JPWO2005097938A1 - 蛍光体及び発光ダイオード - Google Patents
蛍光体及び発光ダイオード Download PDFInfo
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- JPWO2005097938A1 JPWO2005097938A1 JP2006512012A JP2006512012A JPWO2005097938A1 JP WO2005097938 A1 JPWO2005097938 A1 JP WO2005097938A1 JP 2006512012 A JP2006512012 A JP 2006512012A JP 2006512012 A JP2006512012 A JP 2006512012A JP WO2005097938 A1 JPWO2005097938 A1 JP WO2005097938A1
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 230000005284 excitation Effects 0.000 claims abstract description 49
- 239000013078 crystal Substances 0.000 claims description 60
- 239000011521 glass Substances 0.000 claims description 55
- 239000002223 garnet Substances 0.000 claims description 26
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 14
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 14
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 12
- 229910005793 GeO 2 Inorganic materials 0.000 claims description 12
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 10
- 239000006104 solid solution Substances 0.000 claims description 9
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 7
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 5
- 229910010272 inorganic material Inorganic materials 0.000 claims description 4
- 239000011147 inorganic material Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- 230000000295 complement effect Effects 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000011347 resin Substances 0.000 description 24
- 229920005989 resin Polymers 0.000 description 24
- 238000000465 moulding Methods 0.000 description 12
- 238000002189 fluorescence spectrum Methods 0.000 description 11
- 230000006866 deterioration Effects 0.000 description 10
- 238000004031 devitrification Methods 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000002131 composite material Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 5
- 238000004017 vitrification Methods 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 229910052706 scandium Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000000634 powder X-ray diffraction Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0018—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and monovalent metal oxide as main constituents
- C03C10/0027—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and monovalent metal oxide as main constituents containing SiO2, Al2O3, Li2O as main constituents
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
- C03C10/0045—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents containing SiO2, Al2O3 and MgO as main constituents
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/12—Compositions for glass with special properties for luminescent glass; for fluorescent glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
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- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Ceramic Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Led Device Packages (AREA)
- Glass Compositions (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
これを解決するために、青色LEDチップと、青色LEDチップから発せられた青色光線によって黄色発光するYAG蛍光体を組合わせたLEDが開発された(例えば、特許文献1:特開2000−208815号公報参照。)。これは、1種類のLEDで白色光が得られるため、低コストで、白色光の長期安定性にも優れる。また、この白色LEDは、従来の照明装置等の光源に比べ、長寿命、高効率、高安定性、低消費電力、高応答速度、環境負荷物質を含まない等の利点を有しているため、現在、ほとんどの携帯電話の液晶バックライトにはこの形態の白色LEDが使用されている。今後はこの白色LEDは、白熱電球や蛍光灯に替わる次世代の光源として照明用途への応用が期待されている。
Claims (18)
- 単一の無機材料からなり、可視光線からなる励起光を入射すると、該励起光の色相に対して補色の蛍光を発し、かつ該励起光を一部透過することを特徴とする蛍光体。
- 板形状を有することを特徴とする請求の範囲1に記載の蛍光体。
- 肉厚が0.1mm〜2mmであることを特徴とする請求の範囲1又は2に記載の蛍光体。
- 前記可視光線からなる励起光は、中心波長が430〜490nmの光線であり、前記蛍光は、中心波長が530〜590nmの光線であることを特徴とする請求の範囲1〜3のいずれかに記載の蛍光体。
- Ce3+を含有し、ガーネット結晶を析出してなる結晶化ガラスからなることを特徴とする請求の範囲1〜4のいずれかに記載の蛍光体。
