JPS64817B2 - - Google Patents

Info

Publication number
JPS64817B2
JPS64817B2 JP58072657A JP7265783A JPS64817B2 JP S64817 B2 JPS64817 B2 JP S64817B2 JP 58072657 A JP58072657 A JP 58072657A JP 7265783 A JP7265783 A JP 7265783A JP S64817 B2 JPS64817 B2 JP S64817B2
Authority
JP
Japan
Prior art keywords
thermal expansion
coefficient
lead frame
silicon chip
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58072657A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59198741A (ja
Inventor
Yoshio Shinoda
Tsuyuki Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Priority to JP58072657A priority Critical patent/JPS59198741A/ja
Publication of JPS59198741A publication Critical patent/JPS59198741A/ja
Publication of JPS64817B2 publication Critical patent/JPS64817B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/40—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP58072657A 1983-04-25 1983-04-25 半導体集積回路用リ−ドフレ−ム材 Granted JPS59198741A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58072657A JPS59198741A (ja) 1983-04-25 1983-04-25 半導体集積回路用リ−ドフレ−ム材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58072657A JPS59198741A (ja) 1983-04-25 1983-04-25 半導体集積回路用リ−ドフレ−ム材

Publications (2)

Publication Number Publication Date
JPS59198741A JPS59198741A (ja) 1984-11-10
JPS64817B2 true JPS64817B2 (enExample) 1989-01-09

Family

ID=13495662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58072657A Granted JPS59198741A (ja) 1983-04-25 1983-04-25 半導体集積回路用リ−ドフレ−ム材

Country Status (1)

Country Link
JP (1) JPS59198741A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022208645A1 (de) 2021-08-23 2023-02-23 Okuma Corporation Kalibrierungsverfahren und Kalibrierungsprogramm für einen Kontaktwerkzeugsensor in einer Werkzeugmaschine, und eine Werkzeugmaschine
KR20240069003A (ko) * 2022-11-11 2024-05-20 에스케이 주식회사 Nf3 가스 생산 설비 내 이물질 제거 시스템 및 방법

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61235535A (ja) * 1985-04-10 1986-10-20 Hitachi Metals Ltd リ−ドフレ−ム用合金
JPS6227518A (ja) * 1985-07-26 1987-02-05 Nippon Gakki Seizo Kk 低膨張合金材の製法
JPS6232631A (ja) * 1985-08-05 1987-02-12 Hitachi Ltd 集積回路パッケージ用リード片の製法
EP0299605B1 (en) * 1987-05-26 1995-11-15 Nippon Steel Corporation Iron-copper-chromium alloy for high-strength lead frame or pin grid array and process for preparation thereof
JPH0625395B2 (ja) * 1989-06-26 1994-04-06 日立金属株式会社 高強度リードフレーム材料およびその製造方法
US5147470A (en) * 1990-12-25 1992-09-15 Hitachi Metals, Ltd. High strength lead frame material and method of producing the same
JP2909856B2 (ja) * 1991-11-14 1999-06-23 日本特殊陶業株式会社 セラミックス基板と金属の接合体
JPH09172108A (ja) * 1996-12-24 1997-06-30 Toshiba Corp 窒化アルミニウム回路基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022208645A1 (de) 2021-08-23 2023-02-23 Okuma Corporation Kalibrierungsverfahren und Kalibrierungsprogramm für einen Kontaktwerkzeugsensor in einer Werkzeugmaschine, und eine Werkzeugmaschine
KR20240069003A (ko) * 2022-11-11 2024-05-20 에스케이 주식회사 Nf3 가스 생산 설비 내 이물질 제거 시스템 및 방법

Also Published As

Publication number Publication date
JPS59198741A (ja) 1984-11-10

Similar Documents

Publication Publication Date Title
JPS64817B2 (enExample)
US5315152A (en) Lead frame with improved adhesiveness property against plastic and plastic sealing type semiconductor packaging using said lead frame
US4726859A (en) Wire for bonding a semiconductor device
EP0158509A2 (en) Lead materials for semiconductor devices
JPS61279628A (ja) 繰り返し曲げ性に優れたＦｅ−Ｎｉ系合金板又はＦｅ−Ｎｉ−Ｃｏ系合金板の製造方法
JPH0331449A (ja) リードフレーム用Ｆｅ―Ｎｉ合金
JPS6159760A (ja) 半導体装置の結線用Ａｌ合金極細線
JPH0331450A (ja) リードフレーム用Ｆｅ―Ｎｉ―Ｃｏ合金
JP2523677B2 (ja) 低熱膨張リ―ドフレ―ム材料
JPS60238446A (ja) 耐食性の優れたｉｃリ−ドフレ−ム用合金
JPS60238443A (ja) 耐食性の優れたｉｃリ−ドフレ−ム用合金
JPS5916352A (ja) 半導体装置
JP2533625B2 (ja) 多ピンＩＣパッケ−ジ用リ−ドフレ−ム用高強度低膨張Ｆｅ−Ｎｉ合金の製法
JPS60238450A (ja) 耐食性の優れたｉｃリ−ドフレ−ム用合金
JP2825814B2 (ja) 耐応力腐食割れ性の優れたｉｃリードフレーム用合金
JPH1017959A (ja) 複合材及びその製造方法
JPS6050866B2 (ja) 軟質ガラス封着用合金
JPS60238445A (ja) 耐食性の優れたｉｃリ−ドフレ−ム用合金
JPS60251251A (ja) 耐食性の優れたｉｃリ−ドフレ−ム用合金
JPH04221039A (ja) リードフレーム用合金材及びその製造方法
JPH0243345A (ja) 半導体装置用リードフレーム材
JPH01268845A (ja) リードフレーム材
JPS60238444A (ja) 耐食性の優れたｉｃリ−ドフレ−ム用合金
JPH04160112A (ja) リードフレーム材の製造方法
JP3169675B2 (ja) リードフレーム用Ｆｅ−Ｎｉ合金及び製造方法