JPWO2013069408A1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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Abstract
Description
図1,2,16を用いて実施の形態1にかかる高耐圧ICについて説明する。図1は、実施の形態1にかかる高耐圧ICの要部を示す平面図である。また、図2は、図1の切断線A−A’における断面構造を示す断面図である。図1には、実施の形態1にかかる高耐圧IC内部におけるハイサイド駆動回路300および高耐圧接合終端領域(HVJT)400の要部を示す。図1に示すように、p-型シリコン基板(第1導電型の半導体層、不図示)には、nウエル領域201、n-型領域(第2導電型ウエル領域)101およびpウエル領域(第1導電型ウエル領域)102が配置されている。
図4は、実施の形態2にかかる高耐圧ICの要部を示す平面図である。また、図5は、図4の切断線B−B’における断面構造を示す断面図である。図6は、図4の切断線C−C’における断面構造を示す断面図である。図4には、実施の形態2にかかる高耐圧IC内部におけるハイサイド駆動回路300および高耐圧接合終端領域410の要部を示す。実施の形態2にかかる高耐圧ICが実施の形態1と異なるのは、抵抗性フィールドプレート構造を構成する高抵抗ポリシリコン薄膜411の第1コンタクト部412を、第1メタル層からなるOUT電極160に接続している点である。
図7は、実施の形態3にかかる高耐圧ICの要部を示す平面図である。また、図8は、図7の切断線D−D’における断面構造を示す断面図である。図7には、実施の形態3にかかる高耐圧IC内部におけるハイサイド駆動回路300および高耐圧接合終端領域420の要部を示す。図7の切断線E−E’における断面構造は、図6に示す断面構造と同様である。実施の形態3にかかる高耐圧ICは、実施の形態2にかかる高耐圧ICの変形例である。実施の形態3にかかる高耐圧ICが実施の形態2と異なるのは、ピックアップコンタクト部413が設けられていない部分424に、Vcc1電極172も設けられていない点である。
図9は、実施の形態4にかかる高耐圧ICの要部を示す平面図である。図9には、実施の形態4にかかる高耐圧IC内部におけるハイサイド駆動回路300、高耐圧接合終端領域、および高耐圧トランジスタ(高耐圧nチャネルMOSFET)の要部を示す。実施の形態4にかかる高耐圧ICは、実施の形態2にかかる高耐圧ICの変形例である。実施の形態4にかかる高耐圧ICが実施の形態2と異なるのは、pウエル領域102上に高耐圧nチャネルMOSFET(2入力方式)430が設けられ、高耐圧nチャネルMOSFET430と高耐圧接合終端領域とがドレイン配線432によって接続されている点である。
図10は、実施の形態5にかかる高耐圧ICの要部を示す平面図である。図10には、実施の形態5にかかる高耐圧IC内部におけるハイサイド駆動回路300、高耐圧接合終端領域400、および高耐圧トランジスタの要部を示す。実施の形態5にかかる高耐圧ICが実施の形態1にかかる高耐圧ICと異なるのは、高耐圧nチャネルMOSFET501および高耐圧pチャネルMOSFET502が高耐圧接合終端領域(HVJT)400と一体化して形成されている点である。
図13は、実施の形態6にかかる高耐圧ICの要部を示す平面図である。また、図14は、実施の形態6にかかる高耐圧ICの一領域の要部を模式的に示す斜視図である。図13には、高電位領域181、低電位領域182、高耐圧接合終端領域183および高耐圧MOSFET190の要部を示す。図14には、高耐圧MOSFET190の構成を示す。実施の形態6にかかる高耐圧ICが実施の形態1と異なるのは、高耐圧接合終端領域183内に高耐圧MOSFET190が設けられている点である。
102 pウエル領域
120 OUT電極
121 グランド電極
122 Vcc1電極
201 nウエル領域
300 ハイサイド駆動回路
401 高抵抗ポリシリコン薄膜
402 第1コンタクト部
403 第2コンタクト部
Claims (12)
- 一方の面が第1導電型の半導体層に接する第2導電型ウエル領域と、
前記第2導電型ウエル領域に接して前記第2導電型ウエル領域を囲む第1導電型ウエル領域と、
