JPWO2007066511A1 - 成膜装置及び成膜方法 - Google Patents
成膜装置及び成膜方法 Download PDFInfo
- Publication number
- JPWO2007066511A1 JPWO2007066511A1 JP2007549063A JP2007549063A JPWO2007066511A1 JP WO2007066511 A1 JPWO2007066511 A1 JP WO2007066511A1 JP 2007549063 A JP2007549063 A JP 2007549063A JP 2007549063 A JP2007549063 A JP 2007549063A JP WO2007066511 A1 JPWO2007066511 A1 JP WO2007066511A1
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- JP
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- Prior art keywords
- substrate
- film forming
- film
- forming apparatus
- substrate support
- Prior art date
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-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physical Vapour Deposition (AREA)
- Hall/Mr Elements (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
2 真空チャンバ
3 基板支持台
4 回転軸
5A〜5C スパッタカソード
6 処理室
7 台座
9 駆動源
10 加熱源(基板温度調整手段)
11 静電チャック用電極
14 シャッタ機構
20 真空処理装置
W 基板
Claims (10)
- 真空チャンバと、
前記真空チャンバの内部に配置された基板支持台と、
前記基板支持台を自転させる基板回転機構と、
スパッタターゲットが装着され前記基板支持台上の基板に対してスパッタ粒子を斜め方向から入射させるスパッタカソードと、
基板温度を調整する基板温度調整手段とを備えたことを特徴とする成膜装置。 - 前記基板温度調整手段は、前記基板支持台に内蔵された加熱源又は冷却源であることを特徴とする請求の範囲第1項に記載の成膜装置。
- 前記基板支持台には、静電チャック機構が設けられていることを特徴とする請求の範囲第1項に記載の成膜装置。
- 前記スパッタカソードは複数配置されており、その各々に対して独立したプラズマ発生源が設けられていることを特徴とする請求の範囲第1項に記載の成膜装置。
- 前記スパッタカソードと基板支持台との間には、任意の1つ又は複数のスパッタカソードを遮蔽するシャッタ機構が設けられていることを特徴とする請求の範囲第4項に記載の成膜装置。
- 前記スパッタターゲットは、抵抗変化素子の少なくとも一機能層を形成する磁性材料からなることを特徴とする請求の範囲第1項に記載の成膜装置。
- 自転する基板支持台上の基板に対して斜め方向からスパッタ粒子を入射させて成膜する成膜方法において、
前記基板支持台上で基板温度を一定に保持して成膜を行うことを特徴とする成膜方法。 - 前記基板温度を成膜材料の結晶化温度とすることを特徴とする請求の範囲第7項に記載の成膜方法。
- 前記基板への成膜が、複数のスパッタカソードに同時に高周波電源を印加して行われることを特徴とする請求の範囲第7項に記載の成膜方法。
- 前記複数のスパッタカソードへ印加する高周波電源の電源周波数を互いに異ならせることを特徴とする請求の範囲第9項に記載の成膜方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005352894 | 2005-12-07 | ||
JP2005352894 | 2005-12-07 | ||
PCT/JP2006/323281 WO2007066511A1 (ja) | 2005-12-07 | 2006-11-22 | 成膜装置及び成膜方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2007066511A1 true JPWO2007066511A1 (ja) | 2009-05-14 |
Family
ID=38122660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007549063A Pending JPWO2007066511A1 (ja) | 2005-12-07 | 2006-11-22 | 成膜装置及び成膜方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100000855A1 (ja) |
JP (1) | JPWO2007066511A1 (ja) |
KR (1) | KR20080059304A (ja) |
DE (1) | DE112006003218T5 (ja) |
TW (1) | TW200724705A (ja) |
WO (1) | WO2007066511A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5584409B2 (ja) * | 2008-02-21 | 2014-09-03 | キヤノンアネルバ株式会社 | スパッタリング装置およびその制御方法 |
JP5310283B2 (ja) * | 2008-06-27 | 2013-10-09 | 東京エレクトロン株式会社 | 成膜方法、成膜装置、基板処理装置及び記憶媒体 |
JP2010126789A (ja) * | 2008-11-28 | 2010-06-10 | Shibaura Mechatronics Corp | スパッタ成膜装置 |
JP4537479B2 (ja) * | 2008-11-28 | 2010-09-01 | キヤノンアネルバ株式会社 | スパッタリング装置 |
JP5503905B2 (ja) * | 2009-06-18 | 2014-05-28 | 株式会社アルバック | スパッタ装置及びスパッタ方法 |
JP5480290B2 (ja) * | 2009-12-04 | 2014-04-23 | キヤノンアネルバ株式会社 | スパッタリング装置、及び電子デバイスの製造方法 |
WO2011117916A1 (ja) * | 2010-03-24 | 2011-09-29 | キヤノンアネルバ株式会社 | 電子デバイスの製造方法およびスパッタリング方法 |
JPWO2012033198A1 (ja) * | 2010-09-10 | 2014-01-20 | 株式会社アルバック | スパッタ装置 |
JP2012219330A (ja) * | 2011-04-08 | 2012-11-12 | Ulvac Japan Ltd | 相変化メモリの形成装置、及び相変化メモリの形成方法 |
