JPS648077B2 - - Google Patents
Info
- Publication number
- JPS648077B2 JPS648077B2 JP13447083A JP13447083A JPS648077B2 JP S648077 B2 JPS648077 B2 JP S648077B2 JP 13447083 A JP13447083 A JP 13447083A JP 13447083 A JP13447083 A JP 13447083A JP S648077 B2 JPS648077 B2 JP S648077B2
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- anode
- electroplating
- plating
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000009713 electroplating Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 description 17
- 239000000758 substrate Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000010802 sludge Substances 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13447083A JPS6026692A (ja) | 1983-07-25 | 1983-07-25 | 電気めつき方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13447083A JPS6026692A (ja) | 1983-07-25 | 1983-07-25 | 電気めつき方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6026692A JPS6026692A (ja) | 1985-02-09 |
| JPS648077B2 true JPS648077B2 (zh) | 1989-02-13 |
Family
ID=15129070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13447083A Granted JPS6026692A (ja) | 1983-07-25 | 1983-07-25 | 電気めつき方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6026692A (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9657406B2 (en) | 2011-06-30 | 2017-05-23 | C. Uyemura & Co., Ltd. | Surface treating apparatus and plating tank |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1213567B (it) * | 1986-12-19 | 1989-12-20 | Permelec Spa | Anodo permanente per procedimenti galvanici ad alta densita' di correnti |
| EP1961842A1 (en) * | 2007-02-22 | 2008-08-27 | Atotech Deutschland Gmbh | Device and method for the electrolytic plating of a metal |
-
1983
- 1983-07-25 JP JP13447083A patent/JPS6026692A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9657406B2 (en) | 2011-06-30 | 2017-05-23 | C. Uyemura & Co., Ltd. | Surface treating apparatus and plating tank |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6026692A (ja) | 1985-02-09 |
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