前記第2導電型ウエル領域内に設けられた、前記第2導電型ウエル領域よりも不純物濃度が高い第2導電型高濃度領域と、
前記第1導電型ウエル領域内に設けられた、前記第1導電型ウエル領域よりも不純物濃度が高い第1導電型高濃度領域と、
前記第2導電型ウエル領域の他方の面に絶縁膜を介して設けられた抵抗性薄膜層と、
前記抵抗性薄膜層を囲むように配置され、前記第1導電型高濃度領域に接続された第1電極と、
前記第2導電型高濃度領域に接続された、前記第1電極に印加される電圧よりも高い電圧が印加される第2電極と、
前記抵抗性薄膜層よりも前記第1電極の内周側に配置され、前記第1電極に印加される電圧よりも高い電圧でかつ前記第2電極に印加される電圧よりも低い電圧が印加される第3電極と、
を備え、
前記抵抗性薄膜層の一方の端部が前記第1電極と接続され、前記抵抗性薄膜層の他方の端部が前記第3電極と接続されていることを特徴とする半導体装置。 - 一方の面が第1導電型の半導体層に接する第2導電型ウエル領域と、
前記第2導電型ウエル領域に接して前記第2導電型ウエル領域を囲む第1導電型ウエル領域と、
前記第2導電型ウエル領域内に設けられた、前記第2導電型ウエル領域よりも不純物濃度が高い第2導電型高濃度領域と、
前記第1導電型ウエル領域内に設けられた、前記第1導電型ウエル領域よりも不純物濃度が高い第1導電型高濃度領域と、
前記第2導電型ウエル領域内の、前記第2導電型ウエル領域の他方の面側に、前記第2導電型ウエル領域よりも浅く設けられた第1導電型ボディ領域と、
前記第1導電型ボディ領域を覆う絶縁膜を介して、前記第2導電型ウエル領域の他方の面に設けられた抵抗性薄膜層と、
前記抵抗性薄膜層を囲むように配置され、前記第1導電型高濃度領域に接続された第1電極と、
前記第2導電型高濃度領域に接続された、前記第1電極に印加される電圧よりも高い電圧が印加される第2電極と、
前記抵抗性薄膜層よりも前記第1電極の内周側に配置され、前記第1電極に印加される電圧よりも高い電圧でかつ前記第2電極に印加される電圧よりも低い電圧が印加される第3電極と、
を備え、
前記抵抗性薄膜層の一方の端部が前記第1電極と接続され、前記抵抗性薄膜層の他方の端部が前記第3電極と接続されていることを特徴とする半導体装置。 - 前記第2電極は、ブートストラップ回路を構成するブートストラップコンデンサの正極側に接続され、
前記第3電極は、前記ブートストラップコンデンサの負極側に接続されていることを特徴とする請求項1に記載の半導体装置。 - 前記第2導電型ウエル領域をカソード領域とし、前記第1導電型ウエル領域をアノード領域として構成されるダイオード構造を備えることを特徴とする請求項1に記載の半導体装置。
- 前記第2導電型ウエル領域をドリフト領域とし、前記第1導電型ウエル領域をベース領域とし、前記第1導電型ウエル領域内に設けられかつ前記第1電極に接続された第2導電型領域をソース領域として構成されるトランジスタ構造を備えることを特徴とする請求項1に記載の半導体装置。
- 前記第1導電型ボディ領域をドリフト領域とし、前記第2導電型ウエル領域をベース領域とし、前記第2導電型ウエル領域内に設けられかつ前記第2電極に接続された第1導電型領域をソース領域として構成されるトランジスタ構造を備えることを特徴とする請求項2に記載の半導体装置。
- 前記抵抗性薄膜層は、渦巻き状に配置されていることを特徴とする請求項1に記載の半導体装置。
- 前記抵抗性薄膜層の他方の端部は、前記第2導電型ウエル領域と前記第2電極との間の前記絶縁膜内に引き出され、前記第3電極に接続されていることを特徴とする請求項1に記載の半導体装置。
- 前記第2導電型ウエル領域の一部を囲む第1導電型分離領域をさらに備え、
前記第2導電型ウエル領域の前記第1導電型分離領域に囲まれた領域には、前記第2導電型ウエル領域をドリフト領域とする絶縁ゲート型電界効果トランジスタが設けられていることを特徴とする請求項1に記載の半導体装置。 - 前記抵抗性薄膜層は、ポリシリコンでできていることを特徴とする請求項1に記載の半導体装置。
- 前記第2導電型ウエル領域は拡散層であることを特徴とする請求項1〜10のいずれか一つに記載の半導体装置。
- 前記第2導電型ウエル領域はエピタキシャル層であることを特徴とする請求項1〜10のいずれか一つに記載の半導体装置。
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