WO2014098077A1 - 圧電アクチュエータ、圧電振動装置および携帯端末 - Google Patents
圧電アクチュエータ、圧電振動装置および携帯端末 Download PDFInfo
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- WO2014098077A1 WO2014098077A1 PCT/JP2013/083744 JP2013083744W WO2014098077A1 WO 2014098077 A1 WO2014098077 A1 WO 2014098077A1 JP 2013083744 W JP2013083744 W JP 2013083744W WO 2014098077 A1 WO2014098077 A1 WO 2014098077A1
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- piezoelectric
- piezoelectric actuator
- flexible substrate
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- region
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- 239000000758 substrate Substances 0.000 claims abstract description 61
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 45
- 239000004020 conductor Substances 0.000 claims description 37
- 238000005304 joining Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 28
- 239000013039 cover film Substances 0.000 claims description 20
- 239000010408 film Substances 0.000 claims description 16
- 210000004728 ear cartilage Anatomy 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 25
- 230000001070 adhesive effect Effects 0.000 description 25
- 239000000919 ceramic Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- 239000002245 particle Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 230000002238 attenuated effect Effects 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 210000000845 cartilage Anatomy 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 239000011190 CEM-3 Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
Definitions
- the present invention relates to a piezoelectric vibration device, a piezoelectric actuator suitable for a mobile terminal, a piezoelectric vibration device, and a mobile terminal.
- a bimorph type piezoelectric element in which a surface electrode is formed on the surface of a laminated body in which a plurality of internal electrodes and piezoelectric layers are laminated (see Patent Document 1), a piezoelectric element and a flexible element are used.
- Patent Document 1 a bimorph type piezoelectric element in which a surface electrode is formed on the surface of a laminated body in which a plurality of internal electrodes and piezoelectric layers are laminated.
- Patent Document 2 There is known one in which a substrate is bonded and a surface electrode of a piezoelectric element and a wiring conductor of a flexible substrate are electrically connected (see Patent Document 2).
- the vibration of the piezoelectric element is transmitted to the flexible substrate, and the flexible substrate also vibrates with the vibration of the piezoelectric element. Accordingly, there is a problem that the flexible substrate may be peeled off from the piezoelectric element due to the influence of the vibration when driven for a long time.
- the present invention has been made in view of the above circumstances, and an object thereof is to provide a piezoelectric actuator, a piezoelectric vibration device, and a portable terminal in which peeling of a flexible substrate due to the influence of vibration of a piezoelectric element is suppressed.
- the piezoelectric actuator of the present invention includes a laminated body in which an internal electrode and a piezoelectric layer are laminated, a piezoelectric element including a surface electrode electrically connected to the internal electrode on one main surface of the laminated body, and the surface A flexible board electrically joined to the electrode; and a reinforcing plate fixed on a region of the flexible board that overlaps the piezoelectric element.
- the reinforcing plate is provided with a bent portion. It is characterized by this.
- the present invention is a piezoelectric vibration device comprising the above-described piezoelectric actuator and a vibration plate bonded to the other main surface of the laminate constituting the piezoelectric actuator.
- the present invention also includes the above-described piezoelectric actuator, an electronic circuit, a display, and a housing, and the other main surface of the laminate constituting the piezoelectric actuator is bonded to the display or the housing. It is the portable terminal characterized by having.
- the reinforcing plate provided with the bent portion, it is possible to obtain a piezoelectric actuator in which peeling of the flexible substrate due to the influence of vibration of the piezoelectric element is suppressed even when driven for a long time.
- FIG. (A) is a schematic perspective view which shows an example of embodiment of the piezoelectric actuator of this invention
- (b) is an AA schematic sectional drawing shown to (a).
- (A) is a schematic perspective view which shows an example of embodiment of the piezoelectric actuator of this invention
- (b) is the AA schematic sectional drawing shown to (a)
- (c) is B shown to (a).
- FIG. (A)-(c) is a schematic sectional drawing which shows the other example of embodiment of the piezoelectric actuator of this invention.
- 1 is a schematic perspective view schematically showing a piezoelectric vibration device according to an embodiment of the present invention. It is a schematic perspective view which shows typically the portable terminal of embodiment of this invention.
- FIG. 6 is a schematic sectional view taken along line AA shown in FIG.
- FIG. 6 is a schematic cross-sectional view taken along line BB shown in FIG.
- FIG. 1A is a schematic perspective view showing an example of an embodiment of the piezoelectric actuator of the present invention
- FIG. 1B is a schematic cross-sectional view taken along line AA shown in FIG. 2A
- FIG. 2B is a schematic cross-sectional view taken along line AA shown in FIG. 2A
- FIG. 2C is a schematic cross-sectional view taken along line BB shown in FIG.