JP5640894B2 (ja) * | 2011-05-26 | 2014-12-17 | 東京エレクトロン株式会社 | 温度測定装置、温度測定方法、記憶媒体及び熱処理装置 |
JP2013057108A (ja) * | 2011-09-09 | 2013-03-28 | Ulvac Japan Ltd | 多元スパッタリング装置 |
US8920888B2 (en) | 2012-04-04 | 2014-12-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Plasma process, film deposition method and system using rotary chuck |
EP2664690B1 (en) * | 2012-05-15 | 2015-09-16 | ZhongAo HuiCheng Technology Co. Ltd. | A magnetron sputtering coating device and the preparation method of a nano-multilayer film |
JP5953994B2 (ja) * | 2012-07-06 | 2016-07-20 | 東京エレクトロン株式会社 | 成膜装置及び成膜方法 |
US9963777B2 (en) | 2012-10-08 | 2018-05-08 | Analog Devices, Inc. | Methods of forming a thin film resistor |
JP6196078B2 (ja) * | 2012-10-18 | 2017-09-13 | 株式会社アルバック | 成膜装置 |
FR3027453B1 (fr) * | 2014-10-20 | 2017-11-24 | Commissariat Energie Atomique | Dispositif resistif pour circuit memoire ou logique et procede de fabrication d'un tel dispositif |
JP6591568B2 (ja) * | 2016-02-01 | 2019-10-16 | キヤノンアネルバ株式会社 | 磁気抵抗効果素子の製造方法 |
WO2018216226A1 (ja) * | 2017-05-26 | 2018-11-29 | アドバンストマテリアルテクノロジーズ株式会社 | 成膜装置及び成膜方法 |
JP6928331B2 (ja) * | 2017-11-06 | 2021-09-01 | 株式会社アルバック | スパッタリング装置及びスパッタリング方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04107257A (ja) * | 1990-08-29 | 1992-04-08 | Japan Steel Works Ltd:The | 多元系複合化合物膜の形成方法及び装置 |
JPH0794412A (ja) * | 1993-09-20 | 1995-04-07 | Mitsubishi Electric Corp | 薄膜形成装置 |
JP2002506490A (ja) * | 1998-04-27 | 2002-02-26 | シーブイシー プロダクツ インコーポレイテッド | 複数ターゲットの物理蒸着装置及び方法 |
JP2002167661A (ja) * | 2000-11-30 | 2002-06-11 | Anelva Corp | 磁性多層膜作製装置 |
JP2002270682A (ja) * | 2001-03-13 | 2002-09-20 | Toshiba Corp | 静電チャック装置および半導体処理装置ならびに半導体製造装置および半導体処理方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6287435B1 (en) * | 1998-05-06 | 2001-09-11 | Tokyo Electron Limited | Method and apparatus for ionized physical vapor deposition |
JP2003253439A (ja) | 2002-03-01 | 2003-09-10 | Ulvac Japan Ltd | スパッタ装置 |
-
2006
- 2006-11-22 JP JP2007549063A patent/JPWO2007066511A1/ja active Pending
- 2006-11-22 DE DE112006003218T patent/DE112006003218T5/de not_active Withdrawn
- 2006-11-22 US US12/084,842 patent/US20100000855A1/en not_active Abandoned
- 2006-11-22 WO PCT/JP2006/323281 patent/WO2007066511A1/ja active Application Filing
- 2006-11-22 KR KR1020087011465A patent/KR20080059304A/ko active Search and Examination
- 2006-12-06 TW TW095145302A patent/TW200724705A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04107257A (ja) * | 1990-08-29 | 1992-04-08 | Japan Steel Works Ltd:The | 多元系複合化合物膜の形成方法及び装置 |
JPH0794412A (ja) * | 1993-09-20 | 1995-04-07 | Mitsubishi Electric Corp | 薄膜形成装置 |
JP2002506490A (ja) * | 1998-04-27 | 2002-02-26 | シーブイシー プロダクツ インコーポレイテッド | 複数ターゲットの物理蒸着装置及び方法 |
JP2002167661A (ja) * | 2000-11-30 | 2002-06-11 | Anelva Corp | 磁性多層膜作製装置 |
JP2002270682A (ja) * | 2001-03-13 | 2002-09-20 | Toshiba Corp | 静電チャック装置および半導体処理装置ならびに半導体製造装置および半導体処理方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20080059304A (ko) | 2008-06-26 |
DE112006003218T5 (de) | 2008-10-23 |
WO2007066511A1 (ja) | 2007-06-14 |
US20100000855A1 (en) | 2010-01-07 |
TW200724705A (en) | 2007-07-01 |
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