JPWO2008096714A1 - 樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置 - Google Patents

樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置 Download PDF

Info

Publication number
JPWO2008096714A1
JPWO2008096714A1 JP2008557105A JP2008557105A JPWO2008096714A1 JP WO2008096714 A1 JPWO2008096714 A1 JP WO2008096714A1 JP 2008557105 A JP2008557105 A JP 2008557105A JP 2008557105 A JP2008557105 A JP 2008557105A JP WO2008096714 A1 JPWO2008096714 A1 JP WO2008096714A1
Authority
JP
Japan
Prior art keywords
light
light emitting
resin
emitting element
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008557105A
Other languages
English (en)
Japanese (ja)
Inventor
俊二 渡辺
俊二 渡辺
雅之 四條
雅之 四條
香織 江面
香織 江面
嘉信 江面
嘉信 江面
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of JPWO2008096714A1 publication Critical patent/JPWO2008096714A1/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2008557105A 2007-02-05 2008-02-04 樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置 Pending JPWO2008096714A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007024972 2007-02-05
JP2007024972 2007-02-05
PCT/JP2008/051781 WO2008096714A1 (fr) 2007-02-05 2008-02-04 Élément électroluminescent scellé par résine, source lumineuse planaire, procédés de fabrication de l'élément électroluminescent scellé par résine et de la source lumineuse planaire et dispositif d'affichage à cristaux liquides

Publications (1)

Publication Number Publication Date
JPWO2008096714A1 true JPWO2008096714A1 (ja) 2010-05-20

Family

ID=39681623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008557105A Pending JPWO2008096714A1 (ja) 2007-02-05 2008-02-04 樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置

Country Status (2)

Country Link
JP (1) JPWO2008096714A1 (fr)
WO (1) WO2008096714A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8803171B2 (en) * 2009-07-22 2014-08-12 Koninklijke Philips N.V. Reduced color over angle variation LEDs
US20120126261A1 (en) * 2009-08-07 2012-05-24 Sharp Kabushiki Kaisha Lens, light-emitting module, light-emitting element package, illumination device, display device, and television receiver
JP2012109532A (ja) * 2010-09-08 2012-06-07 Mitsubishi Chemicals Corp 発光装置、照明装置、及びレンズ
JP5760655B2 (ja) * 2011-04-28 2015-08-12 三菱化学株式会社 半導体発光装置用樹脂パッケージ及び該樹脂パッケージを有してなる半導体発光装置並びにそれらの製造方法
KR102140226B1 (ko) * 2014-02-05 2020-07-31 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
KR102131771B1 (ko) * 2014-02-05 2020-07-08 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
KR102154061B1 (ko) * 2014-02-05 2020-09-09 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
TWI532222B (zh) * 2015-04-21 2016-05-01 隆達電子股份有限公司 發光裝置及其透鏡結構

