JPWO2015049939A1 - 感光性導電フィルム、これを用いた導電パターンの形成方法及び導電パターン基板 - Google Patents
感光性導電フィルム、これを用いた導電パターンの形成方法及び導電パターン基板 Download PDFInfo
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- JPWO2015049939A1 JPWO2015049939A1 JP2015540427A JP2015540427A JPWO2015049939A1 JP WO2015049939 A1 JPWO2015049939 A1 JP WO2015049939A1 JP 2015540427 A JP2015540427 A JP 2015540427A JP 2015540427 A JP2015540427 A JP 2015540427A JP WO2015049939 A1 JPWO2015049939 A1 JP WO2015049939A1
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Abstract
Description
図3は、本実施形態に係る導電パターンの形成方法を説明するための模式断面図である。本実施形態の方法は、上述した感光性導電フィルム10を、カバーフィルム1をはく離し、基材20上に導電層2が密着するようにローラ60によりラミネートする工程(以下、「ラミネート工程」ともいう。)(図3(a)及び(b))と、基材上の感光層を露光及び現像することにより導電パターンを形成する工程(以下、「パターニング工程」ともいう。)とを備える(図3(c)及び(d))。パターニング工程は、支持フィルム5を有する感光層4の所定部分にマスク6を介して、活性光線を照射する露光工程(図3(c))と、その後、支持フィルム5をはく離して感光層4を現像する現像工程(図3(d))とからなる。
[ポリオール法による銀繊維の調製]
2000mLの3口フラスコに、エチレングリコール500mLを入れ、窒素雰囲気下、マグネチックスターラーで攪拌しながらオイルバスにより160℃まで加熱した。ここに、別途用意したPtCl22mgを50mLのエチレングリコールに溶解した溶液を滴下した。4〜5分後、AgNO35gをエチレングリコール300mLに溶解した溶液と、重量平均分子量が8万のポリビニルピロリドン(和光純薬工業(株)製)5gをエチレングリコール150mLに溶解した溶液とを、それぞれの滴下ロートから1分間で同時に滴下し、その後160℃で60分間攪拌した。
純水に、上記で得られた銀繊維を0.2質量%、及び、ドデシル−ペンタエチレングリコールを0.1質量%の濃度となるように分散し、導電性繊維分散液1を得た。
[アクリル樹脂の合成]
撹拌機、還流冷却器、温度計、滴下ロート及び窒素ガス導入管を備えたフラスコに、メチルセロソルブとトルエンとの混合液(メチルセロソルブ/トルエン=3/2(質量比)、以下、「溶液s」という)400gを加え、窒素ガスを吹き込みながら撹拌して、80℃まで加熱した。一方、単量体としてメタクリル酸100g、メタクリル酸メチル250g、アクリル酸エチル100g及びスチレン50gと、開始剤としてアゾビスイソブチロニトリル0.8gとを混合した溶液(以下、「溶液a」という)を用意した。次に、80℃に加熱された溶液sに、溶液aを4時間かけて滴下した後、80℃で撹拌しながら2時間保温した。さらに、100gの溶液sにアゾビスイソブチロニトリル1.2gを溶解した溶液を、10分かけてフラスコ内に滴下した。そして、滴下後の溶液を撹拌しながら80℃で3時間保温した後、30分間かけて90℃に加熱した。90℃で2時間保温した後、冷却してバインダーポリマー溶液を得た。このバインダーポリマー溶液に、アセトンを加えて不揮発成分(固形分)が50質量%になるように調製し、(A)成分としてのバインダーポリマー溶液を得た。得られたバインダーポリマーの重量平均分子量はGPCによる標準ポリスチレン換算で80000であった。これをアクリルポリマーAとした。なお、重量平均分子量を測定したGPCの測定条件は下記の通りである。
機種:日立L6000((株)日立製作所製)
検出:L3300RI((株)日立製作所製)
カラム:Gelpack GL−R440 + GL−R450 + GL−R400M(日立化成(株)製)
カラム仕様:直径10.7mm × 300mm
溶媒:THF(テトラヒドロフラン)
試料濃度:NV(不揮発分濃度)50質量%の樹脂溶液を120mg採取、5mLのTHFに溶解
注入量:200μL
圧力:4.9MPa
流量:2.05mL/min
表1に示す材料を同表に示す配合量(単位:質量部)で配合し、感光性樹脂組成物の溶液(X)を調製した。