- the piezoelectric actuator 1 of the example shown in FIGS. 1 and 2 includes a laminated body 14 in which an internal electrode 12 and a piezoelectric layer 13 are laminated, and a surface electrically connected to the internal electrode 12 on one main surface of the laminated body 14.
- a piezoelectric element 10 having an electrode 15, a flexible substrate 2 electrically joined to the surface electrode 15, and a reinforcing plate 3 fixed to a region overlapping the piezoelectric element 10 when viewed from the stacking direction of the flexible substrate 2.
- the reinforcing plate 3 is provided with a bent portion 31.
- the piezoelectric actuator 1 of this example has a piezoelectric element 10, and a laminated body 14 constituting the piezoelectric element 10 is formed by laminating an internal electrode 12 and a piezoelectric layer 13 into a plate shape.
- the plurality of internal electrodes 12 have an active portion that overlaps in the stacking direction and other inactive portions, and are formed in a long shape, for example.
- the length of the laminate 14 is preferably, for example, 18 mm to 28 mm, and more preferably 22 mm to 25 mm.
- the width of the laminate 14 is preferably 1 mm to 6 mm, and more preferably 3 mm to 4 mm.
- the thickness of the laminate 14 is preferably, for example, 0.2 mm to 1.0 mm, and more preferably 0.4 mm to 0.8 mm.
- the internal electrode 12 constituting the laminate 14 is formed by simultaneous firing with ceramics forming the piezoelectric layer, and includes a first electrode and a second electrode.
- the first electrode is a ground electrode
- the second electrode is a positive electrode or a negative electrode.
- the piezoelectric layers 13 are alternately stacked to sandwich the piezoelectric layers 13 from above and below, and the first electrode and the second electrode are arranged in the stacking order, so that the piezoelectric layers 13 sandwiched between them are arranged.
- a drive voltage is applied to the.
- a conductor mainly composed of silver or a silver-palladium alloy having a low reactivity with piezoelectric ceramics, or a conductor containing copper, platinum, or the like can be used. You may make it contain.
- the end portions of the first electrode and the second electrode are alternately led to a pair of opposite side surfaces of the laminate 4.
- the length of the internal electrode 12 is preferably, for example, 17 mm to 25 mm, and more preferably 21 mm to 24 mm.
- the width of the internal electrode 12 is preferably 1 mm to 5 mm, and more preferably 2 mm to 4 mm.
- the thickness of the internal electrode 12 is preferably 0.1 to 5 ⁇ m, for example.
- the piezoelectric layer 13 constituting the laminated body 14 is formed of ceramics having piezoelectric characteristics.
- ceramics for example, a perovskite oxide made of lead zirconate titanate (PbZrO 3 -PbTiO 3 ), Lithium niobate (LiNbO 3 ), lithium tantalate (LiTaO 3 ), or the like can be used.
- the thickness of one layer of the piezoelectric layer is preferably set to 0.01 to 0.1 mm, for example, so as to be driven at a low voltage. In order to obtain a large bending vibration, it is preferable to have a piezoelectric constant d31 of 200 pm / V or more.
- a surface electrode 15 electrically connected to the internal electrode 12 is provided on one main surface of the laminate 14.
- the surface electrode 15 in the form shown in FIGS. 1 and 2 includes a first surface electrode 151 having a large area, a second surface electrode 152 having a small area, and a third surface electrode 153.
- the first surface electrode 151 is electrically connected to the internal electrode 12 serving as the first electrode
- the second surface electrode 152 is, for example, the internal electrode 12 serving as the second electrode disposed on one main surface side.
- the third surface electrode 153 is electrically connected to the internal electrode 12 serving as the second electrode disposed on the other main surface side, for example.
- the length of the first surface electrode 151 is preferably 17 mm to 23 mm, for example, and more preferably 19 mm to 21 mm.
- the width of the first surface electrode 151 is preferably 1 mm to 5 mm, for example, and more preferably 2 mm to 4 mm.
- the lengths of the second surface electrode 152 and the third surface electrode 153 are preferably 1 mm to 3 mm, for example.
- the widths of the second surface electrode 152 and the third surface electrode 153 are preferably 0.5 mm to 1.5 mm, for example.
- the piezoelectric actuator 1 has a flexible substrate 2 electrically joined to the surface electrode 15.
- the flexible substrate 2 is provided with two wiring conductors 22 on the surface of a base film 21 made of, for example, a resin, and a cover film 23 in a region excluding the junction with the piezoelectric element 10 and the vicinity thereof.
- Flexible printed wiring board A part of the flexible substrate 2 is bonded to one main surface of the laminate 14 constituting the piezoelectric element 10 via the conductive bonding member 4, and the wiring conductor 22 is connected to the surface electrode 15 via the conductive bonding member 4. Electrically connected.
