JPS59198741A - 半導体集積回路用リ−ドフレ−ム材 - Google Patents

半導体集積回路用リ−ドフレ−ム材

Info

Publication number
JPS59198741A
JPS59198741A JP58072657A JP7265783A JPS59198741A JP S59198741 A JPS59198741 A JP S59198741A JP 58072657 A JP58072657 A JP 58072657A JP 7265783 A JP7265783 A JP 7265783A JP S59198741 A JPS59198741 A JP S59198741A
Authority
JP
Japan
Prior art keywords
lead frame
thermal expansion
chip
coefficient
break
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58072657A
Other languages
English (en)
Japanese (ja)
Other versions
JPS64817B2 (enExample
Inventor
Yoshio Shinoda
慎夫 篠田
Tsuyuki Watanabe
渡辺　津之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Gakki Co Ltd
Original Assignee
Nippon Gakki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Gakki Co Ltd filed Critical Nippon Gakki Co Ltd
Priority to JP58072657A priority Critical patent/JPS59198741A/ja
Publication of JPS59198741A publication Critical patent/JPS59198741A/ja
Publication of JPS64817B2 publication Critical patent/JPS64817B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/40—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP58072657A 1983-04-25 1983-04-25 半導体集積回路用リ−ドフレ−ム材 Granted JPS59198741A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58072657A JPS59198741A (ja) 1983-04-25 1983-04-25 半導体集積回路用リ−ドフレ−ム材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58072657A JPS59198741A (ja) 1983-04-25 1983-04-25 半導体集積回路用リ−ドフレ−ム材

Publications (2)

Publication Number Publication Date
JPS59198741A true JPS59198741A (ja) 1984-11-10
JPS64817B2 JPS64817B2 (enExample) 1989-01-09

Family

ID=13495662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58072657A Granted JPS59198741A (ja) 1983-04-25 1983-04-25 半導体集積回路用リ−ドフレ−ム材

Country Status (1)

Country Link
JP (1) JPS59198741A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61235535A (ja) * 1985-04-10 1986-10-20 Hitachi Metals Ltd リ−ドフレ−ム用合金
JPS6232631A (ja) * 1985-08-05 1987-02-12 Hitachi Ltd 集積回路パッケージ用リード片の製法
US4869758A (en) * 1987-05-26 1989-09-26 Nippon Steel Corporation Iron/copper/chromium alloy material for high-strength lead frame or pin grid array
US4936925A (en) * 1985-07-26 1990-06-26 Yamaha Corporation Method for producing alloy of low thermal expansion
US5026435A (en) * 1989-06-26 1991-06-25 Hitachi Metals, Ltd. High strength lead frame material and method of producing the same
US5147470A (en) * 1990-12-25 1992-09-15 Hitachi Metals, Ltd. High strength lead frame material and method of producing the same
JPH05139857A (ja) * 1991-11-14 1993-06-08 Ngk Spark Plug Co Ltd セラミツクス基板と金属の接合体
JPH09172108A (ja) * 1996-12-24 1997-06-30 Toshiba Corp 窒化アルミニウム回路基板

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7519966B2 (ja) 2021-08-23 2024-07-22 オークマ株式会社 工作機械における接触式工具センサの校正方法及び校正プログラム、工作機械
KR102762042B1 (ko) * 2022-11-11 2025-02-04 에스케이 주식회사 Nf3 가스 생산 설비 내 이물질 제거 시스템 및 방법

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ASTM STANDARD=1978 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61235535A (ja) * 1985-04-10 1986-10-20 Hitachi Metals Ltd リ−ドフレ−ム用合金
US4936925A (en) * 1985-07-26 1990-06-26 Yamaha Corporation Method for producing alloy of low thermal expansion
JPS6232631A (ja) * 1985-08-05 1987-02-12 Hitachi Ltd 集積回路パッケージ用リード片の製法
US4869758A (en) * 1987-05-26 1989-09-26 Nippon Steel Corporation Iron/copper/chromium alloy material for high-strength lead frame or pin grid array
US5026435A (en) * 1989-06-26 1991-06-25 Hitachi Metals, Ltd. High strength lead frame material and method of producing the same
US5147470A (en) * 1990-12-25 1992-09-15 Hitachi Metals, Ltd. High strength lead frame material and method of producing the same
JPH05139857A (ja) * 1991-11-14 1993-06-08 Ngk Spark Plug Co Ltd セラミツクス基板と金属の接合体
JPH09172108A (ja) * 1996-12-24 1997-06-30 Toshiba Corp 窒化アルミニウム回路基板

Also Published As

Publication number Publication date
JPS64817B2 (enExample) 1989-01-09

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