JPWO2008047629A1 - 基体の保護方法 - Google Patents
基体の保護方法 Download PDFInfo
- Publication number
- JPWO2008047629A1 JPWO2008047629A1 JP2008539752A JP2008539752A JPWO2008047629A1 JP WO2008047629 A1 JPWO2008047629 A1 JP WO2008047629A1 JP 2008539752 A JP2008539752 A JP 2008539752A JP 2008539752 A JP2008539752 A JP 2008539752A JP WO2008047629 A1 JPWO2008047629 A1 JP WO2008047629A1
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- Prior art keywords
- water
- substrate
- positively charged
- substrate surface
- water absorption
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 description 1
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- 150000002978 peroxides Chemical class 0.000 description 1
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
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- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
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- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
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- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- RQGPLDBZHMVWCH-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole Chemical compound C1=NC2=CC=NC2=C1 RQGPLDBZHMVWCH-UHFFFAOYSA-N 0.000 description 1
- FYNROBRQIVCIQF-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole-5,6-dione Chemical compound C1=CN=C2C(=O)C(=O)N=C21 FYNROBRQIVCIQF-UHFFFAOYSA-N 0.000 description 1
- IZMJMCDDWKSTTK-UHFFFAOYSA-N quinoline yellow Chemical compound C1=CC=CC2=NC(C3C(C4=CC=CC=C4C3=O)=O)=CC=C21 IZMJMCDDWKSTTK-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- XJKVPKYVPCWHFO-UHFFFAOYSA-N silicon;hydrate Chemical compound O.[Si] XJKVPKYVPCWHFO-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- UAWGEYZZCKAPHY-XBFRWELRSA-N sodium;5-[(4-ethoxyphenyl)diazenyl]-2-[(e)-2-[4-[(4-ethoxyphenyl)diazenyl]-2-sulfophenyl]ethenyl]benzenesulfonic acid Chemical compound [Na+].C1=CC(OCC)=CC=C1N=NC(C=C1S(O)(=O)=O)=CC=C1\C=C\C1=CC=C(N=NC=2C=CC(OCC)=CC=2)C=C1S(O)(=O)=O UAWGEYZZCKAPHY-XBFRWELRSA-N 0.000 description 1
- GBPOWOIWSYUZMH-UHFFFAOYSA-N sodium;trihydroxy(methyl)silane Chemical compound [Na+].C[Si](O)(O)O GBPOWOIWSYUZMH-UHFFFAOYSA-N 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910000348 titanium sulfate Inorganic materials 0.000 description 1