(B)成分
PET−30:ペンタエリスリトールトリアクリレート(日本化薬(株)製)
(C)成分
OXE−01:1,2−オクタンジオン、1−[4−(フェニルチオ)フェニル−2−(O−ベンゾイルオキシム)](BASF(株)製)
(D)成分
シリカフィラA:オルガノシリカゾル(日産化学工業(株)製、平均一次粒径12nm)
その他
SH−30:オクタメチルシクロテトラシロキサン(東レ・ダウコーニング(株)製)
メチルエチルケトン(東燃化学(株)製)
<感光性導電フィルムの作製>
上記導電性繊維分散液1を、第一のフィルム(カバーフィルム)として用意した厚さ16μmのポリエチレンテレフタレートフィルム(PETフィルム、帝人(株)製、商品名:G2−16)上に20g/m2で均一に塗布し、100℃の熱風対流式乾燥機で10分間乾燥し、室温(25℃)において1MPaの線圧で加圧することにより、第一のフィルム上に導電性繊維を含有する導電層を形成した。なお、走査型電子顕微鏡写真により測定したところ、導電層の乾燥後の膜厚は、約0.1μmであった。
厚さ1mmのポリカーボネート基板を80℃に加温し、その表面上に実施例1で得られた感光性導電フィルムのカバーフィルム(厚さ16μmのPETフィルム)をはく離しながら導電層とポリカーボネート基板とを対向させて、120℃、0.4MPaの条件でラミネートした。ラミネート後、基板を冷却し基板の温度が23℃になった時点で、支持フィルム(厚さ50μmのPETフィルム)側から超高圧水銀灯を有する露光機((株)オーク製作所製、商品名:EXM−1201)を用いて、1000mJ/cm2の露光量で感光層(導電層及び感光性樹脂層)に光照射した。露光後、室温(25℃)で15分間放置し、続いて、支持フィルムであるPETフィルムをはく離することで、銀繊維を含有する導電膜をポリカーボネート基板上に形成し、導電膜基板を得た。得られた導電膜基板について、表面抵抗率及び450〜650nmの波長域における最小光透過率の評価を行った。下記の測定装置を用いて測定した導電膜の表面抵抗率は、150Ω/□であり、450〜650nmの波長域における最小光透過率(基板を含む)は、90%であった。
非接触型表面抵抗計(ナプソン(株)製、EC−80P)を用い、測定プローブを導電膜側から当て、ポリカーボネート基板上に形成した導電膜の表面抵抗率を測定した。
分光光度計((株)日立ハイテクノロジーズ製、商品名「U−3310」)を用いて、450〜650nmの波長域における最小光透過率を測定した。
上記で得られた導電膜基板について、FIB−SEMを使用して集束イオンビーム加工法で薄膜切片状のサンプルを作製して感光性樹脂層3の断面を切り出す。続いて、薄膜切片上のサンプルをTEM(透過型電子顕微鏡、日本電子製;JEM−2100F)を用いて10万倍〜30万倍の倍率で観察した。観察された断面の中で、無機フィラの含まれる数が最も多い領域(2μm×2μm)の全ての粒径を測定したところ、平均値は12nmであった。なお、集束イオンビーム加工法以外の薄膜の断面サンプルの作製方法としては、ウルトラミクロトーム法、クライオウルトラミクロトーム加工法による薄膜加工方法がある。
[評価基板の作製]
ITO−PETフィルム基板(厚さ100μm、表面抵抗率150Ω/□)を80℃に加熱し、その表面上(ITO側)にITOエッチング用レジストフィルム(日立化成(株)製、ME−3315)を、ラミネートロール温度110℃、ラミネート圧力0.4MPa、ラミネート速度1m/minの条件でラミネートした。ラミネート後、基板を冷却し基板の温度が23℃になった時点で、カバーフィルムであるPETフィルム面に、ライン幅/スペース幅が1mm/1mmで長さが50mmの配線パターンを有するフォトマスクを密着させた。そして、超高圧水銀灯を有する露光機((株)オーク製作所製、商品名:EXM−1201)を用いて、200mJ/cm2の露光量でエッチングレジストに光照射した。
得られたITOラインパターン形成基板を80℃に加温し、その表面上(ITOラインパターン形成面)に、実施例1で得られた感光性導電フィルムを、第一のフィルムをはく離しながら導電層とITOラインパターン形成基板とを対向させて、120℃、0.4MPaの条件でラミネートした。ラミネート後、基板を冷却し基板の温度が23℃になった時点で、第二のフィルムであるPETフィルム面に、ライン幅1mmで長さが3mmの配線パターンを有するフォトマスクを密着させた。フォトマスクは配線パターンが、評価基板のITOラインパターンと直交するように配置した。そして、超高圧水銀灯を有する露光機((株)オーク製作所製、商品名:EXM−1201)を用いて、40mJ/cm2の露光量(i線(波長365nm)における測定値)で感光層(導電層及び感光性樹脂層)に光照射した。
