JPWO2014098077A1 - 圧電アクチュエータ、圧電振動装置および携帯端末 - Google Patents
圧電アクチュエータ、圧電振動装置および携帯端末 Download PDFInfo
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Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
Abstract
Description
補強板は、図2に示した形状であり、あらかじめ所望の形状をした金型を用いて加圧して屈曲部を作製したものを用いた。
10:圧電素子
12:内部電極
13:圧電体層
14:積層体
15:表面電極
151:第1の表面電極
152:第2の表面電極
153:第3の表面電極
2:フレキシブル基板
201:第1の領域
202:第2の領域
21:ベースフィルム
22:配線導体
23:カバーフィルム
3:補強板
31:屈曲部
4:導電性接合部材
41:導電粒子
42:樹脂接着剤
81:振動板
82:接合部材
91:ディスプレイ
92:筐体
921:筐体本体
922:振動板
93:接合材
Claims (12)
- 内部電極および圧電体層が積層された積層体、および該積層体の一方主面に前記内部電極と電気的に接続された表面電極を備えた圧電素子と、前記表面電極と電気的に接合されたフレキシブル基板と、該フレキシブル基板上であって前記圧電素子と重なる領域に固着された補強板とを有しており、該補強板には屈曲部が設けられていることを特徴とする圧電アクチュエータ。
- 前記フレキシブル基板は前記圧電素子と重なる第1の領域および前記圧電素子と重ならない第2の領域を有し、前記補強板は前記第1の領域から前記第2の領域にかけて設けられており、前記屈曲部が前記第1の領域と前記第2の領域との境界または該境界よりも外側に位置していることを特徴とする請求項1に記載の圧電アクチュエータ。
- 前記フレキシブル基板はベースフィルムおよび配線導体を備え、該配線導体が前記表面電極と電気的に接続されるように異方性導電材を介して接合され、該異方性導電材が前記一方主面の上方から見て前記屈曲部と重なる位置にも設けられていることを特徴とする請求項2に記載の圧電アクチュエータ。
- 前記補強板が前記圧電素子側に折れ曲がっていることを特徴とする請求項2または請求項3に記載の圧電アクチュエータ。
- 前記フレキシブル基板は前記第2の領域に前記第1の領域と間隔をあけて前記配線導体の一部を覆うように設けられたカバーフィルムを有しており、
前記屈曲部が、前記一方主面の上方から見て前記カバーフィルムと重ならない位置にあることを特徴とする請求項2乃至請求項4のうちのいずれかに記載の圧電アクチュエータ。 - 前記補強板の先端が、前記一方主面の上方から見て前記カバーフィルムと重なる位置まで延びて設けられていることを特徴とする請求項5に記載の圧電アクチュエータ。
- 前記ベースフィルムと前記補強板とが同一の素材からなる請求項1乃至請求項6のうちのいずれかに記載の圧電アクチュエータ。
- 請求項1乃至請求項7のうちのいずれかに記載の圧電アクチュエータと、該圧電アクチュエータを構成する前記積層体の他方主面に接合された振動板とを有することを特徴とする圧電振動装置。
- 前記圧電アクチュエータと前記振動板とが該振動板よりも変形可能な接合部材を用いて接合されていることを特徴とする請求項8に記載の圧電振動装置。
- 請求項1乃至請求項7のうちのいずれかに記載の圧電アクチュエータと、電子回路と、ディスプレイと、筐体とを有しており、前記圧電アクチュエータを構成する前記積層体の他方主面が前記ディスプレイまたは前記筐体に接合されていることを特徴とする携帯端末。
- 前記圧電アクチュエータと前記ディスプレイまたは前記筐体とが該ディスプレイまたは該筐体よりも変形可能な接合部材を用いて接合されていることを特徴とする請求項10に記載の携帯端末。
- 前記ディスプレイまたは前記筐体は、耳の軟骨または気導を通して音情報を伝える振動を生じさせることを特徴とする請求項10または請求項11に記載の携帯端末。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012274741 | 2012-12-17 | ||
JP2012274741 | 2012-12-17 | ||
PCT/JP2013/083744 WO2014098077A1 (ja) | 2012-12-17 | 2013-12-17 | 圧電アクチュエータ、圧電振動装置および携帯端末 |
Publications (2)
Publication Number | Publication Date |
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JPWO2014098077A1 true JPWO2014098077A1 (ja) | 2017-01-12 |
JP6140731B2 JP6140731B2 (ja) | 2017-05-31 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2014553155A Active JP6140731B2 (ja) | 2012-12-17 | 2013-12-17 | 圧電アクチュエータ、圧電振動装置および携帯端末 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9899591B2 (ja) |
JP (1) | JP6140731B2 (ja) |
CN (1) | CN204577470U (ja) |
WO (1) | WO2014098077A1 (ja) |
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CN113778245B (zh) * | 2021-09-19 | 2022-09-16 | 深圳市汇顶科技股份有限公司 | 触控板和电子设备 |
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JP6140731B2 (ja) | 2017-05-31 |
US20150311423A1 (en) | 2015-10-29 |
US9899591B2 (en) | 2018-02-20 |
WO2014098077A1 (ja) | 2014-06-26 |
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