- JUWGUJSXVOBPHP-UHFFFAOYSA-B titanium(4+);tetraphosphate Chemical compound [Ti+4].[Ti+4].[Ti+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O JUWGUJSXVOBPHP-UHFFFAOYSA-B 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- 235000013311 vegetables Nutrition 0.000 description 1
- 239000003021 water soluble solvent Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Images
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/16—Antifouling paints; Underwater paints
- C09D5/1687—Use of special additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
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- Organic Chemistry (AREA)
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Abstract
Description
(1)陽イオン
(2)正電荷を有する導電体又は誘電体
(3)導電体、及び、誘電体又は半導体の複合体
からなる群から選択される1種又は2種以上の正電荷物質を配置することによって達成される。
まず、四塩化チタン等の四価チタンの化合物とアンモニア等の塩基とを反応させて、水酸化チタンを形成する。次に、この水酸化チタンを酸化剤でペルオキソ化し、超微細粒子のアモルファス型過酸化チタンを形成する。この反応は好ましくは水性媒体中で行なわれる。さらに、任意に加熱処理することによりアナターゼ型過酸化チタンに転移させることも可能である。前記の各工程のいずれかにおいて銅、マンガン、ニッケル、コバルト、鉄、亜鉛又はそれらの化合物の少なくともいずれか1つが混合される。
四塩化チタン等の四価チタンの化合物を酸化剤でペルオキソ化し、これとアンモニア等の塩基とを反応させて超微細粒子のアモルファス型過酸化チタンを形成する。この反応は好ましくは水性媒体中で行なわれる。さらに、任意に加熱処埋することによりアナターゼ型過酸化チタンに転移させることも可能である。前記の各工程のいずれかにおいて銅、マンガン、ニッケル、コバルト、鉄、亜鉛又はそれらの化合物の少なくともいずれか1つが混合される。
四塩化チタン等の四価チタンの化合物を、酸化剤及び塩基と同時に反応させて、水酸化チタン形成とそのペルオキソ化とを同時に行い、超微細粒子のアモルファス型過酸化チタンを形成する。この反応は好ましくは水性媒体中で行なわれる。さらに、任意に加熱処埋することによりアナターゼ型過酸化チタンに転移させることも可能である。前記の各工程のいずれかにおいて銅、マンガン、ニッケル、コバルト、鉄、亜鉛又はそれらの化合物の少なくともいずれか1つが混合される。
チタンアルコキシドに、水、アルコール等の溶媒、酸又は塩基触媒を混合撹拌し、チタンアルコキシドを加水分解させ、超微粒子のチタン酸化物のゾル溶液を生成する。この加水分解の前後のいずれかに、銅、マンガン、ニッケル、コバルト、鉄、亜鉛又はそれらの化合物の少なくともいずれか1つが混合される。なお、このようにして得られるチタン酸化物は、ペルオキソ基を有するアモルファス型である。
金属ドープチタン酸化物の製造に使用する四価チタンの化合物としては、塩基と反応させた際に、オルトチタン酸(H4TiO4)とも呼称される水酸化チタンを形成できるものであれば各種のチタン化合物が使用でき、例えば四塩化チタン、硫酸チタン、硝酸チタン、燐酸チタン等のチタンの水溶性無機酸塩がある。それ以外にも蓚酸チタン等のチタンの水溶性有機酸塩も使用できる。なお、これらの各種チタン化合物の中では、水溶性に特に優れ、かつ金属ドープチタン酸化物の分散液中にチタン以外の成分が残留しない点で、四塩化チタンが好ましい。
前記四価チタンの化合物と反応させる塩基は、四価チタンの化合物と反応して水酸化チタンを形成できるものであれば、各種のものが使用可能であり、それにはアンモニア、苛性ソーダ、炭酸ソーダ、苛性カリ等が例示できるが、アンモニアが好ましい。
銅、マンガン、ニッケル、コバルト、鉄又は亜鉛の化合物としては、それぞれ以下のものが例示できる。
Ni化合物:Ni(OH)2、NiCl2