A ; R1≦20×103Ω
B ; 20×103Ω<R1≦200×103Ω
C ; 200×103Ω<R1≦1×106Ω
D ; 1×106Ω<R1
実施例1で得られた感光性導電フィルムで形成した導電パターンの電気的接続性を評価したところ、評点はAだった。導電パターンは、2本のITOラインパターンを良好に電気的に接続していることが確認された。
表2に示す材料を同表に示す配合量(単位:質量部)で配合した感光性樹脂組成物の溶液(X)を用いた以外は、実施例1と同様にして感光性導電フィルムを作製し、導電パターンの表面抵抗率、光透過率、及び、基材表面の接続端子との電気的接続性を評価した。結果を表2に示す。
(B)成分
PET−30:ペンタエリスリトールトリアクリレート(日本化薬(株)製)
TMPTA:トリメチロールプロパントリアクリレート(日本化薬(株)製)
(C)成分
OXE−01:1,2−オクタンジオン、1−[4−(フェニルチオ)フェニル−2−(O−ベンゾイルオキシム)](BASF(株)製)
(D)成分
シリカフィラA:オルガノシリカゾル(日産化学工業(株)製、平均一次粒径12nm)
シリカフィラB:シリカフィラ(アドマファイン、(株)アドマテックス製、平均一次粒径500nm)
酸化ジルコニウムフィラ:(ナノユース、日産化学工業(株)製、平均一次粒径90nm)
ITO粒子フィラ:(透明導電性粉末ITO、三菱マテリアル電子化成(株)製、平均一次粒径30nm)
その他
SH−30:オクタメチルシクロテトラシロキサン(東レ・ダウコーニング(株)製)
メチルエチルケトン(東燃化学(株)製)
表3に示す材料を同表に示す配合量(単位:質量部)で配合した感光性樹脂組成物の溶液(X)を用いた以外は、実施例1と同様にして感光性導電フィルムを作製し、導電パターンの表面抵抗率、光透過率、及び、基材表面の接続端子との電気的接続性を評価した。結果を表3に示す。
(A)成分
アクリルポリマーA:メタクリル酸/メタクリル酸メチル/アクリル酸エチル/スチレン=20/50/20/10の共重合比であるアクリル樹脂、重量平均分子量80000
アクリルポリマーB:メタクリル酸/メタクリル酸メチル/アクリル酸エチル/2−ヒドロキシエチルメタクリレート=20/50/20/10の共重合比であるアクリル樹脂、重量平均分子量85000
(B)成分
PET−30:ペンタエリスリトールトリアクリレート(日本化薬(株)製)
DPHA:ジペンタエリスリトールヘキサアクリレート(日本化薬(株)製)
(C)成分
OXE−01:1,2−オクタンジオン、1−[4−(フェニルチオ)フェニル−2−(O−ベンゾイルオキシム)](BASF(株)製)
TPO:2,4,6−トリメチルベンゾイル−ジフェニルホスフィンオキサイド(BASF(株)製)
(D)成分
シリカフィラA:オルガノシリカゾル(日産化学工業(株)製、平均一次粒径12nm)
その他
SH−30:オクタメチルシクロテトラシロキサン(東レ・ダウコーニング(株)製)
メチルエチルケトン(東燃化学(株)製)
Claims (11)
- 導電性繊維を含有する導電層と、感光性樹脂及び無機フィラを含有する感光性樹脂層と、支持フィルムとをこの順に備える感光性導電フィルムを用意し、基材上に前記導電層側から密着するように前記導電層及び前記感光性樹脂層をラミネートする工程と、
前記基材上の前記感光性樹脂層及び前記導電層を露光及び現像することにより導電パターンを形成する工程と、
を備える、導電パターンの形成方法。 - 前記感光性樹脂層がバインダーポリマー、エチレン性不飽和結合を有する光重合性化合物及び光重合開始剤を含有する、請求項1に記載の導電パターンの形成方法。
- 前記バインダーポリマーがカルボキシル基を有する、請求項2に記載の導電パターンの形成方法。
- 前記導電層及び前記感光性樹脂層の積層体は、450〜650nmの波長域における最小光透過率が80%以上である、請求項1〜3のいずれか一項に記載の導電パターンの形成方法。
- 前記無機フィラは一次粒径が1〜1000nmの無機フィラを含む、請求項1〜4のいずれか一項に記載の導電パターンの形成方法。
- 前記無機フィラの平均一次粒径が200nm以下である、請求項1〜5のいずれか一項に記載の導電パターンの形成方法。
- 基板と、請求項1〜6のいずれか一項に記載の導電パターンの形成方法により前記基板上に形成された導電パターンと、を備える、導電パターン基板。
- 基板と、前記基板上に設けられた導電性繊維を含有する導電層及び前記導電層上に設けられた無機フィラを含有する樹脂硬化層とからなる導電パターンと、を備える、導電パターン基板。
