JPWO2012102202A1 - 繊維強化複合材料rtm成形用エポキシ樹脂組成物、繊維強化複合材料およびその製造方法 - Google Patents
繊維強化複合材料rtm成形用エポキシ樹脂組成物、繊維強化複合材料およびその製造方法 Download PDFInfo
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- JPWO2012102202A1 JPWO2012102202A1 JP2012503821A JP2012503821A JPWO2012102202A1 JP WO2012102202 A1 JPWO2012102202 A1 JP WO2012102202A1 JP 2012503821 A JP2012503821 A JP 2012503821A JP 2012503821 A JP2012503821 A JP 2012503821A JP WO2012102202 A1 JPWO2012102202 A1 JP WO2012102202A1
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- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- 238000009787 hand lay-up Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- SOOZEQGBHHIHEF-UHFFFAOYSA-N methyltetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21C SOOZEQGBHHIHEF-UHFFFAOYSA-N 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- KYCGURZGBKFEQB-UHFFFAOYSA-N n',n'-dibutylpropane-1,3-diamine Chemical compound CCCCN(CCCC)CCCN KYCGURZGBKFEQB-UHFFFAOYSA-N 0.000 description 1
- UDGSVBYJWHOHNN-UHFFFAOYSA-N n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCN UDGSVBYJWHOHNN-UHFFFAOYSA-N 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- ZUXUNWLVIWKEHB-UHFFFAOYSA-N n',n'-dimethylhexane-1,6-diamine Chemical compound CN(C)CCCCCCN ZUXUNWLVIWKEHB-UHFFFAOYSA-N 0.000 description 1
- YXRPHMVUMUKKOS-UHFFFAOYSA-N n,n-dimethylpyridin-4-amine;pyridine Chemical compound C1=CC=NC=C1.CN(C)C1=CC=NC=C1 YXRPHMVUMUKKOS-UHFFFAOYSA-N 0.000 description 1
- RWIVICVCHVMHMU-UHFFFAOYSA-N n-aminoethylmorpholine Chemical compound NCCN1CCOCC1 RWIVICVCHVMHMU-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011208 reinforced composite material Substances 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- IFXORIIYQORRMJ-UHFFFAOYSA-N tribenzylphosphane Chemical compound C=1C=CC=CC=1CP(CC=1C=CC=CC=1)CC1=CC=CC=C1 IFXORIIYQORRMJ-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- MDCWDBMBZLORER-UHFFFAOYSA-N triphenyl borate Chemical compound C=1C=CC=CC=1OB(OC=1C=CC=CC=1)OC1=CC=CC=C1 MDCWDBMBZLORER-UHFFFAOYSA-N 0.000 description 1
- CMLWFCUAXGSMBB-UHFFFAOYSA-N tris(2,6-dimethoxyphenyl)phosphane Chemical compound COC1=CC=CC(OC)=C1P(C=1C(=CC=CC=1OC)OC)C1=C(OC)C=CC=C1OC CMLWFCUAXGSMBB-UHFFFAOYSA-N 0.000 description 1
