JPWO2008050832A1 - 基板洗浄装置、基板洗浄方法、プログラム、および記録媒体 - Google Patents

基板洗浄装置、基板洗浄方法、プログラム、および記録媒体 Download PDF

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Publication number
JPWO2008050832A1
JPWO2008050832A1 JP2008541020A JP2008541020A JPWO2008050832A1 JP WO2008050832 A1 JPWO2008050832 A1 JP WO2008050832A1 JP 2008541020 A JP2008541020 A JP 2008541020A JP 2008541020 A JP2008541020 A JP 2008541020A JP WO2008050832 A1 JPWO2008050832 A1 JP WO2008050832A1
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JP
Japan
Prior art keywords
cleaning
cleaning liquid
supply pipe
gas
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008541020A
Other languages
English (en)
Japanese (ja)
Inventor
辺 司 渡
辺 司 渡
藤 尚 樹 新
藤 尚 樹 新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of JPWO2008050832A1 publication Critical patent/JPWO2008050832A1/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/234—Cleaning during device manufacture during, before or after processing of insulating materials the processing being the formation of vias or contact holes
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
JP2008541020A 2006-10-27 2007-10-25 基板洗浄装置、基板洗浄方法、プログラム、および記録媒体 Pending JPWO2008050832A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006292348 2006-10-27
JP2006292348 2006-10-27
PCT/JP2007/070811 WO2008050832A1 (fr) 2006-10-27 2007-10-25 Appareil et procédé de nettoyage de substrat, programme et support d'enregistrement

Publications (1)

Publication Number Publication Date
JPWO2008050832A1 true JPWO2008050832A1 (ja) 2010-02-25

Family

ID=39324617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008541020A Pending JPWO2008050832A1 (ja) 2006-10-27 2007-10-25 基板洗浄装置、基板洗浄方法、プログラム、および記録媒体

Country Status (3)

Country Link
JP (1) JPWO2008050832A1 (https=)
TW (1) TW200830391A (https=)
WO (1) WO2008050832A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526118B2 (ja) * 2011-12-26 2014-06-18 ジルトロニック アクチエンゲゼルシャフト 超音波洗浄方法
JP5989338B2 (ja) * 2011-12-28 2016-09-07 芝浦メカトロニクス株式会社 処理液生成装置、処理液生成方法、基板処理装置及び基板処理方法
JP6430772B2 (ja) * 2014-10-06 2018-11-28 オルガノ株式会社 炭酸ガス溶解水供給システム、炭酸ガス溶解水供給方法、およびイオン交換装置
CN106140722A (zh) * 2016-08-12 2016-11-23 嘉兴百盛光电有限公司 一种多功能超声波清洗机的供水单元

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000098321A (ja) * 1998-09-25 2000-04-07 Toshiba Corp 洗浄方法および洗浄装置
WO2005006396A2 (en) * 2003-06-11 2005-01-20 Goldfinger Technologies, Llc Megasonic cleaning using supersaturated cleaning solution
JP2006179765A (ja) * 2004-12-24 2006-07-06 Dainippon Screen Mfg Co Ltd 基板処理装置およびパーティクル除去方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5800626A (en) * 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
JP2003234320A (ja) * 2002-02-06 2003-08-22 Nec Electronics Corp 基板の洗浄方法、洗浄薬液、洗浄装置及び半導体装置
JP2004281894A (ja) * 2003-03-18 2004-10-07 Matsushita Electric Ind Co Ltd 電子材料用洗浄水、その製造方法および電子材料の洗浄方法
JP4623706B2 (ja) * 2004-04-14 2011-02-02 東京エレクトロン株式会社 超音波洗浄処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000098321A (ja) * 1998-09-25 2000-04-07 Toshiba Corp 洗浄方法および洗浄装置
WO2005006396A2 (en) * 2003-06-11 2005-01-20 Goldfinger Technologies, Llc Megasonic cleaning using supersaturated cleaning solution
JP2006179765A (ja) * 2004-12-24 2006-07-06 Dainippon Screen Mfg Co Ltd 基板処理装置およびパーティクル除去方法

Also Published As

Publication number Publication date
TW200830391A (en) 2008-07-16
WO2008050832A1 (fr) 2008-05-02
TWI362066B (https=) 2012-04-11

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