JPWO2012132836A1 - 光電変換装置及び光電変換装置の製造方法 - Google Patents
光電変換装置及び光電変換装置の製造方法 Download PDFInfo
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- 238000002161 passivation Methods 0.000 claims description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 22
- 229910052710 silicon Inorganic materials 0.000 claims description 22
- 239000010703 silicon Substances 0.000 claims description 22
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 20
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- 229910052581 Si3N4 Inorganic materials 0.000 claims description 14
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 14
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 10
- 238000004544 sputter deposition Methods 0.000 claims description 7
- 238000005229 chemical vapour deposition Methods 0.000 claims description 5
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 2
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- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
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- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910017855 NH 4 F Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
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- 239000000969 carrier Substances 0.000 description 1
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- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
Claims (13)
- 半導体基板の第1表面上に非晶質半導体膜からなる第1パッシベーション層を形成する第1の工程と、
前記半導体基板の前記第1表面と反対の第2表面上に非晶質半導体膜からなる第2パッシベーション層を形成する第2の工程と、
前記第1パッシベーション層上に保護層を形成する第3の工程と、
前記第2パッシベーション層上に絶縁層を形成する第4の工程と、
前記第1パッシベーション層上が前記保護層によって覆われた状態において、前記第2パッシベーション層の一部及び前記絶縁層の一部を除去してパターンニングする第5の工程と、
を備えることを特徴とする光電変換装置の製造方法。 - 請求項1に記載の光電変換装置の製造方法であって、
前記第5の工程後に、前記第5の工程において除去された前記第2パッシベーション層及び前記絶縁層から露出した前記半導体基板の表面を洗浄する工程であって、同時に前記保護層を除去する第6の工程を備えることを特徴とする光電変換装置の製造方法。 - 請求項1に記載の光電変換装置の製造方法であって、
前記第6の工程で用いられる洗浄液に対して、前記保護層のエッチングレートは前記絶縁層のエッチングレートよりも大きいことを特徴とする光電変換装置の製造方法。 - 請求項1に記載の光電変換装置の製造方法であって、
前記保護層は、窒化ケイ素、酸化ケイ素及び酸窒化ケイ素のいずれか1つであることを特徴とする光電変換装置の製造方法。 - 請求項1に記載の光電変換装置の製造方法であって、
前記保護層及び前記絶縁層は、窒化ケイ素膜から構成され、
前記保護層は、フッ化水素を含むエッチング液に対するエッチングレートが前記絶縁層よりも大きい層を含むことを特徴とする光電変換装置の製造方法。 - 請求項1に記載の光電変換装置の製造方法であって、
前記保護層及び前記絶縁層は、窒化ケイ素膜から構成され、
前記保護層は、前記絶縁層よりも水素含有率が大きい層を含むことを特徴とする光電変換装置の製造方法。 - 請求項1に記載の光電変換装置の製造方法であって、
前記保護層及び前記絶縁層は、窒化ケイ素膜から構成され、
前記保護層は、前記絶縁層よりもシリコン含有率が低い層を含むことを特徴とする光電変換装置の製造方法。 - 請求項1に記載の光電変換装置の製造方法であって、
前記保護層及び前記絶縁層は、窒化ケイ素膜から構成され、
前記保護層は、前記絶縁層よりも密度が小さい層を含むことを特徴とする光電変換装置の製造方法。 - 請求項1に記載の光電変換装置の製造方法であって、
前記第3の工程における前記保護層の製膜温度より前記第4の工程における前記絶縁層の製膜温度が高いことを特徴とする光電変換装置の製造方法。 - 請求項1に記載の光電変換装置の製造方法であって、
前記第3の工程では、プラズマ化学気相成長法により前記保護層を形成し、
前記第4の工程では、スパッタリング法で前記絶縁層を形成することを特徴とする光電変換装置の製造方法。 - 請求項1に記載の光電変換装置の製造方法であって、
