JPS6487305A - Method for dicing semiconductor wafer - Google Patents
Method for dicing semiconductor waferInfo
- Publication number
- JPS6487305A JPS6487305A JP24833087A JP24833087A JPS6487305A JP S6487305 A JPS6487305 A JP S6487305A JP 24833087 A JP24833087 A JP 24833087A JP 24833087 A JP24833087 A JP 24833087A JP S6487305 A JPS6487305 A JP S6487305A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- dicing
- reverse side
- dicing saw
- breaking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
PURPOSE:To make the amount left uncut smaller even when the thickness of a wafer is thicker than ever and consequently reduce the frequency of occurrence of pellet cracking at breaking by a method wherein the breaking is done after dicing grooves are made on both the obverse side and reverse side of the wafer. CONSTITUTION:The scribing lines of a wafer 13, on which semiconductor elements are made, are aligned so as to be parallel or perpendicular to shifting directions of an obverse side dicing saw 11A and of a reverse side dicing saw 11B. Under the condition as described above, the wafer 13 is placed on four stages 14A-14D and sucked to the stages so as to simultaneously make dicing grooves 18A and 18B at the scribing lines on the obverse side and reverse side of the wafer 13 by moving the obverse side dicing saw 11A and the reverse side dicing saw 11B along dividing parts. After the dicing grooves are formed on all the scribing lines to dice, the wafer is transferred to an electron seat so as to carry out a breaking process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24833087A JPS6487305A (en) | 1987-09-30 | 1987-09-30 | Method for dicing semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24833087A JPS6487305A (en) | 1987-09-30 | 1987-09-30 | Method for dicing semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6487305A true JPS6487305A (en) | 1989-03-31 |
Family
ID=17176478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24833087A Pending JPS6487305A (en) | 1987-09-30 | 1987-09-30 | Method for dicing semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6487305A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6583032B1 (en) * | 1999-11-05 | 2003-06-24 | Tokyo Seimitsu Co., Ltd. | Method for manufacturing semiconductor chips |
| JP2008187148A (en) * | 2007-01-31 | 2008-08-14 | Fuji Electric Device Technology Co Ltd | Manufacturing method of semiconductor device and marking device |
| JP2012227371A (en) * | 2011-04-20 | 2012-11-15 | Disco Abrasive Syst Ltd | Processing method of package substrate |
-
1987
- 1987-09-30 JP JP24833087A patent/JPS6487305A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6583032B1 (en) * | 1999-11-05 | 2003-06-24 | Tokyo Seimitsu Co., Ltd. | Method for manufacturing semiconductor chips |
| JP2008187148A (en) * | 2007-01-31 | 2008-08-14 | Fuji Electric Device Technology Co Ltd | Manufacturing method of semiconductor device and marking device |
| JP2012227371A (en) * | 2011-04-20 | 2012-11-15 | Disco Abrasive Syst Ltd | Processing method of package substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR960005047B1 (en) | Method for dicing compound semiconductor wafer | |
| CA2113019A1 (en) | Integrated partial sawing process | |
| JPS6487305A (en) | Method for dicing semiconductor wafer | |
| JPS5740940A (en) | Semiconductor device | |
| JPS53126866A (en) | Production of semiconductor wafers | |
| JPS6485712A (en) | Dicing method of semiconductor | |
| JPS57143844A (en) | Chip composition of wafer | |
| JPS5527623A (en) | Semiconductor wafer dividing method | |
| JPS5472587A (en) | Method of producing tool made of tool steel coatd with hard material | |
| JPS5721826A (en) | Manufacture of semiconductor single crystal wafer | |
| SU1023452A1 (en) | Silicon article oriented machining method | |
| JPS5245879A (en) | Method of dividing semiconductor element | |
| JPS57133647A (en) | Method for separating chip from semiconductor wafer | |
| JPS53111277A (en) | Semiconductor wafer and its fabricating method | |
| JPS5593234A (en) | Splitting method of semiconductor plate | |
| JPS5667933A (en) | Scribe method of semiconductor wafer | |
| JPS5329086A (en) | Production of semiconductor device | |
| JPS5984546A (en) | Breaker for wafer | |
| SU545020A2 (en) | Method of dividing a semiconductor wafer into crystals | |
| JPS54149575A (en) | Method and device for wafer division | |
| JPS6430285A (en) | Manufacture of semiconductor laser | |
| JPS5325350A (en) | Dicing method of semiconductor substrates | |
| JPS6457617A (en) | Boat for diffusion | |
| JPS5211761A (en) | Method of cutting semiconductor wafers | |
| JPS55145344A (en) | Mthod for surface profile processing of 3-5 group compound semiconductor |