- the cover film 23 only needs to be provided in a region excluding the connection portion with the surface electrode 15 of the wiring conductor 22, but the region overlapping with the piezoelectric element 10 and the vicinity thereof are not provided with the cover film 23. A reliable electrical connection can be obtained without being affected by the thickness of the cover film 23.
- the flexible substrate 2 is joined to the piezoelectric element 10 at one end, and joined to an external circuit (connector) at the other end.
- the conductive bonding member 4 is made of a conductive adhesive or solder, but is preferably a conductive adhesive.
- a conductive material obtained by dispersing conductive particles 41 made of, for example, gold, copper, nickel, or gold-plated resin balls in a resin adhesive 42 such as acrylic resin, epoxy resin, silicone resin, polyurethane resin, or synthetic rubber. This is because the use of an adhesive can reduce stress caused by vibration compared to solder.
- the conductive adhesive is preferably an anisotropic conductive material.
- the anisotropic conductive material is composed of conductive particles 41 responsible for electrical joining and a resin adhesive 42 responsible for adhesion. Specifically, one conductive particle 41 is in contact with the surface electrode 15 and the wiring conductor 22.
- the anisotropic conductive material 4 is conductive in the thickness direction and insulated in the in-plane direction, so that even in a narrow pitch wiring, there is no electrical short-circuit between the surface electrodes of different polarities.
- substrate 2 can be made compact.
- the piezoelectric actuator 1 of this example includes a reinforcing plate 3 fixed to a region overlapping the piezoelectric element 10 when viewed from the stacking direction of the flexible substrate 2, and the reinforcing plate 3 is provided with a bent portion 31. ing.
- the reinforcing plate 3 is a metal such as glass epoxy (FR-4), composite (CEM-3), polyetherimide, polyimide, polyester, etc., stainless steel, aluminum and alloys thereof, and has a thickness of 50 to 200 ⁇ m, for example. It is said that.
- the bent portion 31 is a portion where the flexible substrate 2 is bent in the thickness direction of the reinforcing plate 3 (the stacking direction of the piezoelectric elements 10).
- the vibration of the flexible substrate 2 is absorbed by the reinforcing plate 3, and when the vibration reaches the bent portion 31 of the reinforcing plate 3, vibration energy is further absorbed by the bent portion 31 and the vibration is attenuated. .
- the flexible substrate 2 is difficult to peel off even when driven for a long time.
- the flexible substrate 2 since the flexible substrate 2 is bent along the position of the bent portion 31 of the reinforcing plate 3, the flexible substrate 2 comes into contact with the bent portion 31 of the reinforcing plate 3 and bends. When absorbing the vibration, the vibration of the flexible substrate 2 can be absorbed more effectively.
- the reinforcing plate 3 is thicker than the thickness of the flexible substrate 2, and this can increase the effect of suppressing vibration.
- the reinforcing plate 3 is preferably bonded to the upper surface of the flexible substrate 2 via a resin adhesive. Thereby, vibration can be suppressed even in the resin adhesive portion.
- the flexible substrate 2 has a first region 201 that overlaps with the piezoelectric element 10 and a second region 202 that does not overlap with the piezoelectric element 10, and the reinforcing plate 3 is provided from the first region 201 to the second region 202.
- the bent portion 31 is preferably located at the boundary (the same position as the end face of the piezoelectric element 10) between the first region 201 and the second region 202 or outside the boundary.
- a bent portion 31 as shown in FIG. 3A is located in the first region 201 (outside the end face of the surface electrode 15 and inside the end face of the piezoelectric element 10) when viewed from above one main surface of the multilayer body 14.
- the bent portion 31 as shown in FIG. 1, FIG. 2, FIG. 3 (b) and FIG. (Same position as the end face of the piezoelectric element 10) or a configuration located outside the boundary makes it difficult for vibration to be transmitted to most of the second region 202 in the flexible substrate 2.
- the flexible substrate 2 is difficult to peel off even if it is driven for a longer time.
- noise can also be reduced.
- the flexible substrate 2 includes a base film 21 and a wiring conductor 22 provided on the lower surface of the base film 21, so that the wiring conductor 22 is electrically connected to the surface electrode 15.
- the conductive bonding member 4 anisotropic conductive material
- the conductive bonding member 4 is overlapped with the bent portion 31 when viewed from above the one main surface of the laminate 14. It is preferable that the position is also provided.
- the conductive bonding member 4 (anisotropic conductive material) is also provided at a position overlapping the bent portion 31 when viewed from above the one main surface of the laminate 14, the conductive member 4 is positioned at the position overlapping the bent portion 31.
