化合物B5)の量が多いので、積算透過率が低く、かつ黄色度が大きい。このように、比較例5のポリカーボネート樹脂組成物を成形した成形品は、輝度および色相に劣る。 Since the polycarbonate resin composition of Comparative Example 6 has a large amount of the specific melt viscosity modifier (Compound B5), the integrated transmittance is low and the yellowness is large. Thus, the molded product which shape | molded the polycarbonate resin composition of the comparative example 5 is inferior to a brightness | luminance and a hue.
以上のように、本発明における技術の例示として実施の形態を説明した。そのために、詳細な説明を提供した。 As described above, the embodiment has been described as an example of the technique in the present invention. To that end, a detailed explanation was provided.
したがって、詳細な説明に記載された構成要素の中には、課題解決のために必須な構成要素だけでなく、上記技術を例示するために、課題解決のためには必須でない構成要素も含まれ得る。そのため、それらの必須ではない構成要素が詳細な説明に記載されていることをもって、直ちに、それらの必須ではない構成要素が必須であるとの認定をするべきではない。 Accordingly, the components described in the detailed description include not only components essential for solving the problem but also components not essential for solving the problem in order to illustrate the above technique. obtain. Therefore, it should not be immediately recognized that these non-essential components are essential as the non-essential components are described in the detailed description.
また、上述の実施の形態は、本発明における技術を例示するためのものであるから、特許請求の範囲またはその均等の範囲において種々の変更、置き換え、付加、省略などを行うことができる。 Moreover, since the above-mentioned embodiment is for demonstrating the technique in this invention, a various change, replacement, addition, abbreviation, etc. can be performed in a claim or its equivalent range.
本発明のポリカーボネート樹脂組成物は、ポリカーボネート樹脂が本来有する耐熱性、機械的強度等の特性が損なわれることがなく、熱安定性及び耐候性に優れ、しかも高温で成形加工した場合でも光線透過率に優れたものである。よって、例えば厚さ0.3mm程度の薄型の導光板であっても、色相が変化して外観が低下することや、高温成形を経て樹脂そのものが劣化することが少なく、工業的利用価値が極めて高い。 The polycarbonate resin composition of the present invention does not impair the heat resistance, mechanical strength and other properties inherent to the polycarbonate resin, is excellent in thermal stability and weather resistance, and also has a light transmittance even when molded at a high temperature. It is an excellent one. Therefore, even if it is a thin light guide plate with a thickness of about 0.3 mm, for example, the hue changes and the appearance deteriorates, and the resin itself is less likely to deteriorate through high temperature molding. high.
Claims (11)
測定温度220℃、せん断速度10sec−1における溶融粘度をηとしたとき、ポリカーボネート樹脂組成物の溶融粘度η1とポリカーボネート樹脂(A)の溶融粘度η2の比η1/η2が、0.45≦η1/η2≦0.95を満たすことを特徴とする、ポリカーボネート樹脂組成物。For 100 parts by weight of the polycarbonate resin (A), 0.005 to 3.0 parts by weight of the melt viscosity modifier (B) and 0.005 to 1.0 parts by weight of the phosphite compound (C) are blended. A polycarbonate resin composition comprising:
When the melt viscosity at a measurement temperature of 220 ° C. and a shear rate of 10 sec −1 is η, the ratio η1 / η2 of the melt viscosity η1 of the polycarbonate resin composition and the melt viscosity η2 of the polycarbonate resin (A) is 0.45 ≦ η1 / A polycarbonate resin composition characterized by satisfying η2 ≦ 0.95.
一般式(1):
RO−(X−O)m(Y−O)n−R’ (1)
(式中、RおよびR’は、それぞれ独立して水素原子または炭素数1〜30のアルキル基を示し、Xは、炭素数2〜4のアルキレン基を、Yは、炭素数3〜5の分岐アルキレン基を、m及びnは、それぞれ独立して、3〜60の整数を示し、m+nは、8〜90の整数を示す。)The polycarbonate resin composition according to claim 1, wherein the melt viscosity modifier (B) is a polyether derivative represented by the following general formula (1), and the weight average molecular weight of the polyether derivative is 1000 to 4000. .