- COIOYMYWGDAQPM-UHFFFAOYSA-N tris(2-methylphenyl)phosphane Chemical compound CC1=CC=CC=C1P(C=1C(=CC=CC=1)C)C1=CC=CC=C1C COIOYMYWGDAQPM-UHFFFAOYSA-N 0.000 description 1
- LFNXCUNDYSYVJY-UHFFFAOYSA-N tris(3-methylphenyl)phosphane Chemical compound CC1=CC=CC(P(C=2C=C(C)C=CC=2)C=2C=C(C)C=CC=2)=C1 LFNXCUNDYSYVJY-UHFFFAOYSA-N 0.000 description 1
- UYUUAUOYLFIRJG-UHFFFAOYSA-N tris(4-methoxyphenyl)phosphane Chemical compound C1=CC(OC)=CC=C1P(C=1C=CC(OC)=CC=1)C1=CC=C(OC)C=C1 UYUUAUOYLFIRJG-UHFFFAOYSA-N 0.000 description 1
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
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Abstract
Description
次の[A]〜[D]を含み、かつ[A]と[B]の質量配合比[A]/[B]が55/45〜95/5の範囲にある繊維強化複合材料RTM成形用エポキシ樹脂組成物である。
[B]脂環式エポキシ樹脂
[C]酸無水物硬化剤
[D]硬化促進剤
かかる樹脂組成物は、[A]が、常温で液状であるか、軟化点が65℃以下であるフェノールノボラック型エポキシ樹脂であることが好ましい。
0.5≦t90≦10 ・・・ (b)
1<t90/t10≦3 ・・・ (c)
かかる樹脂組成物は、前期温度Tが90〜130℃の範囲内にあることが好ましい。
上記繊維強化複合材料RTM成形用エポキシ樹脂組成物と強化繊維を用い、次の(i)および(ii)の工程を含む繊維強化複合材料の製造方法、である。
(i)90〜130℃の金型内で、0.5〜10分の間RTM成形し、ガラス転移温度を95〜150℃、反応率を50〜90%に至らしめた後に脱型し、予備成形体を得る工程
(ii)得られた予備成形体を、130〜200℃の温度範囲で後硬化を施し、ガラス転移温度を150〜220℃、反応率を90〜100%に至らしめた繊維強化複合材料を得る工程
本発明における硬化促進剤[D]の具体例としては、トリブチルホスフィン、トリオクチルホスフィン、トリシクロヘキシルホスフィン、トリフェニルホスフィン、トリベンジルホスフィン、トリ−o−トリルホスフィン、トリ−m−トリルホスフィン、トリ−p−トリルホスフィン、トリス(4−メトキシフェニル)ホスフィン、トリス(2,6−ジメトキシフェニル)ホスフィン、ジフェニルシクロヘキシルホスフィン、p−スチリルジフェニルホスフィン、1,2−ビス(ジフェニルホスフィノ)エタン、1,3−ビス(ジフェニルホスフィノ)プロパン、1,4−ビス(ジフェニルホスフィノ)ブタン、テトラフェニルホスホニウム・テトラフェニルボレート、トリフェニルホスフィン・トリフェニルボランなどの有機リン系化合物、トリエチルアミン、ジメチルベンジルアミン、2,4,6−トリス(ジメチルアミノメチル)フェノール、1,5−ジアザビシクロ[4.3.0]ノナ−5−エン、1,8−ジアザビシクロ[5.4.0]ウンデカ−7−エン、1,8−ジアザビシクロ[5.4.0]ウンデカ−7−エンのフェノール塩、1,8−ジアザビシクロ[5.4.0]ウンデカ−7−エンのフタル酸塩、ピリジン、4−ジメチルアミノピリジン、3−ジメチルアミノプロピルアミン、3−ジエチルアミノプロピルアミン、3−ジブチルアミノプロピルアミン、2−ジエチルアミノエチルアミン、1−ジエチルアミノ−4−アミノペンタン、N−(3−アミノプロピル)−N−メチルプロパンジアミン、1−(2−アミノエチル)ピペラジン、1,4−ビス(2−アミノエチル)ピペラジン、3−(3−ジメチルアミノプロピル)プロピルアミン、1,4−ビス(3−アミノプロピル)ピペラジン、4−(2−アミノエチル)モルホリン、4−(3−アミノプロピル)モルホリンなどの三級アミン化合物とその塩類、イミダゾール、2−メチルイミダゾール、2−エチルイミダゾール、2−ウンデシルイミダゾール、2−ヘプタデシルイミダゾール、2−フェニルイミダゾール、1,2−ジメチルイミダゾール、2−エチル−4−メチルイミダゾール、2−フェニル−4−メチルイミダゾール、1−ベンジル−2−フェニルイミダゾール、1−ベンジル−2−メチルイミダゾール、1−シアノエチル−2−メチルイミダゾール、1−アミノエチル−2−メチルイミダゾールなどのイミダゾール類、テトラエチルアンモニウムブロマイド、テトラブチルアンモニウムブロマイドなどの四級アンモニウム塩類、オクチル酸亜鉛、オクチル酸錫やアルミニウムアセチルアセトン錯体などの有機金属化合物類、三フッ化ホウ素、トリフェニルボレート等のホウ素化合物、塩化亜鉛、塩化第二錫などの金属ハロゲン化物が挙げられる。更には、高融点イミダゾール化合物、ジシアンジアミド、アミンをエポキシ樹脂等に付加したアミン付加型促進剤等の高融点分散型潜在性促進剤、イミダゾール系、リン系、ホスフィン系促進剤の表面をポリマーで被覆したマイクロカプセル型潜在性促進剤、アミン塩型潜在性硬化促進剤、ルイス酸塩、ブレンステッド酸塩等の高温解離型の熱カチオン重合型の潜在性硬化促進剤等に代表される潜在性硬化促進剤も使用することができる。これらの硬化促進剤は単独又は2種以上を適宜混合して使用することができる。
