JPWO2013042638A1 - 熱伝導性湿気硬化型樹脂組成物 - Google Patents
熱伝導性湿気硬化型樹脂組成物 Download PDFInfo
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- JPWO2013042638A1 JPWO2013042638A1 JP2013534705A JP2013534705A JPWO2013042638A1 JP WO2013042638 A1 JPWO2013042638 A1 JP WO2013042638A1 JP 2013534705 A JP2013534705 A JP 2013534705A JP 2013534705 A JP2013534705 A JP 2013534705A JP WO2013042638 A1 JPWO2013042638 A1 JP WO2013042638A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
Abstract
Description
表1に示した配合(単位:質量部)で成分(A)〜(C)を混合し、さらに接着付与剤としてフェニルトリメトキシシランと硬化触媒としてジブチルスズアセテートを1質量部づつ加え混合し、湿気硬化型組成物を調製した。
・カネカサイリルSAT200:(株)カネカ製、両末端に加水分解性シリル基を合計2個含有するポリエーテル、23℃の粘度25Pa・s
・カネカサイリルSAT115:(株)カネカ製、加水分解性シリル基を片末端にのみ有するポリエーテル、23℃の粘度0.5Pa・s
・カネカサイリルSAT350:(株)カネカ製、両末端に加水分解性シリル基を合計2個含有するポリエーテル、23℃の粘度4Pa・s
・ARUFON UP−1000:東亞合成(株)製、反応性官能基を持たないアクリル重合体
・アルミナ粉1:平均粒径0.5μmの粉砕状アルミナ粉
・アルミナ粉2:平均粒径30μmの真球状アルミナ粉
・アルミナ粉3:平均粒径10μmの真球状アルミナ粉
1)粘度
以下の測定条件で周波数1Hzと10Hzの粘度をレオメータを用いて測定した。
測定機器:Reologica社製 DAR−100 粘弾性測定、
プレシェア せん断速度:5.0(1/S)20秒、平衡時間200秒、
歪み:1×E−2、積算回数:3回、測定回数:20回、インターバル10秒、
測定子:パラレル25、ギャップ1mm、温度25℃
プランジャー付きポリエチレン製カートリッジに充填し、カートリッジに内径5mmのノズルを付け、カートリッジをエアガンに装着し、圧力0.5MPaで10秒間押し出して、吐出した質量を測定した。
各種組成物を熱線法(薄膜)に従い熱伝導率計(京都電子工業製 QTM−D3)を用いて測定した。
各種組成物をアルミ板(A1050P)上に円状に2.2gを吐出し24時間放置後、組成物を観察し、組成物外周に液状物がブリードアウトしたか否かを確認した。
各種組成物をシート状フッ素製型に注入し23℃、50%RH、168時間養生硬化させた。得られた厚さ2mmのシート状硬化物をC2型硬度デュロメーターを用いて「硬度」(単位無し)を測定した。詳細についてはJIS K 6253(2006年)に従う。
Claims (2)
- (A)成分:架橋可能な加水分解性シリル基を2個以上含有する有機重合体、
(B)成分:熱伝導性充填剤、及び
(C)成分:架橋可能な加水分解性シリル基を片末端のみに有するポリエーテル化合物
を含有する熱伝導性湿気硬化型樹脂組成物。 - 前記(A)成分と(C)成分の配合比率は質量比で70:30〜1:99であり、前記(B)成分の配合量は(A)成分と(C)成分の合計量100質量部に対し、150〜3000質量部である請求項1に記載の熱伝導性湿気硬化型樹脂組成物。
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JP2013534705A JPWO2013042638A1 (ja) | 2011-09-21 | 2012-09-14 | 熱伝導性湿気硬化型樹脂組成物 |
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JP2011205534 | 2011-09-21 | ||
JP2011205534 | 2011-09-21 | ||
JP2013534705A JPWO2013042638A1 (ja) | 2011-09-21 | 2012-09-14 | 熱伝導性湿気硬化型樹脂組成物 |
Publications (1)
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JPWO2013042638A1 true JPWO2013042638A1 (ja) | 2015-03-26 |
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JP2013534705A Pending JPWO2013042638A1 (ja) | 2011-09-21 | 2012-09-14 | 熱伝導性湿気硬化型樹脂組成物 |
Country Status (4)
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JP (1) | JPWO2013042638A1 (ja) |
KR (1) | KR101898757B1 (ja) |
CN (1) | CN103998528B (ja) |
WO (1) | WO2013042638A1 (ja) |
Families Citing this family (8)
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CN111615539B (zh) * | 2018-02-15 | 2022-08-02 | 三键有限公司 | 导热性湿气固化型树脂组合物及其固化物 |
CN112189043A (zh) * | 2018-06-25 | 2021-01-05 | Sika技术股份公司 | 基于硅烷官能的聚合物的不含催化剂的可固化组合物 |
CN109135247A (zh) * | 2018-07-17 | 2019-01-04 | 平湖阿莱德实业有限公司 | 高导热填隙界面材料及其制备方法 |
JP2022520317A (ja) * | 2019-02-13 | 2022-03-30 | シーカ テクノロジー アクチェンゲゼルシャフト | 熱伝導性硬化性組成物 |
US11873423B2 (en) * | 2019-02-28 | 2024-01-16 | Kaneka Americas Holding, Inc. | Moisture curable adhesive compositions |
JP7256944B2 (ja) * | 2019-08-08 | 2023-04-13 | 株式会社スリーボンド | 湿気硬化型樹脂組成物および硬化物 |