General formula (1):
RO- (X-O) m (YO) n-R '(1)
(In the formula, R and R ′ each independently represent a hydrogen atom or an alkyl group having 1 to 30 carbon atoms, X represents an alkylene group having 2 to 4 carbon atoms, and Y represents an alkyl group having 3 to 5 carbon atoms. In the branched alkylene group, m and n each independently represents an integer of 3 to 60, and m + n represents an integer of 8 to 90.)
一般式(2):
HO−(CH2CH2CH2CH2O)m(CH2CH2C(CH3)HCH2O)n−H (2)
(式中、m及びnは、それぞれ独立して、3〜60の整数を示し、m+nは、8〜90の整数を示す。)The polyether derivative represented by the general formula (1) is a polyether derivative represented by the following general formula (2), and the weight average molecular weight of the polyether derivative is 1000 to 4000. Polycarbonate resin composition.
General formula (2):
HO- (CH 2 CH 2 CH 2 CH 2 O) m (CH 2 CH 2 C (CH 3) HCH 2 O) n -H (2)
(In the formula, m and n each independently represent an integer of 3 to 60, and m + n represents an integer of 8 to 90.)
一般式(3):
C4H9O−(CH2CH2)m(CH2C(CH3)HO)n−H (3)
(式中、m及びnは、それぞれ独立して、3〜60の整数を示し、m+nは、8〜90の整数を示す。)The polyether derivative represented by the general formula (1) is a polyether derivative represented by the following general formula (3), and the weight average molecular weight of the polyether derivative is 1000 to 4000. Polycarbonate resin composition.
General formula (3):
C 4 H 9 O- (CH 2 CH 2) m (CH 2 C (CH 3) HO) n-H (3)
(In the formula, m and n each independently represent an integer of 3 to 60, and m + n represents an integer of 8 to 90.)
一般式(4):
HO−(CH2CH2O)m(CH2CH(CH3)O)n−H (4)
(式中、m及びnは、それぞれ独立して、3〜60の整数を示し、m+nは、8〜90の整数を示す。)The polyether derivative represented by the general formula (1) is a polyether derivative represented by the following general formula (4), and the weight average molecular weight of the polyether derivative is 1000 to 4000. Polycarbonate resin composition.
General formula (4):
HO- (CH 2 CH 2 O) m (CH 2 CH (CH 3) O) n-H (4)
(In the formula, m and n each independently represent an integer of 3 to 60, and m + n represents an integer of 8 to 90.)
一般式(5):
一般式(6):
一般式(7):
General formula (5):
General formula (6):
General formula (7):
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JP5947095B2 (en) * | 2012-05-01 | 2016-07-06 | 三菱エンジニアリングプラスチックス株式会社 | Polycarbonate resin composition for light guide plate and light guide plate |
US9303121B2 (en) * | 2013-08-29 | 2016-04-05 | Lg Chem, Ltd. | Terminally modified polyoxyalkylene glycol and polycarbonate resin composition having improved optical characteristics comprising the same |
JP6828954B2 (en) * | 2013-11-11 | 2021-02-10 | 出光興産株式会社 | Polycarbonate resin molding material |
KR101715582B1 (en) * | 2013-12-10 | 2017-03-13 | 수미카 스타이론 폴리카보네이트 주식회사 | Polycarbonate resin composition and optical molded article |
WO2016060220A1 (en) * | 2014-10-17 | 2016-04-21 | 出光興産株式会社 | Polycarbonate resin composition |
JP6386343B2 (en) * | 2014-11-11 | 2018-09-05 | 住化ポリカーボネート株式会社 | Polycarbonate resin composition and optical molded article |
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CN107418181B (en) * | 2015-03-26 | 2020-04-21 | 住化Pc有限公司 | Polycarbonate resin composition and optical molded article |
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TWI686445B (en) | 2020-03-01 |
JP2017128742A (en) | 2017-07-27 |
CN107418181A (en) | 2017-12-01 |
CN107207848B (en) | 2019-11-05 |
KR20170122713A (en) | 2017-11-06 |
JP6746533B2 (en) | 2020-08-26 |
JP2017057408A (en) | 2017-03-23 |
CN107418181B (en) | 2020-04-21 |
CN107207848A (en) | 2017-09-26 |
WO2016152165A1 (en) | 2016-09-29 |
TW201641589A (en) | 2016-12-01 |
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JP6063101B1 (en) | 2017-01-18 |
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