Co化合物:Co(OH)NO3、Co(OH)2、CoSO4、CoCl2
Cu化合物:Cu(OH)2、Cu(NO3)2、CuSO4、CuCl2、
Cu(CH3COO)2
Mn化合物:MnNO3、MnSO4、MnCl2
Fe化合物:Fe(OH)2、Fe(OH)3、FeCl3
Zn化合物:Zn(NO3)2、ZnSO4、ZnCl2
顔料及び/又は染料として有機系顔料及び/又は染料を用いた場合であっても、驚くべきことに、本発明の方法では、該有機系顔料及び/又は染料の褪色は抑制される。特に負電荷を有するものには有効である。
既述した四価チタン化合物とアンモニア等の塩基とを反応させて、水酸化チタンを形成する。次に、この水酸化チタンを過酸化水素等の酸化剤でペルオキソ化し、超微細粒子のアモルファス型過酸化チタンを形成する。更に加熱処理することによりアナターゼ型過酸化チタンに転移させる。
既述した四価チタン化合物を過酸化水素等の酸化剤でペルオキソ化し、次にアンモニア等の塩基と反応させて超微細粒子のアモルファス型過酸化チタンを形成する。更に加熱処理することによりアナターゼ型過酸化チタンに転移させる。
既述した四価チタン化合物と過酸化水素等の酸化剤及びアンモニア等の塩基とを反応させ、水酸化チタン形成及びペルオキソ化とを同時に行い、超微細粒子のアモルファス型過酸化チタンを形成する。更に加熱処理することによりアナターゼ型過酸化チタンに転移させる。
97%CuCl2・2H2O(塩化第二銅)(日本化学産業(株)製)0.4gを2.5%アンモニア水99.6gに完全に溶解させて銅濃度約800ppmの濃青色の正電荷金属溶液100gを調製した。
97%CuCl2・2H2O(塩化第二銅)(日本化学産業(株)製)0.8gを純水199.2gに完全に溶解させて銅濃度約800ppmの淡青色の正電荷金属溶液200gを調製した。
撥水剤(ドライシールS:東レ・ダウコーニング(株)製)と純水とを20:80の重量比で混合して撥水性分散液100gを調製した。
撥水剤(ドライシールS:東レ・ダウコーニング(株)製)と純水とを40:60の重量比で混合して撥水性分散液100gを調製した。
製造例2で調製した溶液と製造例3で調製した分散液とを1:1の重量比で混合して正電荷金属含有撥水性分散液100gを調製した。
製造例2で調製した溶液と製造例4で準備した分散液とを1:1の重量比で混合して正電荷金属含有撥水性分散液100gを調製した。
製造例5で調製した正電荷金属含有撥水性分散液90gに白色顔料(ポルックスホワイトPC−CRH(住化カラー(株)製))10gを混合し、更に、バインダーとしてポリゾールAP−609L(昭和高分子(株)製)5gを混合して、正電荷含有撥水性白色分散液105gを調製した。
陶器質タイル(97mm×97mm)の表面に製造例5で調製した正電荷金属含有撥水性分散液を2.0g/100cm2の塗布量でスプレー塗布し、70℃で1時間加熱して評価用基板を得た。
陶器質タイル(97mm×97mm)の裏面に製造例7で調製した正電荷含有撥水性白色分散液を2.0g/100cm2の塗布量でスプレー塗布し、70℃で1時間加熱して評価用基板を得た。
陶器質タイル(97mm×97mm)の裏面に光触媒液(B56:サスティナブル・テクノロジー(株)製)を2.0g/100cm2の塗布量でスプレー塗布し、70℃で1時間加熱して評価用基板を得た。
陶器質タイル(97mm×97mm)の表面に撥水剤(ドライシールS:東レ・ダウコーニング(株)製)の純水10倍希釈液を2.0g/100cm2の塗布量でスプレー塗布し、70℃で1時間加熱して評価用基板を得た。
負電荷を有する染料であるインジコ染料を含む赤インク(パイロット(株)製)をエタノールで希釈して10倍希釈液とし、0.007g/100cm2の塗布量で、実施例1及び2並びに比較例1及び2の各評価用基板表面にスポット塗布した。各基板1〜4を直線上に並べ、20Wのブラックライト(東芝ライテック(株)製)を各基板上に配置し各基板表面に1100μW/cm2の割合で紫外線を照射した。色差計(ミノルタ(株)製、CR−200)を使用して、各評価基板表面上の赤インクの褪色率を経時的に測定した。
消色率=100−
√((L2−L0)2+(a2−a0)2+(b2−b0)2))/√((L1−L0)2+(a1−a0)2+(b1−b0)2))×100
L0、a0、b0:赤インク塗布前の基板表面の色データ
L1、a1、b1:赤インク塗布直後の基板表面の色データ
L2、a2、b2:紫外線照射後の基板表面の色データ
製造例3で調製した撥水性分散液90gに白色顔料(ポルックスホワイトPC−CRH(住化カラー(株)製))10gを混合し、更に、バインダーとしてポリゾールAP−609L(昭和高分子(株)製)5gを混合して、撥水性白色分散液105gを調製した。この撥水性白色分散液50gと、製造例1の正電荷金属溶液50gを1:1の重量比で混合して正電荷金属含有撥水性白色分散液100gを調製した。