- the conductive bonding member 4 (anisotropic conductive material) also absorbs vibration. Moreover, the adhesion area of the piezoelectric element 10 and the flexible substrate 2 increases, and it becomes difficult to peel off.
- the reinforcing plate 3 is bent in the thickness direction and the bent portion 31 is formed, an effect of absorbing vibration can be obtained, but it is particularly preferable that the reinforcing plate 3 is bent toward the piezoelectric element 10 side (downward). Thus, the vibration can be attenuated so as to wrap the piezoelectric element 10 and the stress to be peeled off can be suppressed.
- the flexible substrate 2 is spaced from the first region 201 in the second region 202 (the lower surface of the second region 202). And has a cover film 23 provided so as to cover a part of the wiring conductor 22, and the bent portion 31 is located at a position where it does not overlap with the cover film 23 when viewed from above one main surface of the laminate 14. Preferably there is. If there is a cover film 23 at a position overlapping with the bent portion 31, vibration of the cover film 23 is applied, and vibration is hardly attenuated by transmitting the cover film 23, whereas in a portion where there is no cover film 23. The presence of the bent portion 31 is effective because the cover film 23 is attenuated as it is without vibration.
- the tip of the reinforcing plate 3 is provided so as to extend to a position overlapping the cover film 23 when viewed from above one main surface of the laminate 14.
- the reinforcing plate 3 is provided so that the front end of the reinforcing plate 3 overlaps the cover film 23 by 0.5 to 1 mm. Thereby, the distance which absorbs the vibration by the reinforcement board 3 becomes long, and becomes easy to attenuate
- the base film 23 and the reinforcing plate 3 are preferably made of the same material.
- the base film 23 and the reinforcing plate 3 are made of polyimide, so that the base film 23 and the reinforcing plate 3 are mechanically formed.
- the properties are the same, and the peeling due to the difference in thermal expansion is less likely to occur between them.
- the end of the conductive bonding member 4 (anisotropic conductive material) is aligned with the end of the laminate 14, but it may be extended toward the cover film 23, and the piezoelectric element 10 It may be extended from the corner
- the conductive bonding member 4 (anisotropic conductive material) has a function of protecting the wiring conductor 22, and damage to the wiring conductor 22 due to friction with the corners of the piezoelectric element 10 can be prevented.
- the corners of the piezoelectric element 10 covered with the flexible substrate 2 may be chamfered.
- the piezoelectric actuator 1 according to the present invention is a so-called bimorph type piezoelectric actuator that receives an electrical signal from the surface electrode 15 and vibrates and vibrates so that one main surface and the other main surface are bent surfaces.
- the piezoelectric actuator of the present invention is not limited to the bimorph type, and may be a unimorph type.
- the other main surface of the piezoelectric actuator is bonded (bonded) to a diaphragm described later, so that the unimorph type can be bent. Can be vibrated.
- a ceramic green sheet to be the piezoelectric layer 13 is produced. Specifically, a ceramic slurry is prepared by mixing a calcined powder of piezoelectric ceramic, a binder made of an organic polymer such as acrylic or butyral, and a plasticizer. And a ceramic green sheet is produced using this ceramic slurry by using tape molding methods, such as a doctor blade method and a calender roll method.
- the piezoelectric ceramic any material having piezoelectric characteristics may be used.
- a perovskite oxide made of lead zirconate titanate (PbZrO 3 —PbTiO 3 ) can be used.
- the plasticizer dibutyl phthalate (DBP), dioctyl phthalate (DOP), or the like can be used.
- a conductive paste to be the internal electrode 12 is produced.
- a conductive paste is prepared by adding and mixing a binder and a plasticizer to a metal powder of a silver-palladium alloy. This conductive paste is applied on the ceramic green sheet in the pattern of the internal electrodes 12 using a screen printing method. Further, a plurality of ceramic green sheets on which the conductive paste is printed are laminated, subjected to binder removal treatment at a predetermined temperature, fired at a temperature of 900 to 1200 ° C., and then subjected to a predetermined grinding using a surface grinder or the like. By performing a grinding process so as to have a shape, a laminated body 14 including the internal electrodes 12 and the piezoelectric body layers 13 that are alternately laminated is manufactured.
- the laminated body 14 is not limited to the one produced by the above manufacturing method, and any production method can be used as long as the laminated body 14 formed by laminating a plurality of internal electrodes 12 and piezoelectric layers 13 can be produced. It may be produced.
- a silver glass-containing conductive paste prepared by adding a binder, a plasticizer, and a solvent to a mixture of conductive particles mainly composed of silver and glass is used as a main electrode of the laminate 14 in a pattern of the surface electrode 15.
- a baking process is performed at a temperature of 650 to 750 ° C. to form the surface electrode 15.