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5092665U (fr) * 1973-12-27 1975-08-05
JPH0563343A (ja) * 1991-08-30 1993-03-12 Techno Sunstar Kk 電子部品実装方法
JPH05291627A (ja) * 1992-04-10 1993-11-05 Iwasaki Electric Co Ltd 発光ダイオード
JPH0653554A (ja) * 1992-07-28 1994-02-25 Rohm Co Ltd 光半導体デバイス
JPH098357A (ja) * 1995-06-16 1997-01-10 Rohm Co Ltd 発光装置およびその製造方法
JP2000282442A (ja) * 1999-03-30 2000-10-10 Ube Nitto Kasei Co Ltd 繊維強化樹脂製仕切板
JP2001279585A (ja) * 2000-03-29 2001-10-10 Asahi Lite Optical Co Ltd 着色高屈折率プラスチックレンズの製造方法
JP3101037U (ja) * 2002-11-26 2004-06-03 玄基光電半導體股▲ふん▼有限公司 表面実装型発光ダイオード
WO2005025831A1 (fr) * 2003-09-09 2005-03-24 Cree, Inc. Elements optiques transmissifs comprenant une enveloppe plastique transparente qui contient une matiere fluorescente dispersee, et procedes de fabrication de ceux-ci
JP2006310710A (ja) * 2005-05-02 2006-11-09 Sony Corp 半導体発光素子
JP2006525682A (ja) * 2003-04-30 2006-11-09 クリー　インコーポレイテッド 高出力固体発光素子パッケージ
JP2006319149A (ja) * 2005-05-13 2006-11-24 Sony Corp 光源装置およびその製造方法並びに光源装置を用いた表示装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5092665U (fr) * 1973-12-27 1975-08-05
JPH0563343A (ja) * 1991-08-30 1993-03-12 Techno Sunstar Kk 電子部品実装方法
JPH05291627A (ja) * 1992-04-10 1993-11-05 Iwasaki Electric Co Ltd 発光ダイオード
JPH0653554A (ja) * 1992-07-28 1994-02-25 Rohm Co Ltd 光半導体デバイス
JPH098357A (ja) * 1995-06-16 1997-01-10 Rohm Co Ltd 発光装置およびその製造方法
JP2000282442A (ja) * 1999-03-30 2000-10-10 Ube Nitto Kasei Co Ltd 繊維強化樹脂製仕切板
JP2001279585A (ja) * 2000-03-29 2001-10-10 Asahi Lite Optical Co Ltd 着色高屈折率プラスチックレンズの製造方法
JP3101037U (ja) * 2002-11-26 2004-06-03 玄基光電半導體股▲ふん▼有限公司 表面実装型発光ダイオード
JP2006525682A (ja) * 2003-04-30 2006-11-09 クリー　インコーポレイテッド 高出力固体発光素子パッケージ
WO2005025831A1 (fr) * 2003-09-09 2005-03-24 Cree, Inc. Elements optiques transmissifs comprenant une enveloppe plastique transparente qui contient une matiere fluorescente dispersee, et procedes de fabrication de ceux-ci
JP2006310710A (ja) * 2005-05-02 2006-11-09 Sony Corp 半導体発光素子
JP2006319149A (ja) * 2005-05-13 2006-11-24 Sony Corp 光源装置およびその製造方法並びに光源装置を用いた表示装置

Also Published As

Publication number Publication date
WO2008096714A1 (fr) 2008-08-14

Similar Documents

Publication Publication Date Title
JPWO2008096714A1 (ja) 樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置
TWI507635B (zh) 具有模造雙向光學器件之發光二極體
CN102800790B (zh) 发光器件
CN101485004B (zh) 照明器件封装
TWI447450B (zh) 導光板結構、背光模組及其製造方法
JP5632824B2 (ja) Ｌｅｄダイ上のオーバーモールドレンズ
TWI393841B (zh) 背光用發光二極體之寬發光透鏡
CN103486451B (zh) 发光装置及包括该发光装置的照明装置
KR20090023688A (ko) 조명 장치 및 그 제조 방법
US20120267663A1 (en) Light emitting diode package and manufacturing method thereof
JP2008226928A (ja) 発光装置およびその製造方法、ならびに照明装置
KR101575366B1 (ko) 발광소자 패키지
CN109814189B (zh) 光学器件以及包括光学器件的光源模块
JP6510256B2 (ja) Ｌｅｄモジュールの製造方法
KR101288918B1 (ko) 파장변환층이 형성된 발광소자 제조방법 및 그에 따라 제조된 발광소자
KR101308774B1 (ko) 광학 소자와 수지 밀봉 발광 소자의 제조 방법, 광학 소자, 수지 밀봉 발광 소자 및 평면형 광원 장치
JP6021485B2 (ja) 光学部材付半導体発光装置
KR100900286B1 (ko) 발광 소자 패키지 및 그 제조방법
CN103219450A (zh) 固态照明系统
JP2023073973A (ja) 発光装置、光源装置及び発光装置の製造方法
KR20050090707A (ko) 칩형 발광다이오드
JP2010050294A (ja) レンズを有する発光ユニットの製造方法
TW201306227A (zh) 發光二極體的封裝製造方法
KR20110090493A (ko) 도광판 및 이를 구비한 발광장치
KR20080056424A (ko) 발광 소자 패키지 및 그 제조방법

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110106

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110323

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120327

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120511

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130507