前記第3の工程では、プラズマ化学気相成長法により前記保護層を形成し、
前記第4の工程では、前記第3の工程におけるプラズマ密度よりも高い密度のプラズマ化学気相成長法で前記絶縁層を形成することを特徴とする光電変換装置の製造方法。 - 請求項1に記載の光電変換装置の製造方法であって、
前記第6の工程後に、前記第3の工程と同一の方法で前記第1パッシベーション層上に反射防止層を形成する第7の工程を備えることを特徴とする光電変換装置の製造方法。 - 半導体基板と、
前記半導体基板の第1表面の少なくとも一部の領域上に形成された非晶質半導体膜からなる第1パッシベーション層と、
前記半導体基板の前記第1表面と反対の第2表面の少なくとも一部の領域上に形成された非晶質半導体膜からなる第2パッシベーション層と、
前記第1パッシベーション層上の少なくとも一部の領域に形成された反射防止層と、
前記第2パッシベーション層上の少なくとも一部の領域に形成された絶縁層と、
を備え、
前記反射防止層は、前記絶縁層よりエッチングレートが大きいことを特徴とする光電変換装置。
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WO2016152022A1 (ja) * | 2015-03-24 | 2016-09-29 | パナソニックIpマネジメント株式会社 | 太陽電池セルの製造方法 |
US20160284917A1 (en) * | 2015-03-27 | 2016-09-29 | Seung Bum Rim | Passivation Layer for Solar Cells |
US9525083B2 (en) * | 2015-03-27 | 2016-12-20 | Sunpower Corporation | Solar cell emitter region fabrication with differentiated P-type and N-type architectures and incorporating a multi-purpose passivation and contact layer |
WO2020149128A1 (ja) * | 2019-01-18 | 2020-07-23 | 株式会社カネカ | 太陽電池の製造方法 |
US11355697B2 (en) * | 2019-11-25 | 2022-06-07 | The Board Of Trustees Of The Leland Stanford Junior University | Nanometer scale nonvolatile memory device and method for storing binary and quantum memory states |
CN114944432A (zh) * | 2022-05-05 | 2022-08-26 | 西安隆基乐叶光伏科技有限公司 | 一种hbc太阳能电池及制备方法、电池组件 |
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JP2006128258A (ja) * | 2004-10-27 | 2006-05-18 | Sharp Corp | 太陽電池および太陽電池の製造方法 |
JP2009152222A (ja) * | 2006-10-27 | 2009-07-09 | Kyocera Corp | 太陽電池素子の製造方法 |
JP2010504636A (ja) * | 2006-09-26 | 2010-02-12 | コミサリア、ア、レネルジ、アトミク | 背面ヘテロ接合太陽電池製造方法 |
WO2010113750A1 (ja) * | 2009-03-30 | 2010-10-07 | 三洋電機株式会社 | 太陽電池 |
JP2010258043A (ja) * | 2009-04-21 | 2010-11-11 | Sanyo Electric Co Ltd | 太陽電池 |
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JP2009088203A (ja) * | 2007-09-28 | 2009-04-23 | Sanyo Electric Co Ltd | 太陽電池、太陽電池モジュール及び太陽電池の製造方法 |
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JP5230222B2 (ja) | 2008-02-21 | 2013-07-10 | 三洋電機株式会社 | 太陽電池 |
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JP2006128258A (ja) * | 2004-10-27 | 2006-05-18 | Sharp Corp | 太陽電池および太陽電池の製造方法 |
JP2010504636A (ja) * | 2006-09-26 | 2010-02-12 | コミサリア、ア、レネルジ、アトミク | 背面ヘテロ接合太陽電池製造方法 |
JP2009152222A (ja) * | 2006-10-27 | 2009-07-09 | Kyocera Corp | 太陽電池素子の製造方法 |
WO2010113750A1 (ja) * | 2009-03-30 | 2010-10-07 | 三洋電機株式会社 | 太陽電池 |
JP2010258043A (ja) * | 2009-04-21 | 2010-11-11 | Sanyo Electric Co Ltd | 太陽電池 |
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JP5842173B2 (ja) | 2016-01-13 |
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