- a via that penetrates the piezoelectric layer 13 may be formed or connected, or a side electrode may be formed on the side surface of the multilayer body 14, It may be produced by any manufacturing method.
- the flexible substrate 2 and the reinforcing plate 3 are prepared.
- the reinforcing plate 3 having the bent portion 31 may be processed into a final shape together with the reinforcing plate 3 when the flexible substrate 2 is separated from the sheet using a mold or the like (when it is made into individual pieces).
- the reinforcing plate 3 processed into a final shape in advance with a mold or the like may be bonded to a predetermined position from the beginning.
- the flexible substrate 2 is connected and fixed (bonded) to the piezoelectric element 10 using a conductive bonding member.
- a conductive bonding member paste made of, for example, solder, silver paste, anisotropic conductive material or the like is applied and formed at a predetermined position of the piezoelectric element 10 using a technique such as screen printing. Then, the flexible substrate 2 is connected and fixed to the piezoelectric element 10 by curing the conductive bonding member paste in a state where the flexible substrate 2 is brought into contact therewith.
- the conductive bonding member paste may be applied and formed on the flexible substrate 2 side.
- the conductive bonding member 4 is a conductive adhesive and the resin constituting the conductive adhesive is made of a thermoplastic resin
- the conductive adhesive is placed at a predetermined position on the piezoelectric element 10 or the flexible substrate 2.
- the thermoplastic resin softens and flows by heating and pressing in a state where the piezoelectric element 10 and the flexible substrate 2 are brought into contact with each other through a conductive adhesive, and then returned to room temperature to be heated again.
- the plastic resin is cured, and the flexible substrate 2 is connected and fixed to the piezoelectric element 10.
- a flexible substrate 2 (to be described later) is bonded to the piezoelectric element 10 using a mold having a desired shape, and at the same time, the reinforcing plate 3 is fixed to the flexible substrate 2 and the bent portion 31 is formed on the reinforcing plate 3. May be.
- the piezoelectric vibration device of the present invention is characterized by including a piezoelectric actuator 1 and a vibration plate 81 joined to the other main surface of the laminate 14 constituting the piezoelectric actuator 1.
- the piezoelectric actuator 1 used here is the piezoelectric actuator 1 shown in FIGS.
- the diaphragm 81 has a rectangular thin plate shape.
- the diaphragm 81 can be preferably formed using a material having high rigidity and elasticity, such as acrylic resin or glass.
- the thickness of the diaphragm 81 is set to 0.4 mm to 1.5 mm, for example.
- the diaphragm 81 is attached to the other main surface of the piezoelectric actuator 1 via a joining member 82.
- the entire surface of the other main surface may be bonded to the vibration plate 81 via the bonding member 82, or the substantially entire surface may be bonded.
- the joining member 82 is more deformable than the diaphragm 81. That is, the joining member 82 can be deformed when the diaphragm 81 is vibrated by driving the piezoelectric actuator 1, and is deformed more greatly than the diaphragm 81 when the same force is applied.
- a joining member 82 has, for example, a film shape. It is made of a material that is softer and easier to deform than the diaphragm 81, and has a smaller elastic modulus and rigidity such as Young's modulus, rigidity, and bulk modulus than the diaphragm 81.
- the other main surface (main surface on the ⁇ z direction side in the drawing) of the piezoelectric actuator 1 is fixed to one main surface (main surface on the + z direction side in the drawing) of the bonding member 82, so A part of one main surface (main surface on the + z direction side in the drawing) of the diaphragm 81 is fixed to the surface (main surface on the ⁇ z direction side in the drawing).
- the deformable joining member 82 is larger than the diaphragm 81 when vibration is transmitted from the piezoelectric actuator 1. Deform.
- the piezoelectric actuator 1 transmits strong vibration to the vibration plate 81 without being influenced by the surrounding vibration. Can be made.
- the joining member 82 since at least a part of the joining member 82 is made of a viscoelastic body, strong vibration from the piezoelectric actuator 1 is transmitted to the vibration plate 81, while weak vibration reflected from the vibration plate 81 is transmitted to the joining member 82. It is preferable in that it can be absorbed.
- a double-sided tape in which a pressure-sensitive adhesive is attached to both surfaces of a base material made of a nonwoven fabric or the like, or a joining member including an elastic adhesive can be used, and the thickness thereof is, for example, 10 ⁇ m to 2000 ⁇ m. Can be used.
- the joining member 82 may be a single member or a composite body composed of several members.
- a joining member 82 for example, a double-sided tape in which a pressure-sensitive adhesive is attached to both surfaces of a base material made of a nonwoven fabric or the like, various elastic adhesives that are adhesives having elasticity, and the like can be suitably used.
