TW201509594A - 半導體晶圓硏削裝置、半導體晶圓製造方法、及半導體晶圓硏削方法 - Google Patents

半導體晶圓硏削裝置、半導體晶圓製造方法、及半導體晶圓硏削方法 Download PDF

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Publication number
TW201509594A
TW201509594A TW103117535A TW103117535A TW201509594A TW 201509594 A TW201509594 A TW 201509594A TW 103117535 A TW103117535 A TW 103117535A TW 103117535 A TW103117535 A TW 103117535A TW 201509594 A TW201509594 A TW 201509594A
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
grinding
wafer
grinding wheel
ground surface
Prior art date
Application number
TW103117535A
Other languages
English (en)
Chinese (zh)
Inventor
Shinsuke Sakai
Original Assignee
Success Yk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Success Yk filed Critical Success Yk
Publication of TW201509594A publication Critical patent/TW201509594A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW103117535A 2013-05-30 2014-05-19 半導體晶圓硏削裝置、半導體晶圓製造方法、及半導體晶圓硏削方法 TW201509594A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013114286 2013-05-30

Publications (1)

Publication Number Publication Date
TW201509594A true TW201509594A (zh) 2015-03-16

Family

ID=51988623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103117535A TW201509594A (zh) 2013-05-30 2014-05-19 半導體晶圓硏削裝置、半導體晶圓製造方法、及半導體晶圓硏削方法

Country Status (3)

Country Link
JP (1) JP5944581B2 (ja)
TW (1) TW201509594A (ja)
WO (1) WO2014192590A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0677187A (ja) * 1992-08-25 1994-03-18 Sumitomo Metal Ind Ltd ラッピング装置
JPH10244449A (ja) * 1997-02-28 1998-09-14 Hitachi Cable Ltd ＧａＡｓウェハの加工方法
JP2001244240A (ja) * 2000-02-25 2001-09-07 Speedfam Co Ltd 半導体ウエハの製造方法
JP2002079464A (ja) * 2000-09-06 2002-03-19 Nagase Integrex Co Ltd 研削方法及び研削盤
JP2005238413A (ja) * 2004-02-27 2005-09-08 Yachiyo Microscience Inc ラップ盤用回転定盤
JP2010045262A (ja) * 2008-08-15 2010-02-25 Showa Denko Kk 半導体発光素子の製造方法
JP5793341B2 (ja) * 2011-05-12 2015-10-14 株式会社ディスコ ウェーハの加工方法

Also Published As

Publication number Publication date
JPWO2014192590A1 (ja) 2017-02-23
WO2014192590A1 (ja) 2014-12-04
JP5944581B2 (ja) 2016-07-05

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