- 支持フィルムと、導電性繊維を含有する導電層と、感光性樹脂及び無機フィラを含有する感光性樹脂層と、をこの順に備える、感光性導電フィルム。
- 前記無機フィラは一次粒径が1〜1000nmの無機フィラを含む、請求項9に記載の感光性導電フィルム。
- 前記無機フィラの平均一次粒径が200nm以下である、請求項9又は10に記載の感光性導電フィルム。
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KR20210078619A (ko) * | 2019-12-18 | 2021-06-29 | 삼성디스플레이 주식회사 | 도전 패턴 형성 방법 및 도전 패턴을 포함하는 표시 장치 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001203436A (ja) * | 2000-01-18 | 2001-07-27 | Nippon Synthetic Chem Ind Co Ltd:The | 電極形成用シートとその製造法および基板上への電極の形成方法 |
WO2010021224A1 (ja) * | 2008-08-22 | 2010-02-25 | 日立化成工業株式会社 | 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 |
JP2011164306A (ja) * | 2010-02-08 | 2011-08-25 | Taiyo Holdings Co Ltd | 積層構造体及びそれに用いる感光性ドライフィルム |
JP2013039739A (ja) * | 2011-08-17 | 2013-02-28 | Toppan Printing Co Ltd | 透明積層体及び透明積層体の製造方法 |
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SG150514A1 (en) * | 2005-08-12 | 2009-03-30 | Cambrios Technologies Corp | Nanowires-based transparent conductors |
JP4635925B2 (ja) | 2006-03-22 | 2011-02-23 | Tdk株式会社 | 転写用導電性フィルム及びそれを用いた透明導電層が付与された物体 |
CN101465173B (zh) | 2008-12-31 | 2011-02-09 | 广东东邦科技有限公司 | 一种触摸屏透明导电膜及其制备方法 |
JP5257558B1 (ja) * | 2011-10-03 | 2013-08-07 | 日立化成株式会社 | 導電パターンの形成方法、導電パターン基板及びタッチパネルセンサ |
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JP2001203436A (ja) * | 2000-01-18 | 2001-07-27 | Nippon Synthetic Chem Ind Co Ltd:The | 電極形成用シートとその製造法および基板上への電極の形成方法 |
WO2010021224A1 (ja) * | 2008-08-22 | 2010-02-25 | 日立化成工業株式会社 | 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 |
JP2011164306A (ja) * | 2010-02-08 | 2011-08-25 | Taiyo Holdings Co Ltd | 積層構造体及びそれに用いる感光性ドライフィルム |
JP2013039739A (ja) * | 2011-08-17 | 2013-02-28 | Toppan Printing Co Ltd | 透明積層体及び透明積層体の製造方法 |
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US10353293B2 (en) | 2019-07-16 |
US20160238942A1 (en) | 2016-08-18 |
CN105593950B (zh) | 2018-04-13 |
KR20160065807A (ko) | 2016-06-09 |
CN105593950A (zh) | 2016-05-18 |
JP6561837B2 (ja) | 2019-08-21 |
TW201530567A (zh) | 2015-08-01 |
WO2015049939A1 (ja) | 2015-04-09 |
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