- the thickness of the joining member 82 is preferably larger than the amplitude of the bending vibration of the piezoelectric actuator 1, but if it is too thick, the vibration is attenuated, so that it is set to 0.1 mm to 0.6 mm, for example.
- the material of the bonding member 82 is not limited, and the bonding member 82 may be formed of a material that is harder and more difficult to deform than the vibration plate 81. Moreover, depending on the case, the structure which does not have the joining member 82 may be sufficient.
- the piezoelectric vibration device of this example having such a configuration functions as a piezoelectric vibration device that causes the piezoelectric actuator 1 to bend and vibrate by applying an electric signal, thereby vibrating the vibration plate 81.
- the other end of the diaphragm 81 in the length direction (the end in the ⁇ y direction in the figure, the peripheral edge of the diaphragm 81, etc.) may be supported by a support member (not shown).
- the piezoelectric vibration device of this example is configured using the piezoelectric actuator 1 in which peeling of the flexible substrate 2 is suppressed, the piezoelectric vibration device can be driven stably for a long period of time.
- a vibration plate 81 is bonded to the other flat main surface of the laminate 14 constituting the piezoelectric actuator 1.
- the portable terminal of the present invention includes the piezoelectric actuator 1, an electronic circuit (not shown), a display 91, and a housing 92.
- the other main surface of the laminated body 14 is bonded to a display 91 or a casing 92.
- 5 is a schematic perspective view schematically showing the portable terminal of the present invention
- FIG. 6 is a schematic cross-sectional view taken along the line AA shown in FIG. 5
- FIG. 7 is a line BB shown in FIG. It is the schematic sectional drawing cut
- the piezoelectric actuator 1 is attached to a part of the casing 92 that serves as a cover for the display 91, and a part of the casing 92 functions as the diaphragm 922.
- the housing 92 includes a box-shaped housing main body 921 having one surface opened, and a diaphragm 922 that closes the opening of the housing main body 921.
- the casing 92 (the casing main body 921 and the diaphragm 922) can be formed preferably using a material such as a synthetic resin having high rigidity and elastic modulus.
- the peripheral edge of the diaphragm 922 is attached to the housing main body 921 via a bonding material 93 so as to vibrate.
- the bonding material 93 is formed of a material that is softer and easier to deform than the diaphragm 922, and has a smaller elastic modulus and rigidity such as Young's modulus, rigidity, and bulk modulus than the diaphragm 922. That is, the bonding material 93 can be deformed, and deforms more greatly than the diaphragm 922 when the same force is applied.
- the bonding material 93 may be a single material or a composite made up of several members.
- a bonding material 93 for example, a double-sided tape in which an adhesive is attached to both surfaces of a base material made of a nonwoven fabric or the like can be suitably used.
- the thickness of the bonding material 93 is set so that the vibration is not attenuated due to being too thick, and is set to, for example, 0.1 mm to 0.6 mm.
- the material of the bonding material 93 is not limited, and the bonding material 93 may be formed of a material that is harder than the vibration plate 922 and hardly deforms. Moreover, depending on the case, the structure which does not have the joining material 93 may be sufficient.
- Examples of the electronic circuit include a circuit for processing image information to be displayed on the display 91 and audio information transmitted by the portable terminal, a communication circuit, and the like. At least one of these circuits may be included, or all the circuits may be included. Further, it may be a circuit having other functions. Furthermore, you may have a some electronic circuit.
- the electronic circuit and the piezoelectric actuator 1 are connected by a connection wiring (not shown).
- the display 91 is a display device having a function of displaying image information.
- a known display such as a liquid crystal display, a plasma display, and an organic EL display can be suitably used.
- the display 91 may have an input device such as a touch panel.
- the cover (diaphragm 922) of the display 91 may have an input device such as a touch panel.
- the entire display 91 or a part of the display 91 may function as a diaphragm.
- the piezoelectric actuator 1 and the housing 92 (vibrating plate 922) are joined using a joining member that can be deformed more than the housing 92 (vibrating plate 922). That is, in FIG. 6 and FIG. 7, the joining member 82 is a deformable joining member.
- the deformable joining member 82 is larger than the housing 92 when vibration is transmitted from the piezoelectric actuator 1.
- the joining member 82 can be deformed when the housing 92 is vibrated by driving the piezoelectric actuator 1, and is deformed to be larger than the housing 92 when the same force is applied.
- Such a joining member 82 has, for example, a film shape.
- the housing 92 is made of a material that is softer and more easily deformed, and has a smaller elastic modulus and rigidity such as Young's modulus, rigidity, and bulk modulus than the housing 92.
- the anti-phase vibration reflected from the casing 92 can be mitigated by the deformable joining member 82, so that the piezoelectric actuator 1 transmits strong vibration to the casing 92 without being affected by the surrounding vibration. Can be made.