MX2023010465A (es) * | 2021-03-15 | 2023-09-14 | Henkel Ag & Co Kgaa | Materiales curables a temperatura ambiente termicamente conductores de un solo componente. |
FR3136238A1 (fr) * | 2022-06-03 | 2023-12-08 | Bostik Sa | Composition bicomposante thermoconductrice de polymère silylé |
Citations (7)
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JP2004224985A (ja) * | 2003-01-24 | 2004-08-12 | Kanegafuchi Chem Ind Co Ltd | 硬化性組成物 |
WO2005073276A1 (ja) * | 2004-01-30 | 2005-08-11 | Kaneka Corporation | 加水分解性珪素基含有オキシアルキレン重合体の製造方法およびその硬化性組成物 |
JP2008088318A (ja) * | 2006-10-03 | 2008-04-17 | Momentive Performance Materials Japan Kk | 熱伝導性シリコーン組成物及びそれを用いた半導体装置 |
JP2009067877A (ja) * | 2007-09-12 | 2009-04-02 | Du Pont Mitsui Polychem Co Ltd | 放熱性樹脂組成物 |
JP2009191163A (ja) * | 2008-02-14 | 2009-08-27 | Shin Etsu Chem Co Ltd | 縮合反応硬化型シリコーンゴム組成物 |
JP2011032344A (ja) * | 2009-07-31 | 2011-02-17 | Kaneka Corp | 半導体パッケージ用硬化性樹脂組成物 |
WO2011125636A1 (ja) * | 2010-04-08 | 2011-10-13 | 電気化学工業株式会社 | 熱伝導性湿気硬化型樹脂組成物 |
Family Cites Families (7)
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JPH04335086A (ja) | 1991-05-10 | 1992-11-24 | Three Bond Co Ltd | 熱伝導性充填剤組成物 |
JP2002363429A (ja) | 2001-06-07 | 2002-12-18 | Three Bond Co Ltd | 熱伝導性組成物 |
EP1717254A1 (de) * | 2005-04-29 | 2006-11-02 | Sika Technology AG | Feuchtigkeitshärtende Zusammensetzung mit erhöhter Dehnbarkeit |
EP2078065A2 (en) * | 2006-10-10 | 2009-07-15 | Dow Corning Corporation | Extenders for organosiloxane compositions |
GB0806820D0 (en) * | 2008-04-16 | 2008-05-14 | Dow Corning | Polymeric compositions |
JP2011256214A (ja) | 2008-10-08 | 2011-12-22 | Denki Kagaku Kogyo Kk | 熱伝導性湿気硬化型樹脂組成物 |
JP2011225695A (ja) * | 2010-04-19 | 2011-11-10 | Three Bond Co Ltd | 難燃性湿気硬化型樹脂組成物 |
-
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- 2012-09-14 JP JP2013534705A patent/JPWO2013042638A1/ja active Pending
- 2012-09-14 CN CN201280046308.9A patent/CN103998528B/zh active Active
- 2012-09-14 WO PCT/JP2012/073736 patent/WO2013042638A1/ja active Application Filing
- 2012-09-14 KR KR1020147007477A patent/KR101898757B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004224985A (ja) * | 2003-01-24 | 2004-08-12 | Kanegafuchi Chem Ind Co Ltd | 硬化性組成物 |
WO2005073276A1 (ja) * | 2004-01-30 | 2005-08-11 | Kaneka Corporation | 加水分解性珪素基含有オキシアルキレン重合体の製造方法およびその硬化性組成物 |
JP2008088318A (ja) * | 2006-10-03 | 2008-04-17 | Momentive Performance Materials Japan Kk | 熱伝導性シリコーン組成物及びそれを用いた半導体装置 |
JP2009067877A (ja) * | 2007-09-12 | 2009-04-02 | Du Pont Mitsui Polychem Co Ltd | 放熱性樹脂組成物 |
JP2009191163A (ja) * | 2008-02-14 | 2009-08-27 | Shin Etsu Chem Co Ltd | 縮合反応硬化型シリコーンゴム組成物 |
JP2011032344A (ja) * | 2009-07-31 | 2011-02-17 | Kaneka Corp | 半導体パッケージ用硬化性樹脂組成物 |
WO2011125636A1 (ja) * | 2010-04-08 | 2011-10-13 | 電気化学工業株式会社 | 熱伝導性湿気硬化型樹脂組成物 |
Also Published As
Publication number | Publication date |
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CN103998528B (zh) | 2017-06-23 |
KR101898757B1 (ko) | 2018-09-13 |
CN103998528A (zh) | 2014-08-20 |
KR20140063722A (ko) | 2014-05-27 |
WO2013042638A1 (ja) | 2013-03-28 |
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