JPWO2014192590A1 - 半導体ウエハ研削装置、半導体ウエハの製造方法、及び半導体ウエハの研削方法 - Google Patents
半導体ウエハ研削装置、半導体ウエハの製造方法、及び半導体ウエハの研削方法 Download PDFInfo
- Publication number
- JPWO2014192590A1 JPWO2014192590A1 JP2015519800A JP2015519800A JPWO2014192590A1 JP WO2014192590 A1 JPWO2014192590 A1 JP WO2014192590A1 JP 2015519800 A JP2015519800 A JP 2015519800A JP 2015519800 A JP2015519800 A JP 2015519800A JP WO2014192590 A1 JPWO2014192590 A1 JP WO2014192590A1
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- ground
- grinding
- wafer
- grinding wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 122
- 238000000034 method Methods 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 235000012431 wafers Nutrition 0.000 claims description 153
- 238000005498 polishing Methods 0.000 claims description 14
- 238000005520 cutting process Methods 0.000 claims description 5
- 230000007246 mechanism Effects 0.000 description 12
- 238000007517 polishing process Methods 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
10 研削ホイール
10b 主面
13 砥石
20 第1駆動機構(第1駆動手段)
30 ウエハ支持具
40 第2駆動機構(第2駆動手段)
W 半導体ウエハ
Wa 被研削面
Claims (6)
- 半導体ウエハの被研削面を研削する半導体ウエハ研削装置であって、
研削ホイールと、
前記研削ホイールを中心軸周りに回転駆動する第1駆動手段と、
前記半導体ウエハを支持するとともに、前記研削ホイールの中心軸と平行且つ前記中心軸に対して偏心した軸線周りに回転可能なウエハ支持具と、
前記ウエハ支持具を回転駆動する第2駆動手段と
を備え、
前記研削ホイールは、前記ウエハ支持具に対向する主面に設けられた複数の砥石を備え、
前記ウエハ支持具は、前記半導体ウエハの前記被研削面が前記研削ホイールの前記主面に対向するように前記半導体ウエハを支持し、
前記複数の砥石の各々は、前記研削ホイールの中心から放射状に延びるとともに、前記半導体ウエハの前記被研削面を横断するように形成されている、半導体ウエハ研削装置。
- 前記ウエハ支持具は、複数の前記半導体ウエハを支持するように形成されている、請求項1に記載の半導体ウエハ研削装置。
- 前記ウエハ支持具を複数備える、請求項1又は請求項2に記載の半導体ウエハ研削装置。
- インゴットを切断して半導体ウエハを得る切断工程と、
前記半導体ウエハの被研削面を研削するラッピング工程と、
前記被研削面を研磨するポリッシング工程と
を包含し、
前記ラッピング工程において、請求項1から請求項3のうちの1項に記載の半導体ウエハ研削装置を使用し、前記研削ホイールと前記ウエハ支持具とを回転させながら前記被研削面を研削する、半導体ウエハの製造方法。
- 前記ラッピング工程において、前記研削ホイールと前記ウエハ支持具とを同じ方向に回転させながら前記被研削面を研削する、請求項4に記載の半導体ウエハの製造方法。
- 半導体ウエハの研削方法であって、
請求項1から請求項3のうちの1項に記載の半導体ウエハ研削装置を使用し、前記研削ホイールと前記ウエハ支持具とを回転させながら前記被研削面を研削する、半導体ウエハの研削方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013114286 | 2013-05-30 | ||
JP2013114286 | 2013-05-30 | ||
PCT/JP2014/063327 WO2014192590A1 (ja) | 2013-05-30 | 2014-05-20 | 半導体ウエハ研削装置、半導体ウエハの製造方法、及び半導体ウエハの研削方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5944581B2 JP5944581B2 (ja) | 2016-07-05 |
JPWO2014192590A1 true JPWO2014192590A1 (ja) | 2017-02-23 |
Family
ID=51988623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015519800A Active JP5944581B2 (ja) | 2013-05-30 | 2014-05-20 | 半導体ウエハ研削装置、半導体ウエハの製造方法、及び半導体ウエハの研削方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5944581B2 (ja) |
TW (1) | TW201509594A (ja) |
WO (1) | WO2014192590A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0677187A (ja) * | 1992-08-25 | 1994-03-18 | Sumitomo Metal Ind Ltd | ラッピング装置 |
JPH10244449A (ja) * | 1997-02-28 | 1998-09-14 | Hitachi Cable Ltd | GaAsウェハの加工方法 |
JP2001244240A (ja) * | 2000-02-25 | 2001-09-07 | Speedfam Co Ltd | 半導体ウエハの製造方法 |
JP2002079464A (ja) * | 2000-09-06 | 2002-03-19 | Nagase Integrex Co Ltd | 研削方法及び研削盤 |
JP2005238413A (ja) * | 2004-02-27 | 2005-09-08 | Yachiyo Microscience Inc | ラップ盤用回転定盤 |
JP2010045262A (ja) * | 2008-08-15 | 2010-02-25 | Showa Denko Kk | 半導体発光素子の製造方法 |
JP5793341B2 (ja) * | 2011-05-12 | 2015-10-14 | 株式会社ディスコ | ウェーハの加工方法 |
-
2014
- 2014-05-19 TW TW103117535A patent/TW201509594A/zh unknown
- 2014-05-20 JP JP2015519800A patent/JP5944581B2/ja active Active
- 2014-05-20 WO PCT/JP2014/063327 patent/WO2014192590A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP5944581B2 (ja) | 2016-07-05 |
WO2014192590A1 (ja) | 2014-12-04 |
TW201509594A (zh) | 2015-03-16 |
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