- the joining member 82 since at least a part of the joining member 82 is made of a viscoelastic body, strong vibration from the piezoelectric actuator 1 is transmitted to the housing 92, while the joining member 82 transmits weak vibration reflected from the housing 92. It is preferable in that it can be absorbed.
- a double-sided tape in which a pressure-sensitive adhesive is attached to both surfaces of a base material made of a nonwoven fabric or the like, or a joining member including an elastic adhesive can be used, and the thickness thereof is, for example, 10 ⁇ m to 2000 ⁇ m. Can be used.
- the piezoelectric actuator 1 is bonded to the housing 92, but the piezoelectric actuator 1 may be bonded to the display 91. In this case, the piezoelectric actuator 1 and the display 91 are connected to the display 91. It is preferable to join using a deformable joining member.
- the portable terminal of the present invention is characterized in that the display 91 or the casing 92 generates vibration that transmits sound information through the ear cartilage or air conduction.
- the portable terminal of this example can transmit sound information by transmitting a vibration to the cartilage of the ear by bringing the diaphragm (display 91 or housing 92) into contact with the ear directly or via another object. That is, sound information can be transmitted by bringing a vibration plate (display 91 or housing 92) into direct or indirect contact with the ear and transmitting vibration to the cartilage of the ear.
- a portable terminal capable of transmitting sound information even when the surroundings are noisy can be obtained.
- the object interposed between the diaphragm (display 91 or housing 92) and the ear may be, for example, a cover of a mobile terminal, a headphone or an earphone, and any object that can transmit vibration. Anything can be used. Further, it may be a portable terminal that transmits sound information by propagating sound generated from the diaphragm (display 91 or housing 92) in the air. Furthermore, it may be a portable terminal that transmits sound information via a plurality of routes.
- the portable terminal of this example transmits sound information using the piezoelectric actuator 1 in which peeling of the flexible substrate 2 is suppressed, high-quality sound information can be transmitted over a long period of time.
- a piezoelectric actuator was manufactured as shown below.
- the piezoelectric element had a long shape with a length of 23.5 mm, a width of 3.3 mm, and a thickness of 0.5 mm.
- the piezoelectric element has a structure in which piezoelectric layers having a thickness of 30 ⁇ m and internal electrodes are alternately stacked, and the total number of piezoelectric layers is 16.
- the piezoelectric layer was formed of lead zirconate titanate in which part of Zr was replaced with Sb.
- As the internal electrode an alloy of silver palladium was used.
- the surface electrode was printed so as to be 1 mm longer at both ends in the width direction than the internal electrode to obtain a surface electrode.
- a voltage with an electric field strength of 2 kV / mm was applied between the internal electrodes (between the first electrode and the second electrode) via the surface electrode to polarize the piezoelectric element.
- the flexible substrate and the reinforcing plate were produced as follows. First, a copper foil serving as a wiring conductor is bonded to a polyimide film as a sheet in which a large number of base films are arranged (a multi-sheet for base film) using an adhesive. Next, a conductor pattern of the wiring conductor is formed by a photolithography technique, and a polyimide film serving as a cover film is bonded using an adhesive for insulation and conductor protection. Next, a gold plating treatment is performed, and a polyimide sheet having a thickness of 125 ⁇ m (a multi-sheet for reinforcing plate) serving as a reinforcing plate is not formed with a wiring conductor of a multi-sheet for base film using a thermosetting adhesive.
- the flexible substrate and the reinforcing plate were produced by bonding to the surface and punching into a desired shape with a mold.
- the reinforcing plate having the shape shown in FIG. 2 was used in which a bent portion was produced by applying pressure using a mold having a desired shape in advance.
- a paste dispersed in a synthetic rubber adhesive was prepared, printed on the surface electrode by screen printing, and then pressed while heating the flexible substrate to produce a piezoelectric actuator.
- a piezoelectric actuator was manufactured by the same method as in the above example using a flexible substrate not provided with a reinforcing plate.
- each piezoelectric actuator was affixed to a diaphragm and a reliability test was performed.
- a 100,000-cycle sine wave signal was continuously applied and driven, the displacement amount of the diaphragm was zero in the piezoelectric actuator of the comparative example.
- the piezoelectric actuator of the comparative example the flexible substrate was peeled off from the piezoelectric element, and no voltage was applied.
- a displacement of about 4 ⁇ m was confirmed on the diaphragm, and the flexible substrate was not peeled off.