- 前記ガーネット結晶がYAG結晶又はYAG結晶固溶体であることを特徴とする請求の範囲5に記載の蛍光体。
- Ce2O3を0.01〜5モル%含有することを特徴とする請求の範囲5又は6に記載の蛍光体。
- モル%で、SiO2+B2O3 10〜60%、Al2O3+GeO2+Ga2O3 15〜50%、Y2O3+Gd2O3 5〜30%、Li2O 0〜25%、TiO2+ZrO2 0〜15%、Ce2O3 0.01〜5%含有する結晶化ガラスからなることを特徴とする請求の範囲1〜7のいずれかに記載の蛍光体。
- TiO2及びZrO2を本質的に含有しないことを特徴とする請求の範囲8に記載の蛍光体。
- モル%でSiO2 10〜50%、Al2O3 15〜45%、Y2O3 5〜30%、GeO2 0〜15%、Gd2O3 0〜20%、Li2O 0〜15%、CaO+MgO+Sc2O3 0〜30%、Ce2O3 0.01〜5%含有する結晶化ガラスからなることを特徴とする請求の範囲1〜9のいずれかに記載の蛍光体。
- 請求の範囲1〜10のいずれかに記載の蛍光体を用いてなることを特徴とする発光ダイオード。
- カソードリード端子とアノードリード端子とを備えたステムと、アノードリード端子に接続された発光ダイオードチップと、発光ダイオードチップとカソードリード端子を接続する金属線と、ステムとともに発光ダイオードチップを気密封止するように固定され、発光ダイオードチップの上方に窓部が形成された収納容器と、収納容器の窓部に取り付けられた請求の範囲1〜10のいずれかに記載の蛍光体とを具備してなることを特徴とする発光ダイオード。
- Ce3+を含有し、ガーネット結晶を析出してなることを特徴とする結晶化ガラス。
- 前記ガーネット結晶がYAG結晶又はYAG結晶固溶体であることを特徴とする請求の範囲13に記載の結晶化ガラス。
- Ce2O3を0.01〜5モル%含有することを特徴とする請求の範囲13又は14に記載の結晶化ガラス。
- モル%で、SiO2+B2O3 10〜60%、Al2O3+GeO2+Ga2O3 15〜50%、Y2O3+Gd2O3 5〜30%、Li2O 0〜25%、TiO2+ZrO2 0〜15%、Ce2O3 0.01〜5%含有してなることを特徴とする請求の範囲13〜15のいずれかに記載の結晶化ガラス。
- TiO2及びZrO2を本質的に含有しないことを特徴とする請求の範囲16に記載の結晶化ガラス。
- モル%でSiO2 10〜50%、Al2O3 15〜45%、Y2O3 5〜30%、GeO2 0〜15%、Gd2O3 0〜20%、Li2O 0〜15%、CaO+MgO+Sc2O3 0〜30%、Ce2O3 0.01〜5%含有する結晶化ガラスからなることを特徴とする請求の範囲13〜17のいずれかに記載の結晶化ガラス。
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JP2006512012A JP5013405B2 (ja) | 2004-03-31 | 2005-03-24 | 蛍光体及び発光ダイオード |
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JP2004103425 | 2004-03-31 | ||
JP2004103425 | 2004-03-31 | ||
JP2004250079 | 2004-08-30 | ||
JP2004250079 | 2004-08-30 | ||
JP2006512012A JP5013405B2 (ja) | 2004-03-31 | 2005-03-24 | 蛍光体及び発光ダイオード |
PCT/JP2005/005412 WO2005097938A1 (ja) | 2004-03-31 | 2005-03-24 | 蛍光体及び発光ダイオード |
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JPWO2005097938A1 true JPWO2005097938A1 (ja) | 2008-02-28 |
JP5013405B2 JP5013405B2 (ja) | 2012-08-29 |
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JP (1) | JP5013405B2 (ja) |
WO (1) | WO2005097938A1 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007112951A (ja) * | 2005-10-24 | 2007-05-10 | Fujifilm Corp | 無機化合物及びこれを含む組成物と成形体、発光装置、固体レーザ装置 |
JP2007161944A (ja) * | 2005-12-16 | 2007-06-28 | Nippon Electric Glass Co Ltd | 蛍光体 |
EP1995834B1 (en) | 2006-03-10 | 2017-08-30 | Nichia Corporation | Light emitting device |
JP5483795B2 (ja) * | 2006-04-11 | 2014-05-07 | 日本電気硝子株式会社 | 発光色変換材料及び発光色変換部材 |
DE102006027307B4 (de) | 2006-06-06 | 2014-08-07 | Schott Ag | Verfahren zur Herstellung einer Sinterglaskeramik und deren Verwendung |
KR101421412B1 (ko) * | 2006-06-21 | 2014-07-22 | 코닌클리케 필립스 엔.브이. | 적어도 하나의 세라믹 구체 색변환 재료를 포함하는 발광 장치 |
JP4860368B2 (ja) * | 2006-06-27 | 2012-01-25 | 富士フイルム株式会社 | ガーネット型化合物とその製造方法 |
JP2008231218A (ja) * | 2007-03-20 | 2008-10-02 | Nippon Electric Glass Co Ltd | 蛍光体材料及び白色led |
US7700967B2 (en) * | 2007-05-25 | 2010-04-20 | Philips Lumileds Lighting Company Llc | Illumination device with a wavelength converting element held by a support structure having an aperture |
WO2009107535A1 (ja) | 2008-02-25 | 2009-09-03 | 株式会社東芝 | 白色ledランプ、バックライト、発光装置、表示装置および照明装置 |
US9241879B2 (en) | 2008-04-11 | 2016-01-26 | James R. Glidewell Dental Ceramics, Inc. | Lithium silicate glass ceramic for fabrication of dental appliances |
US7892995B2 (en) * | 2008-04-11 | 2011-02-22 | James R. Glidewell Dental Ceramics, Inc. | Lithium silicate glass ceramic and method for fabrication of dental appliances |
JP2010024278A (ja) * | 2008-07-16 | 2010-02-04 | Stanley Electric Co Ltd | 蛍光体セラミック板およびそれを用いた発光素子 |
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JP5013405B2 (ja) | 2012-08-29 |
US20070262702A1 (en) | 2007-11-15 |
WO2005097938A1 (ja) | 2005-10-20 |
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