0.5≦t90≦10 ・・・ (b)
1<t90/t10≦3 ・・・ (c)
(ここで、t10は、温度Tにおける測定開始からキュアインデックスが10%に到達するまでの時間(分)を表し、t90は、測定開始からキュアインデックスが90%に到達する時間(分)を表す。)。
αt:時間tにおけるイオン粘度(単位:Ω・cm)
αmin:イオン粘度の最小値(単位:Ω・cm)
αmax:イオン粘度の最大値(単位:Ω・cm)。
本発明の製造方法においては、特定温度Tすなわち90〜130℃で0.5〜10分間硬化させて、ガラス転移温度を95〜150℃、反応率を50〜90%に至らしめる工程(i)の後、130〜200℃の温度範囲で後硬化(工程(ii))を施し、ガラス転移温度を150〜220℃、反応率を90〜100%に至らしめるものである。
Af:繊維基材1枚・1m2当たりの重量(g/m2)
N:繊維基材の積層枚数(枚)
ρf:強化繊維の密度(g/cm3)
h:繊維強化複合材料(試験片)の厚み(mm)
なお、繊維基材1枚・1m2当たりの重量Afや、繊維基材の積層枚数N、強化繊維の密度ρfが明らかでない場合は、JIS K 7075 (1991)に基づく燃焼法もしくは硝酸分解法、硫酸分解法のいずれかにより、繊維強化複合材料の繊維体積含有率を測定する。この場合に用いる強化繊維の密度は、JIS R 7603 (1999)に基づき測定した値を用いる。
(樹脂原料)
各実施例の樹脂組成物を得るために、以下の樹脂原料を用いた。なお、表1、2中の樹脂組成物の含有割合の単位は、特に断らない限り「質量部」を意味する。
1.エポキシ樹脂
[A]常温で液状であるか、軟化点が65℃以下である多官能エポキシ樹脂
・“jER”(登録商標)154(三菱化学(株)製):フェノールノボラック型エポキシ樹脂、エポキシ当量178、25℃において液状
・YDCN−700−2(新日鐵化学(株)製):o−クレゾールノボラック型エポキシ樹脂、エポキシ当量200、軟化点61℃
・“Tactix”(登録商標)742(ハンツマン・アドバンスド・マテリアルズ社製):トリフェニルメタン型エポキシ樹脂、エポキシ当量160、軟化点49℃
[B]脂環式エポキシ樹脂
・“セロキサイド”(登録商標)2021P(ダイセル化学工業(株)製):脂環式エポキシ樹脂、エポキシ当量137
・“セロキサイド”(登録商標)3000(ダイセル化学工業(株)製):脂環式エポキシ樹脂、エポキシ当量94
[A]、[B]以外のエポキシ樹脂
・“EPICLON”(登録商標)N−775(DIC(株)製):フェノールノボラック型エポキシ樹脂、エポキシ当量190、軟化点75℃
・YD−128(新日鐵化学(株)製):ビスフェノールA型エポキシ樹脂、エポキシ当量189、25℃において液状
・ELM434(住友化学(株)製):アミン型エポキシ樹脂、エポキシ当量120、25℃において液状
[C]酸無水物硬化剤
・“リカシッド”(登録商標)MH−700(新日本理化(株)製):メチルヘキサヒドロフタル酸無水物
・“カヤハード”(登録商標)MCD(日本化薬(株)製):メチルナジック酸無水物
・“リカシッド”(登録商標)OSA(新日本理化(株)製):オクテニルコハク酸無水物
[D]硬化促進剤
・“キュアゾール”(登録商標)1,2−DMZ(四国化成工業(株)製)):1,2−ジメチルイミダゾール
・トリフェニルホスフィン(ケイ・アイ化成(株)製)
・N,N−ジメチルベンジルアミン(東京化成工業(株)製)
(エポキシ樹脂組成物の調製)
表1、2に記載した配合比でエポキシ樹脂を混合しI液とした。表1、2に記載した配合比で、酸無水物硬化剤と硬化促進剤を混合し、II液とした。
(樹脂組成物の粘度測定)
ISO 2884-1(1994)における円錐平板型回転粘度計を使用した測定方法に準拠し、エポキシ樹脂組成物の調製直後の粘度を測定した。装置には東機産業(株)製のTVE−30H型を用いた。ここでローターは1゜34’×R24を用い、サンプル量は1cm3とした。
(誘電測定)
樹脂の硬化を追跡するために誘電測定を行った。誘電測定装置として、Holometrix-Micromet社製のMDE−10キュアモニターを使用した。TMS−1インチ型センサーを下面に埋め込んだプログラマブルミニプレスMP2000の下面に内径32mm、厚さ3mmのバイトン製Oリングを設置し、プレスの温度を110℃に設定し、Oリングの内側にエポキシ樹脂組成物を注ぎ、プレスを閉じ、樹脂組成物のイオン粘度の時間変化を追跡した。誘電測定は1、10、100、1,000、および10,000Hzの各周波数で行い、付属のソフトウェアを用いて、周波数非依存のイオン粘度の対数Logαを得た。