- Piezoelectric actuator 10 Piezoelectric element 12: Internal electrode 13: Piezoelectric layer 14: Laminate 15: Surface electrode 151: First surface electrode 152: Second surface electrode 153: Third surface electrode 2: Flexible substrate 201: 1st area
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
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- Piezo-Electric Transducers For Audible Bands (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
Description
補強板は、図2に示した形状であり、あらかじめ所望の形状をした金型を用いて加圧して屈曲部を作製したものを用いた。
10:圧電素子
12:内部電極
13:圧電体層
14:積層体
15:表面電極
151:第1の表面電極
152:第2の表面電極
153:第3の表面電極
2:フレキシブル基板
201:第1の領域
202:第2の領域
21:ベースフィルム
22:配線導体
23:カバーフィルム
3:補強板
31:屈曲部
4:導電性接合部材
41:導電粒子
42:樹脂接着剤
81:振動板
82:接合部材
91:ディスプレイ
92:筐体
921:筐体本体
922:振動板
93:接合材
Claims (12)
- 内部電極および圧電体層が積層された積層体、および該積層体の一方主面に前記内部電極と電気的に接続された表面電極を備えた圧電素子と、前記表面電極と電気的に接合されたフレキシブル基板と、該フレキシブル基板上であって前記圧電素子と重なる領域に固着された補強板とを有しており、該補強板には屈曲部が設けられていることを特徴とする圧電アクチュエータ。
- 前記フレキシブル基板は前記圧電素子と重なる第1の領域および前記圧電素子と重ならない第2の領域を有し、前記補強板は前記第1の領域から前記第2の領域にかけて設けられており、前記屈曲部が前記第1の領域と前記第2の領域との境界または該境界よりも外側に位置していることを特徴とする請求項1に記載の圧電アクチュエータ。
- 前記フレキシブル基板はベースフィルムおよび配線導体を備え、該配線導体が前記表面電極と電気的に接続されるように異方性導電材を介して接合され、該異方性導電材が前記一方主面の上方から見て前記屈曲部と重なる位置にも設けられていることを特徴とする請求項2に記載の圧電アクチュエータ。
- 前記補強板が前記圧電素子側に折れ曲がっていることを特徴とする請求項2または請求項3に記載の圧電アクチュエータ。
- 前記フレキシブル基板は前記第2の領域に前記第1の領域と間隔をあけて前記配線導体の一部を覆うように設けられたカバーフィルムを有しており、
前記屈曲部が、前記一方主面の上方から見て前記カバーフィルムと重ならない位置にあることを特徴とする請求項2乃至請求項4のうちのいずれかに記載の圧電アクチュエータ。 - 前記補強板の先端が、前記一方主面の上方から見て前記カバーフィルムと重なる位置まで延びて設けられていることを特徴とする請求項5に記載の圧電アクチュエータ。
- 前記ベースフィルムと前記補強板とが同一の素材からなる請求項1乃至請求項6のうちのいずれかに記載の圧電アクチュエータ。
- 請求項1乃至請求項7のうちのいずれかに記載の圧電アクチュエータと、該圧電アクチュエータを構成する前記積層体の他方主面に接合された振動板とを有することを特徴とする圧電振動装置。
- 前記圧電アクチュエータと前記振動板とが該振動板よりも変形可能な接合部材を用いて接合されていることを特徴とする請求項8に記載の圧電振動装置。
- 請求項1乃至請求項7のうちのいずれかに記載の圧電アクチュエータと、電子回路と、ディスプレイと、筐体とを有しており、前記圧電アクチュエータを構成する前記積層体の他方主面が前記ディスプレイまたは前記筐体に接合されていることを特徴とする携帯端末。
- 前記圧電アクチュエータと前記ディスプレイまたは前記筐体とが該ディスプレイまたは該筐体よりも変形可能な接合部材を用いて接合されていることを特徴とする請求項10に記載の携帯端末。
- 前記ディスプレイまたは前記筐体は、耳の軟骨または気導を通して音情報を伝える振動を生じさせることを特徴とする請求項10または請求項11に記載の携帯端末。
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US14/439,111 US9899591B2 (en) | 2012-12-17 | 2013-12-17 | Piezoelectric actuator, piezoelectric vibration apparatus, and portable terminal |
JP2014553155A JP6140731B2 (ja) | 2012-12-17 | 2013-12-17 | 圧電アクチュエータ、圧電振動装置および携帯端末 |
CN201390000837.5U CN204577470U (zh) | 2012-12-17 | 2013-12-17 | 压电致动器、压电振动装置及便携式终端 |
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Also Published As
Publication number | Publication date |
---|---|
US9899591B2 (en) | 2018-02-20 |
US20150311423A1 (en) | 2015-10-29 |
CN204577470U (zh) | 2015-08-19 |
JP6140731B2 (ja) | 2017-05-31 |
JPWO2014098077A1 (ja) | 2017-01-12 |
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