製造例3で調製した撥水性分散液90gに白色顔料(ポルックスホワイトPC−CRH(住化カラー(株)製))10gを混合し、更に、バインダーとしてポリゾールAP−609L(昭和高分子(株)製)5gを混合して、撥水性白色分散液105gを調製した。この撥水性白色分散液50gと、製造例2の正電荷金属溶液50gを1:1の重量比で混合して正電荷金属含有撥水性白色分散液100gを調製した。
製造例3で調製した撥水性分散液90gに白色顔料(ポルックスホワイトPC−CRH(住化カラー(株)製))10gを混合し、更に、バインダーとしてポリゾールAP−609L(昭和高分子(株)製)5gを混合して、撥水性白色分散液105gを調製した。
舗石コンクリートブロック(300mm×300mm×30mm)の裏面に製造例8で準備した正電荷撥水性白色分散液を20g/100cm2の塗布量でスプレー塗布し、常温で乾燥させて、評価用基板を得た。
舗石コンクリートブロック(300mm×300mm×30mm)の裏面に製造例9で準備した正電荷撥水性白色分散液を20g/100cm2の塗布量でスプレー塗布し、常温で乾燥させて、評価用基板を得た。
舗石コンクリートブロック(300mm×300mm×30mm)の裏面に製造例10の撥水性白色分散液を20g/100cm2の塗布量でスプレー塗布し、常温で乾燥させて、評価用基板を得た。
実施例3及び4並びに比較例3の各評価用基板について佐賀県において5ヶ月間の曝露試験を行い、各基板の表面の汚染状態を目視観察した。結果を表2に示す。なお、表2中の「撥水性」とは水との接触角が95°であることを示す。
陶器質タイル(97mm×97mm)の表面に、フッ素系撥水剤(GM−105:ダイキン工業(株)製)と製造例2の正電荷金属溶液を1:1の重量比で混合して得られた混合液を5g/100cm2の塗布量で刷毛塗りし、130℃で30分加熱して、評価用基板を得た。
陶器質タイル(97mm×97mm)の裏面にフッ素系撥水剤(GM−105:ダイキン工業(株)製)を5g/100cm2の塗布量で刷毛塗りし、130℃で30分加熱して、評価用基板を得た。
実施例3及び比較例4の各評価用基板について佐賀県において曝露試験を行い、各基板の表面の汚染状態を目視観察した。具体的には、各評価用基板を18日間屋外にて太陽光に曝露し、その後、暗所内で2日間放置した。結果を表3に示す。なお、表3中の「強撥水性」とは水との接触角が100°以下であることを示し、「撥水性」とは水との接触角が95°前後であることを示し、「親水性」とは水との接触角が20°以下であることを示す。なお、接触角は手動角度計にて目視計測した。
Claims (12)
- 基体表面又は基体表面層中に
撥水剤又は吸水防止剤、並びに、
(1)陽イオン
(2)正電荷を有する導電体又は誘電体
(3)導電体、及び、誘電体又は半導体の複合体
からなる群から選択される1種又は2種以上の正電荷物質を配置することを特徴とする、基体表面における正電荷発生方法。 - 基体表面又は基体表面層中に
撥水剤又は吸水防止剤、並びに、
(1)陽イオン
(2)正電荷を有する導電体又は誘電体
(3)導電体、及び、誘電体又は半導体の複合体
からなる群から選択される1種又は2種以上の正電荷物質を配置することを特徴とする、基体表面の汚染防止乃至低減方法。 - 基体表面又は基体表面層中に
撥水剤又は吸水防止剤、並びに、
(1)陽イオン
(2)正電荷を有する導電体又は誘電体
(3)導電体、及び、誘電体又は半導体の複合体
からなる群から選択される1種又は2種以上の正電荷物質を、配置することを特徴とする、基体表面の保護方法。 - 前記撥水剤又は吸水防止剤が、シラン系、シリコネート系、シリコーン系、シリコーン及びシラン複合系、フッ素系の撥水剤又は吸水防止剤、或いは、これらの少なくとも2種の混合物である、請求項1乃至3のいずれかに記載の方法。
- 前記撥水剤又は吸水防止剤、及び、前記正電荷物質の混合物が基体表面又は基体表面層中に配置される、請求項1乃至4のいずれかに記載の方法。
- 前記混合物が、更に、
ノニオン性分散剤、アニオン性分散剤、両性分散剤、酸価が50〜250の水溶性樹脂性分散剤、及び、酸価が50〜250のエマルジョン樹脂性分散剤からなる群から選択される1種以上の分散剤;顔料;並びに液体からなる顔料分散体を含有することを特徴とする、請求項5記載の方法。 - 前記混合物が層を形成することを特徴とする、請求項5又は6記載の方法。
- 前記基体表面と前記混合物層との間に中間層を形成することを特徴とする、請求項7記載の方法。
- 前記混合物層上に更に被覆層を形成することを特徴とする、請求項7又は8記載の方法。
- 請求項1乃至9のいずれかに記載の方法により、空気中又は水中における表面の汚染が防止乃至低減され、又は、表面が保護された前記基体を備えた物品。
- 撥水剤又は吸水防止剤、及び、正電荷物質を含む基体表面用汚染防止乃至低減剤。
- 撥水剤又は吸水防止剤、及び、正電荷物質を含む基体表面用保護剤。
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