(樹脂硬化板の作製)
プレス装置下面に、一辺50mmの正方形をくり抜いた、厚さ2mmの銅製スペーサーを設置し、プレスの温度を110℃に設定し、エポキシ樹脂組成物をスペーサーの内側に注ぎ、プレスを閉じた。10分後にプレスを開け、樹脂硬化板を得た。
(後硬化樹脂板の作製)
得られた樹脂硬化版を、180℃の熱風オーブンに投入し、30分間の後硬化を施し、後硬化樹脂板を得た。
(樹脂硬化板および後硬化樹脂板のガラス転移温度Tg測定)
樹脂硬化板から幅12.7mm、長さ40mmの試験片を切り出し、レオメーター(TAインスツルメンツ社製ARES)を用いてねじりDMA測定を行った。測定条件は、周波数1Hz、測定温度範囲30〜300℃、昇温速度20℃/分である。測定で得られた貯蔵弾性率G’の変曲点での温度をTgとした。
(樹脂硬化板および後硬化樹脂板の反応率測定)
樹脂組成物から約3mgを採取し、DSC(TAインスツルメンツ社製2910)を用いて硬化発熱量測定を行った。測定条件は、測定温度範囲30〜300℃、昇温速度10℃/分である。測定で得られた縦軸:発熱量、横軸:温度の硬化発熱曲線において、ベースラインとの差し引きの面積を硬化発熱量とした。樹脂組成物の硬化発熱量Qを算出した。
(実施例1〜12)
前記したようにして、表1、2に示す組成でエポキシ樹脂組成物を調製し、粘度測定、誘電測定を行った。また、調製したエポキシ樹脂組成物を用いて、前記したようにして、樹脂硬化板および後硬化樹脂板を作製し、ガラス転移温度Tgおよび反応率を測定した。
(比較例1〜5)
前記したようにして、表2に示す組成でエポキシ樹脂組成物を調製し、粘度測定、誘電測定を行った。また、調製したエポキシ樹脂組成物を用いて、前記したようにして、樹脂硬化板および後硬化樹脂板を作製し、ガラス転移温度Tgおよび反応率を測定した。
Claims (11)
- 次の[A]〜[D]を含み、かつ[A]と[B]の質量配合比[A]/[B]が55/45〜95/5の範囲にある繊維強化複合材料RTM成形用エポキシ樹脂組成物。
[A]常温で液状であるか、軟化点が65℃以下である多官能エポキシ樹脂であって、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、トリフェニルメタン型エポキシ樹脂から選ばれる少なくとも一つの多官能エポキシ樹脂
[B]脂環式エポキシ樹脂
[C]酸無水物硬化剤
[D]硬化促進剤 - [A]が、常温で液状であるか、軟化点が65℃以下であるフェノールノボラック型エポキシ樹脂である請求項1記載の繊維強化複合材料RTM成形用エポキシ樹脂組成物。
- [C]がヘキサヒドロフタル酸無水物、テトラヒドロフタル酸無水物、ナジック酸無水物およびそれらのアルキル置換タイプより選ばれるものである、請求項1または2に記載の繊維強化複合材料RTM成形用エポキシ樹脂組成物。
- キュアインデックスが次の式(a)〜(c)を満たす特定温度Tを有する請求項1〜3のいずれかに記載の繊維強化複合材料RTM成形用エポキシ樹脂組成物。
0.5≦t10≦4 ・・・ (a)
0.5≦t90≦10 ・・・ (b)
1<t90/t10≦3 ・・・ (c) - 前期温度Tが90〜130℃の範囲内にある請求項1〜4のいずれかに記載の繊維強化複合材料RTM成形用エポキシ樹脂組成物。
- [D]が有機リン化合物もしくはイミダゾール類である請求項1〜5のいずれかに記載の繊維強化複合材料RTM成形用エポキシ樹脂組成物。
- [D]がイミダゾール類である請求項1〜6のいずれかに記載の繊維強化複合材料RTM成形用エポキシ樹脂組成物。
- [D]が有機リン化合物である請求項1〜6のいずれかに記載の繊維強化複合材料RTM成形用エポキシ樹脂組成物。
- 請求項1〜8のいずれかに記載の繊維強化複合材料RTM成形用エポキシ樹脂組成物と強化繊維を組み合わせ、硬化してなる繊維強化複合材料。
- 強化繊維が炭素繊維である請求項9記載の繊維強化複合材料。
- 請求項1〜8のいずれかに記載の繊維強化複合材料RTM成形用エポキシ樹脂組成物と強化繊維を用い、次の(i)および(ii)の工程を含む繊維強化複合材料の製造方法。
(i)90〜130℃の金型内で、0.5〜10分の間RTM成形し、ガラス転移温度を95〜150℃、反応率を50〜90%に至らしめた後に脱型し、予備成形体を得る工程
(ii)得られた予備成形体を、130〜200℃の温度範囲で後硬化を施し、ガラス転移温度を150〜220℃、反応率を90〜100%に至らしめた繊維強化複合材料を得る工程
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US20130303661A1 (en) | 2013-11-14 |
KR101846978B1 (ko) | 2018-04-09 |
US9309352B2 (en) | 2016-04-12 |
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